AU2001238149A1 - Method and apparatus for processing a microelectronic workpiece at an elevated temperature - Google Patents

Method and apparatus for processing a microelectronic workpiece at an elevated temperature

Info

Publication number
AU2001238149A1
AU2001238149A1 AU2001238149A AU3814901A AU2001238149A1 AU 2001238149 A1 AU2001238149 A1 AU 2001238149A1 AU 2001238149 A AU2001238149 A AU 2001238149A AU 3814901 A AU3814901 A AU 3814901A AU 2001238149 A1 AU2001238149 A1 AU 2001238149A1
Authority
AU
Australia
Prior art keywords
processing
elevated temperature
microelectronic workpiece
microelectronic
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001238149A
Inventor
Paul R. Mchugh
Robert A. Weaver
Gregory J. Wilson
Vladimir Zila
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/501,002 external-priority patent/US6471913B1/en
Priority claimed from US09/733,608 external-priority patent/US6780374B2/en
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of AU2001238149A1 publication Critical patent/AU2001238149A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
AU2001238149A 2000-02-09 2001-02-08 Method and apparatus for processing a microelectronic workpiece at an elevated temperature Abandoned AU2001238149A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/501,002 US6471913B1 (en) 2000-02-09 2000-02-09 Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature
US09501002 2000-02-09
US09/733,608 US6780374B2 (en) 2000-12-08 2000-12-08 Method and apparatus for processing a microelectronic workpiece at an elevated temperature
US09733608 2000-12-08
PCT/US2001/004444 WO2001059815A2 (en) 2000-02-09 2001-02-08 Method and apparatus for processing a microelectronic workpiece at an elevated temperature

Publications (1)

Publication Number Publication Date
AU2001238149A1 true AU2001238149A1 (en) 2001-08-20

Family

ID=27053689

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001238149A Abandoned AU2001238149A1 (en) 2000-02-09 2001-02-08 Method and apparatus for processing a microelectronic workpiece at an elevated temperature

Country Status (5)

Country Link
EP (1) EP1254477A2 (en)
JP (1) JP2003524299A (en)
AU (1) AU2001238149A1 (en)
TW (1) TW495885B (en)
WO (1) WO2001059815A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005014513B4 (en) * 2005-03-30 2011-05-12 Att Advanced Temperature Test Systems Gmbh Device and method for tempering a substrate, and method for producing the device
MD3512C2 (en) * 2005-10-28 2008-09-30 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Device for magnesium diboride obtaining
MD175Z (en) * 2008-02-25 2010-10-31 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Device for the obtaining of superconducting films
EP2301081A2 (en) * 2008-06-03 2011-03-30 Vserv Technologies Corp System for simultaneous tabbing and stringing of solar cells
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor
TW201426844A (en) * 2012-12-28 2014-07-01 Metal Ind Res & Dev Ct Manufacturing method of micro-channel structure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3719952A1 (en) * 1987-06-15 1988-12-29 Convac Gmbh DEVICE FOR TREATING WAFERS IN THE PRODUCTION OF SEMICONDUCTOR ELEMENTS
WO1991004213A1 (en) * 1989-09-12 1991-04-04 Rapro Technology, Inc. Automated wafer transport system
EP1120817B8 (en) * 1991-03-26 2007-10-10 Ngk Insulators, Ltd. Use of a corrosion-resistant member
US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
JP2953395B2 (en) * 1996-09-05 1999-09-27 日本電気株式会社 Sputtering equipment
US6072163A (en) * 1998-03-05 2000-06-06 Fsi International Inc. Combination bake/chill apparatus incorporating low thermal mass, thermally conductive bakeplate
JPH11354260A (en) * 1998-06-11 1999-12-24 Shin Etsu Chem Co Ltd Multiple-layered ceramic heater

Also Published As

Publication number Publication date
TW495885B (en) 2002-07-21
EP1254477A2 (en) 2002-11-06
WO2001059815A2 (en) 2001-08-16
WO2001059815A3 (en) 2002-02-21
JP2003524299A (en) 2003-08-12

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