JP2565474Y2 - 電子制御装置の構成部材群のためのばね部材 - Google Patents
電子制御装置の構成部材群のためのばね部材Info
- Publication number
- JP2565474Y2 JP2565474Y2 JP1991081582U JP8158291U JP2565474Y2 JP 2565474 Y2 JP2565474 Y2 JP 2565474Y2 JP 1991081582 U JP1991081582 U JP 1991081582U JP 8158291 U JP8158291 U JP 8158291U JP 2565474 Y2 JP2565474 Y2 JP 2565474Y2
- Authority
- JP
- Japan
- Prior art keywords
- spring
- spring member
- cooling
- leg
- control unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 claims description 27
- 210000000078 claw Anatomy 0.000 claims description 9
- 238000000034 method Methods 0.000 description 4
- 238000010008 shearing Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9014091U DE9014091U1 (de) | 1990-10-10 | 1990-10-10 | Federelement für eine Baugruppe eines elektronischen Steuergerätes |
| DE4131504A DE4131504C2 (de) | 1990-10-10 | 1991-09-21 | Federelement für eine Baugruppe eines elektronischen Steuergeräts |
| DE9014091.5 | 1991-09-21 | ||
| DE4131504.9 | 1991-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0496858U JPH0496858U (enrdf_load_html_response) | 1992-08-21 |
| JP2565474Y2 true JP2565474Y2 (ja) | 1998-03-18 |
Family
ID=25907571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991081582U Expired - Fee Related JP2565474Y2 (ja) | 1990-10-10 | 1991-10-08 | 電子制御装置の構成部材群のためのばね部材 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2565474Y2 (enrdf_load_html_response) |
| FR (1) | FR2668022B1 (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036124A (ja) * | 2012-08-09 | 2014-02-24 | Nidec Servo Corp | 電子機器、放熱機構、クリップ及び治具 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3495131A (en) * | 1968-07-16 | 1970-02-10 | Nat Connector Corp | Integrated circuit connector assembly |
| DE3331207A1 (de) * | 1983-08-30 | 1985-03-07 | Robert Bosch Gmbh, 7000 Stuttgart | Baugruppe fuer elektronische steuergeraete |
| FR2567324B1 (fr) * | 1984-07-06 | 1986-11-28 | Telemecanique Electrique | Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique |
| JPH0625990Y2 (ja) * | 1988-04-20 | 1994-07-06 | 東光株式会社 | 放熱板への電子部品の止め具 |
| US4899255A (en) * | 1988-07-25 | 1990-02-06 | Motorola Inc. | Heat sink clip and assembly and method of manufacture |
-
1991
- 1991-10-08 JP JP1991081582U patent/JP2565474Y2/ja not_active Expired - Fee Related
- 1991-10-10 FR FR9112475A patent/FR2668022B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0496858U (enrdf_load_html_response) | 1992-08-21 |
| FR2668022B1 (fr) | 1994-06-10 |
| FR2668022A1 (fr) | 1992-04-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |