JPH0496858U - - Google Patents

Info

Publication number
JPH0496858U
JPH0496858U JP8158291U JP8158291U JPH0496858U JP H0496858 U JPH0496858 U JP H0496858U JP 8158291 U JP8158291 U JP 8158291U JP 8158291 U JP8158291 U JP 8158291U JP H0496858 U JPH0496858 U JP H0496858U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8158291U
Other languages
Japanese (ja)
Other versions
JP2565474Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE9014091U external-priority patent/DE9014091U1/de
Application filed filed Critical
Publication of JPH0496858U publication Critical patent/JPH0496858U/ja
Application granted granted Critical
Publication of JP2565474Y2 publication Critical patent/JP2565474Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1991081582U 1990-10-10 1991-10-08 電子制御装置の構成部材群のためのばね部材 Expired - Fee Related JP2565474Y2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE9014091U DE9014091U1 (de) 1990-10-10 1990-10-10 Federelement für eine Baugruppe eines elektronischen Steuergerätes
DE4131504A DE4131504C2 (de) 1990-10-10 1991-09-21 Federelement für eine Baugruppe eines elektronischen Steuergeräts
DE9014091.5 1991-09-21
DE4131504.9 1991-09-21

Publications (2)

Publication Number Publication Date
JPH0496858U true JPH0496858U (enrdf_load_html_response) 1992-08-21
JP2565474Y2 JP2565474Y2 (ja) 1998-03-18

Family

ID=25907571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991081582U Expired - Fee Related JP2565474Y2 (ja) 1990-10-10 1991-10-08 電子制御装置の構成部材群のためのばね部材

Country Status (2)

Country Link
JP (1) JP2565474Y2 (enrdf_load_html_response)
FR (1) FR2668022B1 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014036124A (ja) * 2012-08-09 2014-02-24 Nidec Servo Corp 電子機器、放熱機構、クリップ及び治具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156592U (enrdf_load_html_response) * 1988-04-20 1989-10-27

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495131A (en) * 1968-07-16 1970-02-10 Nat Connector Corp Integrated circuit connector assembly
DE3331207A1 (de) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe fuer elektronische steuergeraete
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156592U (enrdf_load_html_response) * 1988-04-20 1989-10-27

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014036124A (ja) * 2012-08-09 2014-02-24 Nidec Servo Corp 電子機器、放熱機構、クリップ及び治具

Also Published As

Publication number Publication date
JP2565474Y2 (ja) 1998-03-18
FR2668022B1 (fr) 1994-06-10
FR2668022A1 (fr) 1992-04-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees