FR2668022B1 - Element de ressort pour un sous-ensemble d'appareil de commande electronique. - Google Patents

Element de ressort pour un sous-ensemble d'appareil de commande electronique.

Info

Publication number
FR2668022B1
FR2668022B1 FR9112475A FR9112475A FR2668022B1 FR 2668022 B1 FR2668022 B1 FR 2668022B1 FR 9112475 A FR9112475 A FR 9112475A FR 9112475 A FR9112475 A FR 9112475A FR 2668022 B1 FR2668022 B1 FR 2668022B1
Authority
FR
France
Prior art keywords
control unit
electronic control
spring element
unit assembly
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9112475A
Other languages
English (en)
French (fr)
Other versions
FR2668022A1 (fr
Inventor
Bentz Willy
Goetzke Siegfried
Karr Dieter
Schetter Jutta
Schiefer Peter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE9014091U external-priority patent/DE9014091U1/de
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2668022A1 publication Critical patent/FR2668022A1/fr
Application granted granted Critical
Publication of FR2668022B1 publication Critical patent/FR2668022B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR9112475A 1990-10-10 1991-10-10 Element de ressort pour un sous-ensemble d'appareil de commande electronique. Expired - Fee Related FR2668022B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE9014091U DE9014091U1 (de) 1990-10-10 1990-10-10 Federelement für eine Baugruppe eines elektronischen Steuergerätes
DE4131504A DE4131504C2 (de) 1990-10-10 1991-09-21 Federelement für eine Baugruppe eines elektronischen Steuergeräts

Publications (2)

Publication Number Publication Date
FR2668022A1 FR2668022A1 (fr) 1992-04-17
FR2668022B1 true FR2668022B1 (fr) 1994-06-10

Family

ID=25907571

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9112475A Expired - Fee Related FR2668022B1 (fr) 1990-10-10 1991-10-10 Element de ressort pour un sous-ensemble d'appareil de commande electronique.

Country Status (2)

Country Link
JP (1) JP2565474Y2 (enrdf_load_html_response)
FR (1) FR2668022B1 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014036124A (ja) * 2012-08-09 2014-02-24 Nidec Servo Corp 電子機器、放熱機構、クリップ及び治具

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495131A (en) * 1968-07-16 1970-02-10 Nat Connector Corp Integrated circuit connector assembly
DE3331207A1 (de) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe fuer elektronische steuergeraete
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
JPH0625990Y2 (ja) * 1988-04-20 1994-07-06 東光株式会社 放熱板への電子部品の止め具
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture

Also Published As

Publication number Publication date
JP2565474Y2 (ja) 1998-03-18
JPH0496858U (enrdf_load_html_response) 1992-08-21
FR2668022A1 (fr) 1992-04-17

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110630