JP2553055Y2 - 樹脂モールド金型 - Google Patents
樹脂モールド金型Info
- Publication number
- JP2553055Y2 JP2553055Y2 JP727091U JP727091U JP2553055Y2 JP 2553055 Y2 JP2553055 Y2 JP 2553055Y2 JP 727091 U JP727091 U JP 727091U JP 727091 U JP727091 U JP 727091U JP 2553055 Y2 JP2553055 Y2 JP 2553055Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- metal
- resin
- linear expansion
- metal block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 title claims description 43
- 229920005989 resin Polymers 0.000 title claims description 43
- 239000002184 metal Substances 0.000 claims description 70
- 229910052751 metal Inorganic materials 0.000 claims description 70
- 238000005304 joining Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 5
- 229910001315 Tool steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP727091U JP2553055Y2 (ja) | 1991-01-25 | 1991-01-25 | 樹脂モールド金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP727091U JP2553055Y2 (ja) | 1991-01-25 | 1991-01-25 | 樹脂モールド金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0496310U JPH0496310U (cg-RX-API-DMAC7.html) | 1992-08-20 |
| JP2553055Y2 true JP2553055Y2 (ja) | 1997-11-05 |
Family
ID=31739023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP727091U Expired - Fee Related JP2553055Y2 (ja) | 1991-01-25 | 1991-01-25 | 樹脂モールド金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2553055Y2 (cg-RX-API-DMAC7.html) |
-
1991
- 1991-01-25 JP JP727091U patent/JP2553055Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0496310U (cg-RX-API-DMAC7.html) | 1992-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970610 |
|
| LAPS | Cancellation because of no payment of annual fees |