JP2549936Y2 - 電子部品検査器における電子部品装着具 - Google Patents
電子部品検査器における電子部品装着具Info
- Publication number
- JP2549936Y2 JP2549936Y2 JP40549490U JP40549490U JP2549936Y2 JP 2549936 Y2 JP2549936 Y2 JP 2549936Y2 JP 40549490 U JP40549490 U JP 40549490U JP 40549490 U JP40549490 U JP 40549490U JP 2549936 Y2 JP2549936 Y2 JP 2549936Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- pin
- connection
- shape memory
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007689 inspection Methods 0.000 title claims description 11
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 3
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WJCRZORJJRCRAW-UHFFFAOYSA-N cadmium gold Chemical compound [Cd].[Au] WJCRZORJJRCRAW-UHFFFAOYSA-N 0.000 description 1
- NSAODVHAXBZWGW-UHFFFAOYSA-N cadmium silver Chemical compound [Ag].[Cd] NSAODVHAXBZWGW-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- -1 copper-aluminum-nickel Chemical compound 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- OBACEDMBGYVZMP-UHFFFAOYSA-N iron platinum Chemical compound [Fe].[Fe].[Pt] OBACEDMBGYVZMP-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40549490U JP2549936Y2 (ja) | 1990-12-28 | 1990-12-28 | 電子部品検査器における電子部品装着具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40549490U JP2549936Y2 (ja) | 1990-12-28 | 1990-12-28 | 電子部品検査器における電子部品装着具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0494576U JPH0494576U (enExample) | 1992-08-17 |
| JP2549936Y2 true JP2549936Y2 (ja) | 1997-10-08 |
Family
ID=31882903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40549490U Expired - Lifetime JP2549936Y2 (ja) | 1990-12-28 | 1990-12-28 | 電子部品検査器における電子部品装着具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2549936Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7203283B2 (ja) * | 2020-05-13 | 2023-01-12 | 三菱電機株式会社 | 電子デバイス検査装置 |
-
1990
- 1990-12-28 JP JP40549490U patent/JP2549936Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0494576U (enExample) | 1992-08-17 |
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