JP2541887Y2 - ウエハの表面処理装置 - Google Patents

ウエハの表面処理装置

Info

Publication number
JP2541887Y2
JP2541887Y2 JP2174590U JP2174590U JP2541887Y2 JP 2541887 Y2 JP2541887 Y2 JP 2541887Y2 JP 2174590 U JP2174590 U JP 2174590U JP 2174590 U JP2174590 U JP 2174590U JP 2541887 Y2 JP2541887 Y2 JP 2541887Y2
Authority
JP
Japan
Prior art keywords
cassette
transfer
wafer
surface treatment
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2174590U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02116736U (enrdf_load_stackoverflow
Inventor
俊作 児玉
Original Assignee
大日本スクリ−ン製造 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大日本スクリ−ン製造 株式会社 filed Critical 大日本スクリ−ン製造 株式会社
Priority to JP2174590U priority Critical patent/JP2541887Y2/ja
Publication of JPH02116736U publication Critical patent/JPH02116736U/ja
Application granted granted Critical
Publication of JP2541887Y2 publication Critical patent/JP2541887Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2174590U 1990-03-02 1990-03-02 ウエハの表面処理装置 Expired - Lifetime JP2541887Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2174590U JP2541887Y2 (ja) 1990-03-02 1990-03-02 ウエハの表面処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2174590U JP2541887Y2 (ja) 1990-03-02 1990-03-02 ウエハの表面処理装置

Publications (2)

Publication Number Publication Date
JPH02116736U JPH02116736U (enrdf_load_stackoverflow) 1990-09-19
JP2541887Y2 true JP2541887Y2 (ja) 1997-07-23

Family

ID=31239247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2174590U Expired - Lifetime JP2541887Y2 (ja) 1990-03-02 1990-03-02 ウエハの表面処理装置

Country Status (1)

Country Link
JP (1) JP2541887Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2598364B2 (ja) * 1993-02-26 1997-04-09 株式会社スガイ 基板洗浄システム

Also Published As

Publication number Publication date
JPH02116736U (enrdf_load_stackoverflow) 1990-09-19

Similar Documents

Publication Publication Date Title
US20020081181A1 (en) Substrate processing apparatus and substrate processing method
JP3978393B2 (ja) 基板処理装置
JP4342745B2 (ja) 基板処理方法および半導体装置の製造方法
KR102396204B1 (ko) 기판 처리 장치 및 기판 반송 방법
JP2541887Y2 (ja) ウエハの表面処理装置
JP3248789B2 (ja) 基板ウェット処理方法および処理システム
JP2544056Y2 (ja) ウエハの表面処理装置
JP4838293B2 (ja) 基板処理方法、半導体装置の製造方法および基板処理装置
KR100521401B1 (ko) 기판세정시스템
JP3346823B2 (ja) 基板ウェット処理装置
JP3559099B2 (ja) 基板処理装置
JPH07211679A (ja) 洗浄装置
JP2505263Y2 (ja) ウエハの表面処理装置のウエハ移送装置
JP2587512Y2 (ja) 基板収納状態検出装置
JP3609936B2 (ja) 基板処理装置
KR100625310B1 (ko) 기판 세정 시스템
JPH11330190A (ja) 基板の搬送方法及び処理システム
JP3205525B2 (ja) 基板の取出装置，搬入装置及び取出搬入装置
JP3210133B2 (ja) 基板ウェット処理装置
KR100625308B1 (ko) 기판세정장치
JP2001135710A (ja) 基板処理装置
JP2002329703A (ja) 基板洗浄装置及び方法
JP3102824B2 (ja) 基板処理装置
TW202343645A (zh) 基板處理裝置
TW202343646A (zh) 基板處理裝置