JP2539264Y2 - プローブカード - Google Patents
プローブカードInfo
- Publication number
- JP2539264Y2 JP2539264Y2 JP1990077861U JP7786190U JP2539264Y2 JP 2539264 Y2 JP2539264 Y2 JP 2539264Y2 JP 1990077861 U JP1990077861 U JP 1990077861U JP 7786190 U JP7786190 U JP 7786190U JP 2539264 Y2 JP2539264 Y2 JP 2539264Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- needle
- probe card
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims description 25
- 238000005476 soldering Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077861U JP2539264Y2 (ja) | 1990-07-24 | 1990-07-24 | プローブカード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077861U JP2539264Y2 (ja) | 1990-07-24 | 1990-07-24 | プローブカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0436240U JPH0436240U (enrdf_load_stackoverflow) | 1992-03-26 |
| JP2539264Y2 true JP2539264Y2 (ja) | 1997-06-25 |
Family
ID=31620626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990077861U Expired - Lifetime JP2539264Y2 (ja) | 1990-07-24 | 1990-07-24 | プローブカード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2539264Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20114544U1 (de) * | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58120650U (ja) * | 1982-02-09 | 1983-08-17 | 日本電子材料株式会社 | プロ−ブカ−ド |
| JPS59163968U (ja) * | 1983-04-20 | 1984-11-02 | 株式会社フジクラ | プリント回路板検査装置 |
| JPS612338A (ja) * | 1984-06-15 | 1986-01-08 | Hitachi Ltd | 検査装置 |
| JPH01295185A (ja) * | 1988-05-21 | 1989-11-28 | Tokyo Electron Ltd | 検査装置 |
-
1990
- 1990-07-24 JP JP1990077861U patent/JP2539264Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0436240U (enrdf_load_stackoverflow) | 1992-03-26 |
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