JP2534061Y2 - 固体撮像装置 - Google Patents
固体撮像装置Info
- Publication number
- JP2534061Y2 JP2534061Y2 JP9491U JP9491U JP2534061Y2 JP 2534061 Y2 JP2534061 Y2 JP 2534061Y2 JP 9491 U JP9491 U JP 9491U JP 9491 U JP9491 U JP 9491U JP 2534061 Y2 JP2534061 Y2 JP 2534061Y2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- lead frame
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 title claims description 38
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9491U JP2534061Y2 (ja) | 1991-01-08 | 1991-01-08 | 固体撮像装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9491U JP2534061Y2 (ja) | 1991-01-08 | 1991-01-08 | 固体撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0494751U JPH0494751U (enExample) | 1992-08-17 |
| JP2534061Y2 true JP2534061Y2 (ja) | 1997-04-30 |
Family
ID=33524084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9491U Expired - Lifetime JP2534061Y2 (ja) | 1991-01-08 | 1991-01-08 | 固体撮像装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2534061Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980030032A (ko) * | 1996-10-29 | 1998-07-25 | 황인길 | 반도체 패키지 |
-
1991
- 1991-01-08 JP JP9491U patent/JP2534061Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0494751U (enExample) | 1992-08-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7367120B2 (en) | Method for producing a solid-state imaging device | |
| US20040095502A1 (en) | Digital camera with a light-sensitive sensor | |
| JPH0685222A (ja) | 固体撮像装置 | |
| US20050077451A1 (en) | Optical device and production method thereof | |
| JP3138191B2 (ja) | 固体撮像素子 | |
| US6740870B1 (en) | Clear plastic packaging in a CMOS active pixel image sensor | |
| JPH05218230A (ja) | 半導体装置 | |
| JP2534061Y2 (ja) | 固体撮像装置 | |
| JPH0653462A (ja) | 樹脂封合形固体撮像素子パッケージおよびその製造方法 | |
| JPH0513738A (ja) | オンチツプレンズ付固体撮像装置 | |
| WO2021143447A1 (zh) | 支架、感光组件、摄像模组和支架制备方法 | |
| JP3953614B2 (ja) | 固体撮像装置 | |
| JP2003032557A (ja) | 固体撮像装置及びその製造方法 | |
| JPH0661522A (ja) | 反射型光結合装置 | |
| JPH04255264A (ja) | 混成集積回路 | |
| JP2921451B2 (ja) | 半導体発光モジュール | |
| JPH06132423A (ja) | 半導体装置の製造方法 | |
| JP2878875B2 (ja) | Ccdモジュール | |
| CN108807430B (zh) | 摄像模组及其复合式感光组件 | |
| JPH05291546A (ja) | 固体撮像素子の製造方法 | |
| JP2620685B2 (ja) | 固体撮像素子の製造方法 | |
| JP3699783B2 (ja) | チップ型半導体及びその製造方法 | |
| JPH0697510A (ja) | 小型光半導体装置 | |
| JP2559621Y2 (ja) | 固体撮像素子 | |
| JPH0627969Y2 (ja) | ホトカプラ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19961210 |