JP2531024Y2 - セラミック基板の共晶加熱ボンディング装置 - Google Patents

セラミック基板の共晶加熱ボンディング装置

Info

Publication number
JP2531024Y2
JP2531024Y2 JP1988130514U JP13051488U JP2531024Y2 JP 2531024 Y2 JP2531024 Y2 JP 2531024Y2 JP 1988130514 U JP1988130514 U JP 1988130514U JP 13051488 U JP13051488 U JP 13051488U JP 2531024 Y2 JP2531024 Y2 JP 2531024Y2
Authority
JP
Japan
Prior art keywords
ceramic substrate
heat block
heating device
eutectic
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988130514U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0252334U (US06815460-20041109-C00097.png
Inventor
哲一 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1988130514U priority Critical patent/JP2531024Y2/ja
Publication of JPH0252334U publication Critical patent/JPH0252334U/ja
Application granted granted Critical
Publication of JP2531024Y2 publication Critical patent/JP2531024Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP1988130514U 1988-10-05 1988-10-05 セラミック基板の共晶加熱ボンディング装置 Expired - Lifetime JP2531024Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988130514U JP2531024Y2 (ja) 1988-10-05 1988-10-05 セラミック基板の共晶加熱ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988130514U JP2531024Y2 (ja) 1988-10-05 1988-10-05 セラミック基板の共晶加熱ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0252334U JPH0252334U (US06815460-20041109-C00097.png) 1990-04-16
JP2531024Y2 true JP2531024Y2 (ja) 1997-04-02

Family

ID=31385749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988130514U Expired - Lifetime JP2531024Y2 (ja) 1988-10-05 1988-10-05 セラミック基板の共晶加熱ボンディング装置

Country Status (1)

Country Link
JP (1) JP2531024Y2 (US06815460-20041109-C00097.png)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3156500B2 (ja) * 1994-05-11 2001-04-16 松下電器産業株式会社 キュア装置
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ
JP7157367B2 (ja) * 2018-02-08 2022-10-20 Tdk株式会社 実装装置および実装方法
JP2020115528A (ja) * 2019-01-18 2020-07-30 株式会社新川 ボンディング装置、フレームフィーダ及びヒータユニット
WO2021176739A1 (ja) * 2020-03-06 2021-09-10 株式会社新川 ボンディング装置、フレームフィーダ及びヒータユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51114739A (en) * 1975-04-02 1976-10-08 Hitachi Ltd Heating table
JPS56108238A (en) * 1980-01-31 1981-08-27 Toshiba Corp Assembling apparatus for semiconductor
JPS59208734A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd ペレツトボンデイング装置
JPS605125U (ja) * 1983-05-31 1985-01-14 ロ−ム株式会社 半導体装置組み立て用ヒ−タブロツク
JPS60167336A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 加熱装置

Also Published As

Publication number Publication date
JPH0252334U (US06815460-20041109-C00097.png) 1990-04-16

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