TW200402811A - Manufacturing apparatus of electronic device, manufacturing method of electronic device, and manufacturing program of electronic device - Google Patents

Manufacturing apparatus of electronic device, manufacturing method of electronic device, and manufacturing program of electronic device Download PDF

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Publication number
TW200402811A
TW200402811A TW092106361A TW92106361A TW200402811A TW 200402811 A TW200402811 A TW 200402811A TW 092106361 A TW092106361 A TW 092106361A TW 92106361 A TW92106361 A TW 92106361A TW 200402811 A TW200402811 A TW 200402811A
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Taiwan
Prior art keywords
heat
heating
electronic device
temperature
block
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TW092106361A
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Chinese (zh)
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TWI258192B (en
Inventor
Masakuni Shiozawa
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Seiko Epson Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

The subject of the present invention is to have the capability of using simple composition to easily conduct quality management of product, and truly preventing the generation of product damage caused when the production line stops. Through the rising movement, the circuit substrate 101 with the predetermined block length of the rolling tape substrate 100 is slowly moved from a fixed location to approach the preheating block 111, and is moved to the fixed location after undergone with a preheating process. After that, the formal heating block 112 disposed adjacent to the preheating block 111 is made to contact with the circuit substrate 101, which is conveyed by the predetermined operation procedure and is preheated. After added with the peak-value heating, the formal heating block is moved back to the fixed location. Then, the cooling block 113 is made to approach the circuit substrate 101, which is undergone with the peak-value heating, and is moved back to the fixed location after cooling the circuit substrate 101.

Description

200402811 Π) 玖、發明說明 【發明所屬之技術領域】 本發明是有關電子裝置的製造裝置，電子裝置的製造 方法及電子裝置的製造程式，尤其是適合於安裝有電子零 件的捲帶基板等的焊錫回流過程者。 【先前技術】 在丰導體裝置的製造中，具有：在COF(chip 〇n film) 挨’ifl或 TAB(Tape Automated Bonding)模組等的電路基板 中，藉由回流方式來例如安裝半導體晶片的過程。圖8是 表示以往電子裝置的製造方法。 圖17是表示以往電子裝置的製造方法。 在圖1 7中’在回流過程中，沿著捲帶基板8 〇 1的搬 送方向（箭頭方向）而設有加熱區域811〜S13及冷却區 域8 1 4。在此，於回流過程中，若施以激烈的高温加熱， 則電路基板8 0 1與半導體晶片之間的接著劑等的接合構件 或半導體晶片本身會發生回流龜裂，或者無法順利地進行 焊錫膏的焊錫接合。因此，會在加熱區域8 1 1、8 1 2施以 預熱，在加熱區域8 1 3施以峰値熱。峰値熱是形成焊錫融 点+ α。並且，在回流過程的回流方式，可採用熱風循環 方式的空氣加熱，燈加熱方式，或遠紅外線方式等。 又，若半導體晶片的端子經由焊錫膏而溶融接合於電 路基板的配線上，則會在冷却區域8 1 4被冷却，藉此半導 體晶片會被固定於電路基板上。在冷却區域8 1 4中，可採 (2) (2)200402811 用使低温空氣循環的方式。 【發明內容】 【發明所欲解決之課題】 但，在熱風循環方式的空氣加熱中，由於熱傳導性差 ，因此加熱區域8 1 1〜8 1 3的加熱處理時間會變長，而有 礙生産性的提升。並且，就熱風循環方式而言，由於熱風 循環的機構大，因此會妨礙裝置的小型化。 又，就燈加熱方式或遠紅外線方式而言，由於是進行 點加熱的方式，因此在加熱區域8 1 1〜8 1 3間必須要有遮 光構造，其結果，裝置的構成會變大。 又，就該等的回流方式而言，由於熱放散性大，因此 在以預定的區塊長單位來對捲帶基板80 1進行加熱處理或 冷却處理時，難以對應配合區塊長的處理時間。並且，在 加熱區域8 1 1〜8 1 3間，由於熱會移動，因此難以維持去 除加熱區域8 1 1〜8 1 3間的境界温度。 又，上述回流方式中，當基於某種原因而造成生產線 停止一定時間以上時，會在關閉加熱源的開關下，使加熱 處理中斷。但，在停止生產線一定時間以上時，由於無法 使加熱處理中的製品迴避，因此會難以防止製品受到損傷 〇 又，由於熱也會被傳達至位於加熱區域8 1 1前之下次 才會進行加熱處理的捲帶基板8 0 1，因此不易進行製品的 品質管理。 -6- (3) (3)200402811 又，當生產線恢復時，雖會再度施以預熱、峰値熱及 冷却’但由於在將受損的製品部份送至回流過程外之後， 必須關閉加熱源的開關，因此會拉長恢復後至進行加熱處 理或冷却處理之通常運轉的等待時間。 又，由於在回流過程的冷却區域8 1 4中使以低温空氣 來冷却，因此冷却處理時間會變長，特別是當焊錫膏爲無 鉛時，不易防止熱氧化。 因應於此，本發明的目的是在於提供一種可以簡單的 構成來容易進行製品的品質管理，以及能夠防止在生產線 停止時造成製品的損傷之電子裝置製造裝置，電子裝置的 製造方法及電子裝置的製造程式。 【用以解決課題之手段】 爲了達成上述目的，本發明之一形態的電子裝置的製 造裝置的特徵是具備：發熱手段；該發熱手段是藉由控制 與在各電路區塊中設有電子零件搭載區域之連續體的被加 熱處理區域的距離來使上述被加熱處理區域的溫度上升。 藉此、可在控制被加熱處理區域與發熱手段的距離之 情況下、容易控制被加熱處理區域的加熱狀態，即使是在 搬送途中使被加熱處理區域静止，照樣可以容易控制被加 熱處理區域的。因此，可控制回流過程之激烈的温度變化 ，降低對電子零件或焊錫材等造成損傷，且可容易避免生 產線停止時造成製品的熱損傷，一方面可以抑止裝置大型 化，另一方面能夠容易進行回流處理的品質管理。 (4) 200402811 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述發熱手段是藉由接近或接觸於上述連續體的被加熱 處理區域的至少一部份來使上述被加熱處理區域的溫度上 藉此，可利用輻射熱或熱傳導來控制被加熱處理區域 的加熱狀態，抑止發熱手段所產生的熱散放於周圍。因此 ，可以電路區塊單位來精度良好地控制温度履歷，而能夠 容易進行品質管理，且不需要熱風循環方式的遮蔽構造， 及燈加熱方式或遠紅外線方式的遮光構造，因此可達成省 空間化。 又，可在使發熱手段接觸於連續體的被加熱處理區域 之情況下，迅速地使電路區塊的温度上升，而能夠縮短搬 送時的作業流程時間。因此，可使焊錫塗佈過程或安裝過 程之搬送作業流程與回流過程之搬送作業流程整合，而使 能夠一次進行焊錫塗佈處理、電子零件的安裝處理及回流 處理。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述發熱手段是由上述連續體的背面側或表面側來接觸 〇 在此，發熱手段會由連續體的背面側接觸，藉此即使 高度不同的電子零件配置於連續體上，還是能夠有效率地 在連續體傳遞熱，而使能夠安定地進行回流處理。 又，發熱手段會由連續體的表面側接觸，藉此發熱手 段可直接接觸於電子零件，防止發熱手段接觸於連續體， 冬 ·、、，、了 二 V. / (5) (5)200402811 而使能夠防止連續體附著於發熱手段。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 ••上述發熱手段是藉由控制移動速度或移動位置來階段性 地控制被加熱處理區域的溫度。 藉此，可不必使用温度不同的複數個發熱手段，就能 階段性地控制被加熱處理區域的温度。因此，可防止在進 行被加熱處理區域的回流處理時產生激烈的温度變化，一 方面可達成省空間化，另一方面能夠抑止回流處理的品質 劣化。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述發熱手段爲上下移動或水平移動。 在此，即使被加熱處理區域較廣，照樣可以藉由上下 移動發熱手段來維持被加熱處理區域的温度分布均—，p皆 段性地使被加熱處理區域的温度上升或下降，且一方面可 抑止回流區域 面積増大，另一方面能夠使發熱手段迅速 地脫離被加熱處理區域。 因此，即使是在生產線發生問題而停止搬送系統時， 照樣可以一方面達成省空間化，另一方面能夠迅速地迴避 對被加熱處理區域造成熱損傷，進而可以抑制回流處理的 品質劣化。 又，可藉由水平移動發熱手段來使連續體的搬送速度 與發熱手段的移動速度一致，可使被加熱處理區域的静止 位置之加熱温度差降低，且即使製品間距不同，照樣可以 保持加熱時間的均一性。 (6) (6)200402811 又’本發明之一形態的電子裝置的製造裝置的特徵爲 :上述發熱手段是複數次接觸於同一被加熱處理區域。 藉此，由於可避免對被加熱處理區域造成熱損傷，因 此即使脫離發熱手段，照樣可一面防止被加熱處理區域的 激烈温度變化，一面使被加熱處理區域容易恢復到原來的 温度’且一方面可達成省空間化，另一方面能抑止回流處 理的品質劣化。 又’本發明之一形態的電子裝置的製造裝置的特徵爲 :上述發熱手段具有比塗佈於上述電路區塊上的焊錫塗佈 區域還要大的接觸面積，一次針對複數個電路區塊來使溫 度上升。 藉此，可在使被加熱處理區域接觸於發熱手段的情況 下’一次針對複數個電路區塊進行回流處理，且即使製品 間距不同，照樣可在不更換發熱手段的情況下進行回流處 理。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述發熱手段具有設定溫度不同的複數個接觸區域，藉 由上述接觸區域依次接觸於上述被加熱處理區域來階段性 地使上述被加熱處理區域的溫度上升。 藉此，可利用熱傳導來控制被加熱處理區域的加熱狀 態’一方面可抑止發熱手段所產生的熱散放於周圍，另一 方面能使被加熱處理區域的温度段階性地上升。因此，可 在不需要熱風循環方式的遮蔽構造，及燈加熱方式或遠紅 外線方式的遮光構造之下，以電路區塊單位來階段性地控 -10- (7) (7)200402811 制温度履歷，進而可以一面達成省空間化，一面能夠容易 進行品質管理。 又’可在使發熱手段依次接近於連續體的被加熱處理 區域之情況下，階段性且迅速地使電路區塊的温度上升， 一方面可防止被加熱處理區域的激烈温度變化，另一方面 成1(0短搬送時的作業流程時間。因此，一*方面可抑止回流 處理的品質劣化，另一方面可使焊錫塗佈過程或安裝過程 之搬送作業流程與回流過程之搬送作業流程整合，而使能 夠一次進行焊錫塗佈處理、電子零件的安裝處理及回流處 理。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述設定溫度不同的複數個接觸區域是沿著上述連續體 的搬送方向來排列配置。 藉此，可在搬送連續體的情況下，使設定温度不同的 複數個接觸區域依次接觸於被加熱處理區域，可在不移動 發熱手段的情況下，階段性地使被加熱處理區域的温度上 升，且能一次針對複數個被加熱處理區域進行回流處理。 因此，一方面可以防止在進行回流處理時被加熱處理 區域產生激烈的温度變化，另一方面能夠縮短回流處理的 作業流程時間，一面維持製品品質，一面更有效率地進行 回流處理。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 •在上述設疋溫度不问的接觸區域間設有空隙。 藉此，可消除在設定温度不同的接觸區域間的境界產 L r v -11 - 200402811 (δ) 生温度差，精度良好地控制各被加熱處理區域的温度履歷 ，提高回流處理的製品品質。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述設定溫度不同的複數個接觸區域可個別移動。 藉此，可使特定的電路區塊繼續進行預熱，而不會中 斷其他電路區塊的正式加熱。因此，即使在途中使正式加 熱中斷，照樣能夠防止在途中停止預熱，進而可以降低製 品不良。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :與上述被加熱處理區域接觸的上述發熱手段的接觸面爲 平坦。 藉此，可在使連續體接觸於發熱手段的接觸面上之情 況下，順暢地搬送連續體。因此，在使連續體接觸於發熱 手段的接觸面來進行加熱時，可省略發熱手段的移動動作 ，進而能縮短回流處理的作業流程時間。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 ••上述發熱手段的接觸面設有對應於上述被加熱處理區域 的半導體晶片的配置位置之凹部。 藉此，可防止發熱手段直接接觸於配置有半導體晶片 的區域。因此，即使在連續體上安裝有不耐熱的半導體晶 片，還是可以抑止對半導體晶片造成熱損傷。 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :在上述連續體的被加熱處理區域與上述發熱手段之間， 更具備插拔可能的遮蔽手段。 -12- (9) (9)200402811 藉此，在使被加熱處理區域迴避發熱手段時，可抑止 來自發熱手段的輻射熱持續加熱被加熱處理區域，即使拉 長回避時間，還是能夠抑止對被加熱處理區域造成熱損傷 〇 又，本發明之一形態的電子裝置的製造裝置的特徵是 更具備： 計時手段；該計時手段是用以計時上述發熱手段之上 述被加熱處理區域的加熱時間；及 脫離手段；該脫離手段是在上述加熱時間超越預定時 間時，使上述發熱手段脫離上述被加熱處理區域。 藉此，在對被加熱處理區域進行加熱處理中，即使生 產線發生問題，而導致搬送系統停止時，照樣可以迅速迴 避對被加熱處理區域造成熱損傷，抑止回流處理的品質劣 化。 又，本發明之一形態的電子裝置的製造裝置的特徵是 更具備： 支持台；該支持台是用以支持上述發熱手段；及 滑動手段；g亥滑動手段是用以沿著上述連續體的搬送 方向來使上述支持台滑動。 藉此，可一邊目視確認，一邊使發熱手段的位置對準 製品間距，即使製品間距不同，照樣能夠保持加熱時間的 i句—性 〇 又’本發明之一形態的電子裝置的製造裝置的特徵是 更具備：加熱輔助手段；該加熱輔助手段是由與上述發熱 -13- (10) (10)200402811 手段不同的方向來加熱上述連續體的被加熱處理區域。 藉此，即使是在使被加熱處理區域迴避發熱手段時， 照樣可以使被加熱處理區域的温度保持於預定値以上，防 止被加熱處理區域的温度過度降低，而發生製品不良。 又，本發明之一形態的電子裝置的製造裝置的特徵是 更具備：溫度下降手段；該溫度下降手段是在於使藉由上 述發熱手段而溫度上升的上述被加熱處理區域的溫度下降 〇 藉此，可使藉由發熱手段而温度上升的被加熱處理區 域的温度急速下降，提高焊錫浸溼性來使接合安定，且可 防止焊錫熱氧化。 又，本發明之一形態的電子裝置的製造裝置的特徵是 上述溫度下降手段具備：平板構件；該平板構件在面向上 述被加熱處理區域的一側具有複數個冷卻劑的吹出孔。 藉此，即使電子零件被安裝於被加熱處理區域上，照 樣可使冷却剤遍及各個角落，有效率地使被加熱處理區域 上的温度下降。 又，本發明之一形態的電子裝置的製造裝置的特徵是 上述溫度下降手段具備： 由厚度方向的上下來覆蓋上述被加熱處理區域而夾入 之剖面呈口字形的覆夾孔；及 設置於上述覆夾孔的內面之複數個冷卻劑的吹出孔。 藉此，可由被加熱處理區域的表面側與背面側來冷卻 被加熱處理區域，而使能夠有效率地使被加熱處理區域的 -14- (11) (11)200402811 温度下降。 又，本發明之一形態的電子裝置的製造裝置的特徵是 上述溫度下降于段具備：比上述發熱手段的溫度還要低白勺 區域，藉由上述溫度較低的區域接觸於上述連續體的被加 熱處理區域的至少一部份來使上述被加熱處理區域的溫度 下降。 藉此，可根據熱傳導來控制被加熱處理區域的冷却狀 態，可使冷却効率提高來縮短冷却時間。 因此，可縮短冷却時的作業程序時間，抑止焊錫熱氧 化，製品品質的劣化，且能有效率地進行回流處理。 又，本發明之一形態的電子裝置的製造裝置的特徵是 上述溫度較低的區域具有比藉由上述焊錫塗佈手段而塗佈 的焊錫塗佈區域還要大的接觸面積，上述溫度下降手段是 一次針對複數個電路區塊來使溫度上升。 藉此，可在使被加熱處理區域接觸於比發熱手段的温 度速要低的區域之情況下，一次針對複數個電路區塊進行 冷却處理，且即使製品間距不同，還是可以在不更換温度 降下手段的情況下進行冷却處理，而使能夠提高生産効率 〇 又，本發明之一形態的電子裝置的製造裝置的特徵爲 :上述溫度較低的區域是排列配置於上述發熱手段的前段 或後段或者上述發熱手段之間。 藉此，可在搬送連續體的情況下，使被加熱處理區域 接觸於比發熱手段的温度還要低的區域，可在固定比發熱 -15- (12) (12)200402811 手段的温度還要低的區域之情況下，使被加熱處理區域的 温度下降，且可一次針對複數個被加熱處理區域進行冷却 處理。 因此，可縮短冷却時的作業流程時間，抑止焊錫熱氧 化，防止製品品質劣化，且可有效率地進行回流處理。 又，可在發熱手段的前段或發熱手段之間Μ列配置比 發熱手段的温度還要低的區域之情況下，防止自發熱手段 產生的熱傳達至未接觸於發熱手段的區域，可精度良好地 保持被加熱處理區域的温度履歷，而使回流處理的製品品 質能夠提高。 又，本發明之一形態的電子裝置的製造方法的特徵爲 :藉由控制在各電路區塊中設有電子零件搭載區域之連續 體的被加熱處理區域與發熱手段的距離來使上述被加熱處 理區域的溫度上升。 藉此，可在控制被加熱處理區域與發熱手段的距離之 情況下，容易控制被加熱處理區域的加熱狀態，即使在搬 送途中使被加熱處理區域靜止，還是可以容易控制被加熱 處理區域的温度。因此，可縮短回流過程的作業流程時間 ，且可抑止回流過程的激烈温度變化，降低對電子零件或 焊錫材等造成損傷，一方面可抑止回流處理的品質劣化， 另一方面能有效率進行回流處理。 又，本發明之一形態的電子裝置的製造方法的特徵爲 :藉由接近或接觸於上述連續體的被加熱處理區域的至少 一部份來使上述被加熱處理區域的溫度上升。 -16- (13) (13)200402811 藉此’可根據輻射熱或熱傳導來控制被加熱處理區域 的加熱狀態’抑止在發熱手段所產生的熱散放於周圍。因 此，可以電路區塊單位來精度良好地控制温度履歷，而容 易進行品質管理，且不需要熱風循環方式的遮蔽構造，或 者燈加熱方式或遠紅外線方式的遮光構造，而使能夠達成 省空間化。 又’可在使}發熱手段接觸於連續體的被加熱處理區域 之情況下’迅速地使電路區塊的温度上升，而使能夠縮短 搬送時的作業流程時間。因此，可使焊錫塗佈過程或安裝 過程之搬送作業流程與回流過程之搬送作業流程整合，而 能夠一次進行焊錫塗佈處理、電子零件的安裝處理及回流 處理。 又，本發明之一形態的電子裝置的製造方法的特徵爲 :使複數個電路區塊一次接觸於上述發熱手段。 藉此，可在使被加熱處理區域接觸於發熱手段的情況 下，一次針對複數個電路區塊進行回流處理，提高生産効 率。 又，本發明之一形態的電子裝置的製造方法的特徵爲 :使同一電路區塊複數次接觸於上述發熱手段。 藉此，即使爲了使被加熱處理區域能夠避免熱損傷而 脫離發熱手段，還是可以一面防止被加熱處理區域產生激 烈温度變化，一面使被加熱處理區域容易恢復到原來的温 度，且一方面可以達成省空間化，另一方面能夠抑止回流 處理的品質劣化。 -17- (14) (14)200402811 又’本發明之一形態的電子裝置的製造方法的特徵是 具備： 將上述連續體的第1被加熱處理區域搬送至上述發熱 手段上之過程；及 藉由使搬送至上述發熱手段上的上述第1被加熱處理 區域接觸於上述發熱手段來使上述第1被加熱處理區域的 溫度上升之過程；及 將上述連續體的第2被加熱處理區域搬送至上述發熱 手段上之過程；及 藉由使搬送至上述發熱手段上的上述第2被加熱處理 區域接觸於上述發熱手段來使上述第2被加熱處理區域的 溫度上升之過程。 藉此，可在發熱手段上搬送連續體的情況下，使被加 熱處理區域接觸於發熱手段，而使能夠縮短回流處理的作 業流程時間，提高生産効率。 又，本發明之一形態的電子裝置的製造方法的特徵是 具備： 將上述連續體的被加熱處理區域搬送至上述發熱手段 上之過程；及 藉由使上述發熱手段階段性地接近於搬送至上述發熱 手段上的被加熱處理區域來階段性地使上述加熱處理區域 的溫度上升之過程。 藉此，可在使用温度一定的發熱手段的情況下，階段 性地使被加熱處理區域的温度上升，一方面可以達成省空 -18- (15) (15)200402811 間化，另一方面能夠抑止回流處理的熱損傷。 又’本發明之一形態的電子裝置的製造方法的特徵是 具備： 在上述發熱手段之上述被加熱處理區域的加熱後或加 熱中’使上述發熱手段脫離上述被加熱處理區域之過程。 藉此’即使在對被加熱處理區域進行加熱處理中停止 搬送系統’照樣可以迅速地迴避對被加熱處理區域造成熱 損傷，抑止回流處理的品質劣化。 又’本發明之一形態的電子裝置的製造方法的特徵是 具備：在上述被脫離的上述發熱手段與上述被加熱處理區 域之間插入遮熱板之過程。 藉此’只要在發熱手段與被加熱處理區域之間插入遮 熱板來使發熱手段脫離被加熱處理區域，便可抑止對被加 熱處理區域造成熱損傷，一方面可達成省空間化，另一方 面能抑止回流處理的品質劣化。 又，本發明之一形態的電子裝置的製造方法的特徵是 具備：使由上述被加熱處理區域脫離的上述發熱手段再度 接觸於上述被加熱處理區域之過程。 藉此，即使爲了避免對被加熱處理區域造成熱損傷， 而脫離發熱手段時，照樣可一面防止被加熱處理區域產生 激烈温度變化，一面使被加熱處理區域容易恢復到原來的 温度。 又，本發明之一形態的電子裝置的製造方法的特徵是 具備··在使由上述被加熱處理區域脫離的上述發熱手段再 -19- (16) (16)200402811 度接觸於上述被加熱處理區域之前，將熱風吹至上述被加 熱處理區域之過程。 藉此，即使被加熱處理區域脫離發熱手段，照樣可以 使被加熱處理區域的温度保持於預定値以上，使能夠防止 發生製品不良。 又，本發明之一形態的電子裝置的製造方法的特徵是 具備： 將上述連續體的第1被加熱處理區域搬送至第1發熱 手段上，且將上述連續體的第2被加熱處理區域搬送至比 上述第1發熱手段還要高溫的第2發熱手段上之過程；及 藉由使搬送至上述第1發熱手段上的上述第i被加熱 處理區域接觸於上述第1發熱手段來使上述第1被加熱處 理區域的溫度上升，且藉由使搬送至上述第2發熱手段上 的上述第2被加熱處理區域接觸於上述第2發熱手段來使 上述第2被加熱處理區域的溫度上升至比上述第1被加熱 處理區域的溫度還要高之過程。 藉此，可在搬送連續體的情況下，一次針對複數個被 加熱處理區域，使温度階段性地上升，一方面可以抑止回 流處理的熱損傷，另一方面能夠謀求回流處理的迅速化。 又，本發明之一形態的電子裝置的製造方法的特徵爲 :上述第1發熱手段及上述第2發熱手段是以上述第1發 熱手段能夠形成前段之方式來沿著上述連續體的搬送方向 而排列配置。 藉此，可在搬送連續體的情況下，一次使複數個被加 -20 - (17) (17)200402811 :熱處理區域接觸於設定温度不同的複數個發熱手段，可在 不移動發熱手段的情況下，一次使複數個被加熱處理區域 . 的温度階段性地上升。 @此’可以一方面防止在進行回流處理時產生被加熱 處S區域的激烈温度變化，另一方面能夠縮短回流處理的 作業流程時間，一面維持製品品質，一面有效率地進行回 流處理。 又’本發明之一形態的電子裝置的製造方法的特徵是 Φ 具備： 在上述第1及第2發熱手段之上述被加熱處理區域的 加熱後或加熱中，在使上述第1發熱手段接觸於上述第1 被加熱處理區域下，使上述第2發熱手段脫離上述第2被 加熱處理區域之過程。 錯此’即使在對複數個被加熱處理區域進行加熱處理 中停止搬送系統，照樣可在使第1被加熱處理區域維持一 定温度的情況下，迅速地迴避對第2被加熱處理區域造成 鲁 熱損傷’且即使被加熱處理區域的加熱狀態不同，還是能 夠抑止回流處理的品質劣化。 又’本發明之一形態的電子裝置的製造方法的特徵是 具備··使由上述第2被加熱處理區域脫離的上述第2發熱 手段再度接觸於上述第2被加熱處理區域之過程。 藉此’即使爲了迴避對第2被加熱處理區域造成熱損 傷，而使第2發熱手段脫離第2被加熱處理區域，照樣可 在不影響第1被加熱處理區域的温度之情況下，使第2被 -21 - (18) 200402811 加熱處理區域恢復到原來的温度，可在不發生製 情況下，使回流處理再度開始。 又’本發明之一形態的電子裝置的製造方法 具備：在使由上述第2被加熱處理區域脫離的上 熱手段再度接觸於上述第2被加熱處理區域之前 吹至上述第2被加熱處理區域之過程。 錯此，即使爲了迴避對第2被加熱處理區域 傷，而使第2被加熱處理區域脫離第2發熱手段 以使弟2被加熱處理區域的温度保持於預定値以 發生製品不良。 又，本發明之一形態的電子裝置的製造方法 具備：以上述發熱手段的位置能夠對應於製品間 ，沿著上述連續體的搬送方向來使支持上述發熱 持台滑動之過程。 藉此，可一邊目視確認，一邊使發熱手段的 製品間距，即使製品間距不同，照樣可以保持加 均一性。 又，本發明之一形態的電子裝置的製造方法 具備：使藉由上述發熱手段而溫度上升的被加熱 的溫度下降之過程。 藉此，可使利用發熱手段而温度上升的被加 域的温度急速下降，提高焊錫浸溼性’而使能夠 ，同時可防止被加熱處理區域長時間維持於高温 夠防止焊錫熱氧化。 品不良的 的特徵是 述第2發 ’將熱風 造成熱損 ，照樣可 上，防止 的特徵是 距之方式 手段的支 位置對準 熱時間的 的特徵是 處理區域 熱處理區 安定接合 ，進而能 -22- (19) (19)200402811 又’本發明之一形態的電子裝置的製造方法的特徵爲 ••藉由使比上述發熱手段的溫度還要低的區域接觸於藉由 上述發熱手段而溫度上升的被加熱處理區域的至少~部份 來使上述被加熱處理區域的溫度下降。 藉此，可利用熱傳導來控制被加熱處理區域的冷却狀 態，提高冷却効率，而使能夠縮短冷却時間。因此，可縮 短冷却時的作業程序時間，抑止焊錫熱氧化，防止製品品 質劣化，且能夠有效率地進行回流處理。 又’本發明之一形態的電子裝置的製造方法的特徵爲 :上述溫度較低的區域是排列配置於上述發熱手段的前段 或後段或者上述發熱手段之間。 葙此’可在搬送連續體的狀態下，使被加熱處理區域 接觸於比發熱手段的温度還要低的區域，有效率地進行回 流時的冷却處理。 又’可在發熱手段的前段或發熱手段之間並列配置比 發熱手段的温度遠要低的區域之情況下，在發熱手段的境 界遮斷由發熱手段所產生的熱，消除發熱手段的境界温度 ，而使能夠提高回流處理的製品品質。 又’本發明之一形態的電子裝置的製造方法的特徵爲 :藉由使氣體吹至藉由上述發熱手段而溫度上升的被加熱 處理區域的單面或兩面來使上述被加熱處理區域的溫度下 降。 藉此，即使電子零件被安裝於被加熱處理區域上，照 樣可使冷却剤遍及各個角落，而有效率地使被加熱處理區 -23 - (20) (20)200402811 域上的温度下降。 又，本發明之一形態的電子裝置的製造程式的特徵是 使下述步驟執行於電腦中，該步驟是藉由控制在各電路區 塊中設有電子零件搭載區域之連續體的被加熱處理區域與 發熱手段的距離來使上述被加熱處理區域的溫度上升。 藉此，可在安裝電子裝置的製造程式下，適當地控制 連續體的被加熱處理區域與發熱手段的距離，而使能夠一 面抑止回流時的熱損傷，一面有效率地製造電子裝置。 【實施方式】 以下，參照圖面來說明本發明之實施形態的電子裝置 的製造裝置及其製造方法。 圖1是表示本發明之第1實施形態的電子裝置的製造 方法。 圖1中，在裝載機2 1與卸載機25之間，焊錫塗怖區 域22、安裝區域23及回流區域24是沿著捲帶基板31的 搬送方向而排列配置。 另一方面，在捲帶基板31上，電子零件搭載區域會 被設置於每個電路區塊B 1 1〜B 1 3，在各電路區塊B 1 1〜 B 13中會分別設有電路基板31a、31b。又，各電路基板 3U〜31b上分別設有配線32a〜32c，且以配線32a〜32c 的端子部分能夠露出的方式，在各配線32a〜32c上形成 有絕緣膜3 3 a〜3 3 c。 此外，連結預定長度的電路基板3 1 a〜3 1 c之捲帶基 -24- (21) 200402811 板3]會被架設於捲出捲軸2 1 a與捲取捲軸2 5 a之間。又 ，依捲帶基板3 1的各搬送作業流程，捲帶基板3 1的未焊 錫塗佈區域會被搬送至設置於裝載機2 1與卸載機2 5之間 的焊錫塗佈區域22，又，捲帶基板3 1的焊錫塗佈完成區 域會被搬送至與焊錫塗佈區域22並列配置的安裝區域23 ，且捲帶基板31的安裝完成區域會被搬送至與安裝區域 2 3並列配置的回流區域2 4。200402811 Π) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a manufacturing apparatus for an electronic device, a manufacturing method for an electronic device, and a manufacturing program for an electronic device, and is particularly suitable for a tape substrate, etc. on which electronic components are mounted. Solder reflow process. [Prior art] In the manufacture of a high-conductor device, a circuit board such as a COF (chip ON film) next to an ifl or a TAB (Tape Automated Bonding) module has a method of mounting a semiconductor wafer by a reflow method, for example. process. FIG. 8 shows a conventional method for manufacturing an electronic device. FIG. 17 shows a method of manufacturing a conventional electronic device. In FIG. 17 ′, during the reflow process, heating areas 811 to S13 and cooling areas 8 1 4 are provided along the conveyance direction (arrow direction) of the tape substrate 801. Here, during the reflow process, if intense high-temperature heating is applied, a bonding member such as an adhesive between the circuit board 801 and the semiconductor wafer, or the semiconductor wafer itself may undergo reflow cracking, or soldering cannot be performed smoothly. Solder bonding of the paste. Therefore, preheating is applied to the heating areas 8 1 1 and 8 1 2, and peak heating is applied to the heating area 8 1 3. The peak heat is formed by the solder melting point + α. Moreover, in the reflow method of the reflow process, air heating by a hot air circulation method, lamp heating method, or far-infrared method can be adopted. In addition, if the terminals of the semiconductor wafer are melt-bonded to the wiring of the circuit board via a solder paste, the semiconductor wafer is cooled in the cooling region 8 1 4 and the semiconductor wafer is fixed on the circuit board. In the cooling zone 8 1 4, (2) (2) 200402811 can be used to circulate low-temperature air. [Summary of the Invention] [Problems to be Solved by the Invention] However, in the air heating of the hot air circulation method, since the thermal conductivity is poor, the heat treatment time of the heating region 8 1 1 to 8 1 3 becomes longer, which hinders productivity. Promotion. In addition, the hot-air circulation method has a large mechanism for hot-air circulation, which hinders downsizing of the device. In addition, since the lamp heating method or the far-infrared method is a spot heating method, a light-shielding structure must be provided between the heating regions 8 1 to 8 1 3. As a result, the device configuration becomes large. In addition, since such a reflow method has a large heat dissipation property, it is difficult to cope with the long processing time of the matching block when the tape substrate 80 1 is heated or cooled in a predetermined block length unit. . In addition, in the heating area 8 1 1 to 8 1 3, since the heat moves, it is difficult to maintain the boundary temperature between the heating area 8 1 1 to 8 1 3. Moreover, in the above-mentioned reflow method, when the production line is stopped for a certain period of time for some reason, the heating process is interrupted by turning off the heating source switch. However, when the production line is stopped for more than a certain period of time, it is difficult to prevent the product from being damaged due to the inability to avoid the product during heating. Also, the heat will be transmitted to the next time before the heating area 8 1 1 The heat-treated tape substrate 801 makes it difficult to perform product quality control. -6- (3) (3) 200402811 Also, when the production line is resumed, although preheating, peak heating and cooling will be applied again, but after the damaged part is sent out of the reflow process, it must be closed. Since the heating source is switched on and off, the waiting time for normal operation after heating or cooling is extended after recovery. In addition, since the low-temperature air is used for cooling in the cooling region 8 1 4 in the reflow process, the cooling treatment time becomes long. Especially when the solder paste is lead-free, it is difficult to prevent thermal oxidation. Accordingly, an object of the present invention is to provide an electronic device manufacturing device, a method for manufacturing an electronic device, and an electronic device that can have a simple structure to easily perform product quality management and prevent damage to the product when a production line is stopped. Manufacturing process. [Means for solving the problem] In order to achieve the above-mentioned object, an electronic device manufacturing apparatus according to an aspect of the present invention includes: a heating means; and the heating means is provided by controlling and providing electronic parts in each circuit block. The distance of the heated region of the continuum in the mounting region increases the temperature of the heated region. This makes it possible to easily control the heating state of the heated processing area while controlling the distance between the heated processing area and the heating means. Even if the heated processing area is stationary during transportation, it is still easy to control the heating processing area. . Therefore, it can control the drastic temperature change in the reflow process, reduce damage to electronic parts or solder materials, and easily avoid thermal damage to the product when the production line is stopped. On the one hand, it can suppress the enlargement of the device, and on the other hand, it can be easily carried out. Quality management for reflow processing. (4) 200402811 Furthermore, the manufacturing apparatus of an electronic device according to an aspect of the present invention is characterized in that: the heating means is to heat-treat the at least a part of the heat-treated region of the continuous body by approaching or contacting the continuous body. The temperature of the area can be used to control the heating state of the heated area by radiant heat or heat conduction, and to prevent the heat generated by the heating means from being dissipated to the surroundings. Therefore, it is possible to control the temperature history with high accuracy in circuit block units, and it is easy to perform quality management. The shielding structure of the hot air circulation method and the light-shielding structure of the lamp heating method or the far-infrared method are not required. . In addition, when the heating means is brought into contact with the heated area of the continuous body, the temperature of the circuit block can be quickly increased, and the work flow time during transportation can be shortened. Therefore, the transfer operation process of the solder coating process or the mounting process can be integrated with the transfer operation process of the reflow process, so that the solder coating process, the mounting process of the electronic parts, and the reflow process can be performed at one time. Moreover, the manufacturing apparatus of an electronic device according to an aspect of the present invention is characterized in that the heating means is contacted from the back side or the front side of the continuous body. Here, the heating means is contacted from the back side of the continuous body, whereby Even if electronic components having different heights are arranged on the continuum, it is possible to efficiently transfer heat to the continuum and enable stable reflow processing. In addition, the heating means is contacted by the surface side of the continuum, whereby the heating means can directly contact the electronic parts, and the heating means is prevented from contacting the continuum. This makes it possible to prevent the continuum from adhering to the heat generating means. In addition, the manufacturing apparatus for an electronic device according to one aspect of the present invention is characterized in that the heating means is to control the temperature of the region to be heated stepwise by controlling a moving speed or a moving position. This makes it possible to control the temperature of the region to be heat-treated stepwise without using a plurality of heating means having different temperatures. Therefore, it is possible to prevent a drastic temperature change during the reflow process in the heat-treated region, to achieve space saving on the one hand, and to suppress deterioration of the quality of the reflow process on the other. In addition, an electronic device manufacturing apparatus according to an aspect of the present invention is characterized in that the heating means is a vertical movement or a horizontal movement. Here, even if the heat-treated area is wide, the temperature distribution of the heat-treated area can be maintained by moving the heating means up and down, and p can increase or decrease the temperature of the heat-treated area in sections. On the one hand, It is possible to prevent the area of the reflow area from being large, and on the other hand, it is possible to quickly release the heating means from the area to be heated. Therefore, even when the conveying system is stopped when a problem occurs in the production line, space saving can be achieved on the one hand, and thermal damage to the heated area can be quickly avoided, and the quality deterioration of the reflow treatment can be suppressed. In addition, the conveying speed of the continuum can be made the same as the moving speed of the heating means by horizontally moving the heating means, so that the heating temperature difference between the stationary positions of the heated area can be reduced, and the heating time can be maintained even if the product distance is different. Uniformity. (6) (6) 200402811 Another feature of the electronic device manufacturing apparatus according to one aspect of the present invention is that the heating means is in contact with the same heat-treated region a plurality of times. In this way, since thermal damage to the area to be heated can be avoided, even if the heating means is removed, the temperature change in the area to be heated can be prevented while the temperature in the area to be heated is easily restored to the original temperature. Space saving can be achieved, and quality deterioration of the reflow process can be suppressed. According to another aspect of the invention, a manufacturing apparatus for an electronic device is characterized in that the heating means has a larger contact area than a solder-coated area coated on the circuit block, and is directed to a plurality of circuit blocks at a time. Increase the temperature. Thereby, the reflow process can be performed for a plurality of circuit blocks at a time when the heated region is brought into contact with the heat generating means, and the reflow process can be performed without changing the heat generating means even if the product pitch is different. In addition, the manufacturing apparatus of an electronic device according to an aspect of the present invention is characterized in that the heating means has a plurality of contact areas having different set temperatures, and the contact areas are sequentially contacted with the heat-treated area to sequentially cause the cover to be heated. The temperature in the heat-treated area rises. Thereby, heat conduction can be used to control the heating state of the heat-treated region ', on the one hand, the heat generated by the heat-generating means can be prevented from being dissipated to the surroundings, and on the other hand, the temperature range of the heat-treated region can be increased stepwise. Therefore, under the shielding structure that does not require the hot air circulation method and the light-shielding structure with the lamp heating method or the far-infrared method, the temperature history can be controlled step by step in the circuit block unit. -10- (7) (7) 200402811 In addition, while achieving space saving, quality management can be easily performed. In addition, when the heating means is sequentially approached to the heated area of the continuum in sequence, the temperature of the circuit block can be raised stepwise and rapidly, on the one hand, it can prevent the drastic temperature change of the heated area, on the other hand, 1 (0) short work flow time during transfer. Therefore, on the one hand, the quality degradation of the reflow process can be suppressed, on the other hand, the transfer work flow of the solder coating process or the installation process can be integrated with the transfer work flow of the reflow process. The solder coating process, the mounting process of electronic parts, and the reflow process can be performed at one time. In addition, the manufacturing apparatus of an electronic device according to an aspect of the present invention is characterized in that the plurality of contact areas having different set temperatures are continuous along the above-mentioned continuous area. In this way, when conveying a continuous body, a plurality of contact areas with different set temperatures can be sequentially contacted with the area to be heated, and stepwise can be performed without moving the heating means. Increase the temperature of the heat-treated area and reflow the heat-treated area at a time Therefore, on the one hand, it is possible to prevent drastic temperature changes in the area being heated during the reflow process, and on the other hand, it is possible to shorten the work flow time of the reflow process, while maintaining the product quality, and performing the reflow process more efficiently. An electronic device manufacturing device according to an aspect of the present invention is characterized in that: a gap is provided between contact areas regardless of the setting temperature. As a result, L rv-which is a boundary between contact areas with different set temperatures can be eliminated. 11-200402811 (δ) The temperature difference is generated, and the temperature history of each heated area is controlled accurately to improve the quality of the reflowed product. In addition, the manufacturing device of the electronic device according to one aspect of the present invention is characterized in that the set temperature is Different contact areas can be moved individually. This allows specific circuit blocks to continue to warm up without interrupting the formal heating of other circuit blocks. Therefore, even if the formal heating is interrupted on the way, it can still be prevented Stopping the preheating on the way can further reduce product defects. The manufacturing device of the sub-device is characterized in that the contact surface of the heating means in contact with the heat-treated region is flat. Thereby, the continuous body can be smoothly conveyed when the continuous body is brought into contact with the contact surface of the heating means. Therefore, when the continuum is brought into contact with the contact surface of the heating means for heating, the movement of the heating means can be omitted, and the work flow time of the reflow process can be shortened. Furthermore, the manufacture of the electronic device according to one aspect of the present invention The device is characterized in that the contact surface of the heating means is provided with a recess corresponding to the arrangement position of the semiconductor wafer in the heat-treated region. This can prevent the heating means from directly contacting the area where the semiconductor wafer is arranged. Therefore, even if Mounting a heat-resistant semiconductor wafer on the continuum can still prevent thermal damage to the semiconductor wafer. Furthermore, an electronic device manufacturing apparatus according to an aspect of the present invention is characterized in that: Between heating means, there are more shielding means that can be inserted and removed. -12- (9) (9) 200402811 In this way, when the heated area is avoided from the heating means, the radiant heat from the heating means can be suppressed to continuously heat the heated area. Even if the avoidance time is lengthened, the heating to the heated area can be suppressed. The processing area causes thermal damage. Furthermore, an electronic device manufacturing apparatus according to an aspect of the present invention further includes: a timing means; the timing means is used to time the heating time of the heated processing area of the heating means; and Means; when the heating time exceeds a predetermined time, the heating means is separated from the heated region. In this way, even if the production line is stopped due to a problem in the production line during the heat treatment of the heated area, thermal damage to the heated area can be quickly avoided, and the quality of the reflow treatment can be prevented. In addition, the manufacturing apparatus for an electronic device according to one aspect of the present invention further includes: a support stand; the support stand is used to support the heating means; and a sliding means; the ghai sliding means is used along the continuous body. The support direction slides the support table in the conveying direction. Thereby, while visually confirming, the position of the heating means can be aligned with the product pitch, and even if the product pitch is different, the heating time can still be maintained. The characteristics of the electronic device manufacturing apparatus according to one aspect of the present invention It is further equipped with a heating assist means for heating the heat-treated region of the continuum from a direction different from the above-mentioned means of heating -13- (10) (10) 200402811. Thereby, even when the heat-treated area is avoided from the heat generating means, the temperature of the heat-treated area can be maintained at a predetermined temperature or more, so that the temperature of the heat-treated area is prevented from being excessively lowered, and product failure is prevented. In addition, the manufacturing apparatus for an electronic device according to an aspect of the present invention further includes: a temperature lowering means for reducing the temperature of the heat-treated region whose temperature is increased by the heat generating means. The temperature of the heated region can be rapidly decreased by heating, and the solder wettability can be improved to stabilize the joint, and the solder can be prevented from thermal oxidation. In addition, the manufacturing apparatus for an electronic device according to an aspect of the present invention is characterized in that the temperature lowering means includes a flat plate member, and the flat plate member has a plurality of coolant blowout holes on a side facing the heat-treated region. Thereby, even if the electronic component is mounted on the heat-treated area, the cooling can be spread all over the corner, and the temperature on the heat-treated area can be efficiently reduced. In addition, the manufacturing apparatus for an electronic device according to an aspect of the present invention is characterized in that the temperature lowering means includes: a covering hole having a rectangular cross section that covers the heat-treated region from above and below in a thickness direction; and A plurality of coolant blow-out holes on the inner surface of the cover hole. Thereby, the heat-treated region can be cooled by the front side and the back side of the heat-treated region, and the temperature of the heat-treated region can be efficiently reduced by -14- (11) (11) 200402811. In addition, the manufacturing apparatus of an electronic device according to an aspect of the present invention is characterized in that the temperature drop section includes a region lower than the temperature of the heating means, and contacts the continuous body through the region with the lower temperature. At least a part of the heated region reduces the temperature of the heated region. Thereby, the cooling state of the heated region can be controlled based on the heat conduction, the cooling efficiency can be improved, and the cooling time can be shortened. Therefore, it is possible to shorten the work program time during cooling, to suppress thermal oxidation of solder, to degrade product quality, and to perform reflow processing efficiently. Furthermore, the manufacturing apparatus of an electronic device according to an aspect of the present invention is characterized in that the lower temperature region has a larger contact area than the solder-coated region applied by the solder coating means, and the temperature lowering means The temperature is raised for a plurality of circuit blocks at a time. In this way, when the heated region is brought into contact with a region having a lower temperature speed than the heating means, a plurality of circuit blocks can be cooled at a time, and the temperature can be lowered without replacement even if the product pitch is different. It is possible to improve the production efficiency by performing a cooling treatment in the case of a heating means. Furthermore, the manufacturing apparatus of an electronic device according to one aspect of the present invention is characterized in that: the lower temperature region is arranged in a front stage or a rear stage of the heating means, or Between the above heating means. In this way, when the continuous body is transported, the heated area can be brought into contact with a region lower than the temperature of the heating means, and the temperature can be fixed at a temperature higher than that of the heating means -15- (12) (12) 200402811 In the case of a low area, the temperature of the area to be heated is lowered, and a cooling process may be performed on a plurality of areas to be heated at one time. Therefore, the time of the work flow during cooling can be shortened, thermal oxidation of the solder can be suppressed, product quality can be prevented from being deteriorated, and reflow processing can be performed efficiently. In addition, in the case where a region lower than the temperature of the heating means is arranged at the front row of the heating means or between the heating means, the heat generated by the self-heating means can be prevented from being transmitted to the area not in contact with the heating means, and the accuracy can be good. The temperature history of the heat-treated area can be maintained in order to improve the quality of the reflowed product. In addition, a method for manufacturing an electronic device according to an aspect of the present invention is characterized in that the heated portion is heated by controlling a distance between a heated region and a heating means of a continuum provided with an electronic component mounting region in each circuit block. The temperature in the processing area rises. This makes it possible to easily control the heating state of the heated processing area while controlling the distance between the heated processing area and the heating means. Even if the heated processing area is stationary during transportation, the temperature of the heated processing area can be easily controlled. . Therefore, the time of the reflow process can be shortened, and drastic temperature changes in the reflow process can be suppressed, and damage to electronic parts or solder materials can be reduced. On the one hand, the quality deterioration of the reflow process can be suppressed, and on the other hand, the reflow can be performed efficiently. deal with. Furthermore, a method of manufacturing an electronic device according to an aspect of the present invention is characterized in that the temperature of the heat-treated region is raised by approaching or contacting at least a part of the heat-treated region of the continuous body. -16- (13) (13) 200402811 In this way, the heating state of the heated area can be controlled based on radiant heat or heat conduction, and the heat generated by the heat generating means is prevented from being dissipated to the surroundings. Therefore, it is possible to control the temperature history with high accuracy in the unit of circuit block, and it is easy to perform quality management. The shielding structure of the hot air circulation method or the light-shielding structure of the lamp heating method or the far-infrared method is not required, so that space saving can be achieved. . In addition, when the heating means is brought into contact with the heated region of the continuum, the temperature of the circuit block can be quickly increased, and the time of the work flow during transportation can be shortened. Therefore, the transfer operation process of the solder coating process or the mounting process can be integrated with the transfer operation process of the reflow process, and the solder coating process, the mounting process of the electronic parts, and the reflow process can be performed at one time. A method of manufacturing an electronic device according to an aspect of the present invention is characterized in that a plurality of circuit blocks are brought into contact with the heat generating means at one time. This makes it possible to perform a reflow process on a plurality of circuit blocks at a time when the heated region is brought into contact with the heating means, thereby improving the production efficiency. Furthermore, a method for manufacturing an electronic device according to an aspect of the present invention is characterized in that the same circuit block is brought into contact with the heating means a plurality of times. Thereby, even if the heat-treated region can be separated from the heating means in order to avoid thermal damage, it can still prevent the heated region from undergoing drastic temperature changes, and it can easily restore the heated region to the original temperature, and can achieve Space saving, on the other hand, can suppress the deterioration of the quality of the reflow process. -17- (14) (14) 200402811 The manufacturing method of an electronic device according to an aspect of the present invention includes: a process of transferring the first heated region of the continuum to the heating means; and A process of raising the temperature of the first heat-treated region by bringing the first heat-treated region conveyed onto the heat-generating means into contact with the heat-generating means; and transporting the second heat-treated region of the continuum to A process on the heat-generating means; and a process of raising the temperature of the second heat-treated region by bringing the second heat-treated region conveyed onto the heat-generating means into contact with the heat-generating means. Thereby, when the continuum is conveyed on the heat generating means, the area to be heat-treated is brought into contact with the heat generating means, so that the working process time of the reflow treatment can be shortened and the production efficiency can be improved. In addition, a method of manufacturing an electronic device according to an aspect of the present invention includes: a process of transferring the heated region of the continuous body to the heating means; and stepwise approaching the heating means to the heating means. A process in which the heated region on the heating means gradually raises the temperature of the heated region. This allows the temperature of the area to be heated to be increased in stages when heating means with a constant temperature are used. On the one hand, it is possible to achieve space-saving -18- (15) (15) 200402811. On the other hand, it can Suppresses thermal damage from reflow treatment. Furthermore, a method of manufacturing an electronic device according to an aspect of the present invention includes a process of removing the heat generating means from the heat-treated region after or during the heating of the heat-treated region. By this means, 'even if the conveyance system is stopped during the heat treatment of the area to be heated', the thermal damage to the area to be heated can be quickly avoided, and the quality of the reflow treatment can be prevented. Furthermore, a method of manufacturing an electronic device according to an aspect of the present invention includes a process of inserting a heat shield between the heat-generating means to be detached and the heat-treated region. This way, as long as a heat shield is inserted between the heating means and the heated area to separate the heating means from the heated area, thermal damage to the heated area can be prevented. On the one hand, space saving can be achieved, and the other The aspect can suppress the quality deterioration of the reflow process. In addition, a method of manufacturing an electronic device according to an aspect of the present invention includes a process of re-contacting the heat generating means separated from the heat-treated region to the heat-treated region. With this, even if the heating means is removed in order to avoid thermal damage to the heat-treated area, it is possible to prevent the heat-treated area from returning to the original temperature while avoiding drastic temperature changes. Moreover, the manufacturing method of the electronic device which concerns on one aspect of this invention is equipped with the said heating means which isolate | separate from the said to-be-heated area | region --- (16) (16) 200402811 degree contact with the to-be-heated process The process of blowing hot air to the heated area before the area. Thereby, even if the heat-treated region is separated from the heat generating means, the temperature of the heat-treated region can be maintained at a predetermined temperature or more, so that product defects can be prevented. In addition, a method of manufacturing an electronic device according to an aspect of the present invention includes: transferring the first heat-treated region of the continuous body to a first heating means; and transferring the second heat-treated region of the continuous body. To the second heat generating means having a higher temperature than the first heat generating means; and contacting the i-th heat-treated region transferred to the first heat generating means with the first heat generating means to make the first 1 The temperature of the heat-treated region rises, and the temperature of the second heat-treated region is increased to a ratio by contacting the second heat-treated region conveyed to the second heat-generating means with the second heat-generating means. The process in which the temperature of the first heat-treated region is still higher. Thereby, when the continuous body is conveyed, the temperature can be raised stepwise for a plurality of heated areas at one time, on the one hand, the thermal damage of the reflow treatment can be suppressed, and on the other hand, the reflow processing can be accelerated. The manufacturing method of an electronic device according to an aspect of the present invention is characterized in that the first heating means and the second heating means are arranged along the conveyance direction of the continuous body in such a manner that the first heating means can form a front stage. Arrange configuration. In this way, when the continuum is transported, a plurality of -20 are added at a time-(17) (17) 200402811: The heat treatment area is contacted with a plurality of heating means with different set temperatures, and the heating means can be moved without moving. Next, the temperature of the plurality of heat-treated regions is increased stepwise. @ 此 ’can prevent the rapid temperature change in the S area to be heated during the reflow process, on the other hand, it can shorten the work flow time of the reflow process, while maintaining the product quality, and efficiently perform the reflow process. A method of manufacturing an electronic device according to an aspect of the present invention is characterized in that Φ includes: after or during heating of the heat-treated region of the first and second heating means, contacting the first heating means with A process of removing the second heating means from the second heat-treated region under the first heat-treated region. Wrong this way "Even if the conveying system is stopped during the heat treatment of a plurality of heat-treated areas, the first heat-treated area can be kept at a constant temperature, and the heat caused by the second heat-treated area can be quickly avoided. Damage 'and the quality of the reflow process can be suppressed even if the heating state of the heated region is different. Furthermore, a method of manufacturing an electronic device according to an aspect of the present invention is characterized by including a process of re-contacting the second heat-generating means separated from the second heat-treated region to the second heat-treated region. With this, even if the second heating means is separated from the second heat-treated region in order to avoid thermal damage to the second heat-treated region, the first heat-treated region can be maintained without affecting the temperature of the first heat-treated region. 2 was -21-(18) 200402811 The heating treatment area was restored to the original temperature, and the reflow treatment could be started again without the occurrence of production. According to another aspect of the present invention, there is provided a method for manufacturing an electronic device, which comprises blowing the second heat-treated region to the second heat-treated region before bringing the heating means detached from the second heat-treated region into contact with the second heat-treated region again. Process. Wrongly, even in order to avoid injury to the second heat-treated region, the second heat-treated region is separated from the second heat-generating means so that the temperature of the second heat-treated region is maintained at a predetermined level so as to cause product failure. In addition, a method of manufacturing an electronic device according to an aspect of the present invention includes a process of sliding the heat-receiving support table along the conveyance direction of the continuum by the position of the heat-generating means corresponding to a product room. This allows the product pitch of the heating means to be visually confirmed, and the uniformity can be maintained even if the product pitch is different. Furthermore, a method of manufacturing an electronic device according to an aspect of the present invention includes a process of lowering a heated temperature which is increased by the above-mentioned heating means. Thereby, the temperature of the area to be heated which is increased by the heating means can be rapidly decreased, the solder wettability can be improved, and at the same time, the heated area can be prevented from being maintained at a high temperature for a long time, which can prevent solder thermal oxidation. The defective product is characterized by the second round of 'heat damage caused by hot air, and it is still available. The characteristic of prevention is that the support position of the method and means is aligned with the thermal time. 22- (19) (19) 200402811 Another feature of the method for manufacturing an electronic device according to the present invention is that a region lower than the temperature of the heating means is brought into contact with the temperature of the heating means. The temperature of the heat-treated region is reduced by at least ~ part of the heat-treated region rising. Thereby, it is possible to control the cooling state of the heat-treated region by heat conduction, improve the cooling efficiency, and shorten the cooling time. Therefore, it is possible to shorten the work program time during cooling, suppress the thermal oxidation of the solder, prevent the deterioration of the product, and perform the reflow process efficiently. Furthermore, a method for manufacturing an electronic device according to an aspect of the present invention is characterized in that the lower temperature region is arranged in a front or rear stage of the heat generating means or between the heat generating means. In this case, while the continuum is being conveyed, the area to be heated can be brought into contact with an area lower than the temperature of the heat generating means, and the cooling process at the time of reflux can be performed efficiently. Also, in the case where a region lower than the temperature of the heating means is arranged side by side in front of the heating means or between the heating means, the heat generated by the heating means is blocked in the realm of the heating means, and the boundary temperature of the heating means is eliminated. , So that the quality of the product can be improved. The method of manufacturing an electronic device according to an aspect of the present invention is characterized in that the temperature of the heat-treated region is caused by blowing a gas to one or both sides of the heat-treated region whose temperature is increased by the heat generating means. decline. Thereby, even if the electronic component is installed on the area to be heated, the cooling can be spread all over the corner, and the temperature in the area to be heated can be efficiently lowered -23-(20) (20) 200402811. In addition, a manufacturing program for an electronic device according to an aspect of the present invention is characterized in that a computer executes the following steps. This step is performed by controlling heating of a continuum provided with an electronic component mounting area in each circuit block. The distance between the region and the heating means increases the temperature of the heat-treated region. Thereby, the distance between the heated area of the continuum and the heating means can be appropriately controlled under the manufacturing program in which the electronic device is installed, so that the electronic device can be efficiently manufactured while suppressing thermal damage during reflow. [Embodiment] Hereinafter, a manufacturing apparatus and a manufacturing method of an electronic device according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a method for manufacturing an electronic device according to a first embodiment of the present invention. In FIG. 1, between the loader 21 and the unloader 25, the solder coating area 22, the mounting area 23, and the reflow area 24 are arranged along the transport direction of the tape substrate 31. On the other hand, on the tape substrate 31, an electronic component mounting area is provided in each of the circuit blocks B 1 1 to B 1 3, and a circuit board is provided in each of the circuit blocks B 1 1 to B 13 31a, 31b. Wirings 32a to 32c are provided on each of the circuit boards 3U to 31b, and an insulating film 3 3a to 3c is formed on each of the wirings 32a to 32c so that the terminal portions of the wirings 32a to 32c can be exposed. In addition, a reel base for connecting circuit boards 3 1 a to 3 1 c of a predetermined length -24- (21) 200402811 board 3] will be erected between the take-up reel 2 1 a and the take-up reel 2 5 a. In addition, according to each transfer operation flow of the tape substrate 31, the unsoldered coating area of the tape substrate 31 is transferred to the solder coating area 22 provided between the loader 21 and the unloader 25. The solder coating completed area of the tape substrate 31 will be transferred to the mounting area 23 arranged in parallel with the solder coating area 22, and the installation completed area of the tape substrate 31 will be transferred to the parallel installation area 23 Reflow area 2 4.

另外，在焊錫塗佈區域22中，焊錫膏34a會被印刷 於電路基板31a上，在安裝區域23中、半導體晶片35b 會被安裝於印刷有焊錫膏34b的電路基板 31b上，在回 流區域24中，藉由安裝有半導體晶片35c之電路基板 3 1 c的回流處理，半導體晶片35c會經由焊錫膏34c來固 定於電路基板3 1 c上。In the solder coating area 22, the solder paste 34a is printed on the circuit substrate 31a. In the mounting area 23, the semiconductor wafer 35b is mounted on the circuit substrate 31b printed with the solder paste 34b. In the reflow area 24, During the reflow process of the circuit substrate 3 1 c on which the semiconductor wafer 35 c is mounted, the semiconductor wafer 35 c is fixed to the circuit substrate 3 1 c via the solder paste 34 c.

再者，若捲帶基板3 1的所有電路區塊B 1 1〜B 1 3的 焊錫塗佈處理，安裝處理及回流處理終了，則於切斷區域 26中，捲帶基板31會在每個電路區塊B11〜B13被切斷 。又，被切斷的各電路區塊B 1 1〜B 1 3會移至樹脂封裝區 域27，例如藉由在半導體晶片3 5 c的周圍塗佈封裝樹脂 3 6 c，而使能夠樹脂封裝電路區塊B 1 3。 藉此，可在捲出捲軸2 1 a與捲取捲軸2 5 a之間，僅搬 送捲帶基板3 1 —次，便能完成電路基板3 1 a〜3 1 c的焊錫 塗佈處理，安裝處理及回流處理，且可同時進行不同電路 基板3 1 a〜3 1 c的焊錫塗佈處理，安裝處理及回流處理， 進而能夠提高生産効率。 -25- (22) 200402811 圖2是表示本發明之第2實施形態的電 裝置的槪略構成立體圖。 在圖2中，設有：施以預熱的預熱區塊 峰値熱的正式加熱區塊11 2，以及使被施以 熱處理體的温度下降的冷卻區塊1 1 3。例如 、安裝過程後進行的回流過程中，對連接圖 長的被加熱處理體（電路基板1 0 〇的連續 】〇 〇 )進行加熱處理或冷卻處理。 預熱區塊I ] 1是例如由金屬或陶瓷等所 未圖示的驅動機構來自由移動於箭頭a，b 預熱區塊1 1 1是慢慢地接近捲帶基板1 00來 詳細說明如後述。 正式加熱區塊1 1 2是例如由金屬或陶瓷 接近配置於預熱區塊1 1 1。並且，正式加熱 用未圖示的驅動機構來自由移動於箭頭a， ，正式加熱區塊1 12是接觸於捲帶基板1〇〇 ’其詳細說明如後述。 冷卻區塊1 1 3是例如由金屬或陶瓷等所 未圖示的驅動機構來自由移動於箭頭c，d 冷卻區塊113具有：由厚度方向的上下來覆 板1 1 0的覆夾孔1 1 4 (剖面呈〕字形状）。 孔1 1 4的面設有複數個冷卻劑的吹出孔1 1 5 卻劑而言，例如可使用空氣、氧氣、氮氣、 或氟代烴等。 子裝置的製造 111，及施以 峰値熱的被加 ，在錫焊過程 4之預定區塊 體（捲帶基板 構成，且利用 方向。並且， 施以預熱，其 等所構成，且 區塊1 1 2會利 b方向。而且 來賦予峰値熱 構成，且利用 方向。並且， 蓋夾入捲帶基 而且，在覆夾 。在此’就冷 二氧化碳、氦 -26- (23) (23)200402811 在此，捲帶基板]0 0，如後述的圖4所示，連接預定 區塊長的電路基板10 1。並且，在後述圖4的電路基板 1 〇 1上，會在回流過程前的錫焊過程中，在配線1 〇 2上附 著焊錫膏1 04。並且，亦可在配線I 0 2上，利用轉印來附 著ACF等的黏著劑。圖中，元件符號1 04爲絕緣膜。而 且，在錫焊過程後的安裝過程中，會在電路基板1 01上經 由焊錫膏104來安裝半導體晶片105。 又，基於某種原因，例如從圖I所述的裝載機2 1至 卸載機2 5間的生產線停止時，在預熱區塊1 1 1或正式加 熱區塊1 1 2的加熱處理中，預熱區塊1 1 1或正式加熱區塊 1 1 2會自捲帶基板1 00離開，而使能夠避免對捲帶基板 1 〇 〇加熱至所需以上。 圖3、4是表示圖2的回流處理。圖5是表示圖2的 回流處理的温度履歷。 在圖3〜5中’若完成錫焊過程及安裝過程的捲帶基 板1 〇 〇前進至回流過程，則如圖3 ( a)所示，預熱區塊1 1 1 會於箭頭a方向上升一段，而接近捲帶基板I 〇 〇。此刻， 正式加熱區塊1 1 2會在定位待機。 又，預熱區塊1 1 1會以預定時間來接近圖4所示之捲 帶基板1 0 〇的預定區塊長的電路基板1 0 1，而進行加熱處 理。藉此，在電路基板1 〇 1中，賦予預熱①。此預熱①是 形成圖5之①的實線所示的温度梯度。 若預熱區塊π 1之圖3(a)的加熱處理終了，則如圖3( b)所示，預熱區塊111會更於箭頭a方向上升一_段，而來 -27- (24) 200402811 1 0 ]進行 ，如圖4 實線所示 ，則如圖 —段，而 板101進 中，如圖 的實線所 ①〜③賦 定位待機 基板101 則如圖3 ( 基板100 2所示的 接觸於捲 熱處理。 値熱④。 度。在此 溶融，而 配線102 接近捲帶基板100，與上述同樣的，對電路基板 預定時間的加熱處理。藉此，在電路基板101中 所示，賦予預熱②。此預熱②是形成圖5之②的 的温度梯度。 若預熱區塊111之圖3(b)的加熱處理終了 3 ( c)所示，預熱區塊ill會更於箭頭a方向上升 來接近捲帶基板100，與上述同樣的，對電路基: 行預定時間的加熱處理。藉此，在電路基板101 4所示，賦予預熱⑧。此預熱③是形成圖5之③ 示的温度梯度。並且，藉預熱區塊111，當預熱 予電路基板1 〇 1時，由於正式加熱區塊11 2會在 ’因此可防止來自正式加熱區塊11 2的熱對電路 進成影響。 若預熱區塊111之圖3(C)的加熱處理終了， d)所示，預熱區塊111會回到定位。此刻，捲帶 會只以電路基板10.1的預定區塊長度來搬送於圖 虛線箭頭方向。又，正式加熱區塊112會上升而 帶基板1 0 0，對電路基板1 〇 1進行預定時間的加 藉此，在電路基板1 〇 1中，如圖4所示，賦予峰 此峰値熱④是形成圖5之④的實線所示的温度梯 的峰値熱④爲焊錫融點+ α ，因此焊錫膏1 〇4會 使得半導體晶片1 〇5會接合於電路基板10 1上的 若正式加熱區塊112之圖3(d)的加熱處理終了 ’則如 (25) (25)200402811 圖3 (e )所示，正式加熱區塊1 ] 2會下降於箭頭b方向， 而回到定位，且冷卻區塊1 1 3會自圖3 ( a)所示的定位移動 於箭頭c方向’而使能夠藉由覆夾孔1 1 4來從上下夾入基 板1 0 0。又，來自設於覆夾孔1 1 4的內面之複數個冷卻劑 吹出孔1 1 5的冷卻劑會從電路基板1 〇 1的上下面吹出’而 來冷卻電路基板1 〇 1。 藉此，電路基板1 〇 1會如圖4的⑤所示那樣被冷卻。 此冷卻⑤是形成圖5之⑤的實線所示的温度梯度。如此一 來，在冷卻電路基板1 〇I下，半導體晶片1 05會經由配線 1 〇 2來固定於電路基板1 0 1。若對電路基板1 01之預定時 間的冷卻終了，則冷卻區塊1 1 3會由圖3 (e)的狀態來移動 於箭頭d方向，回到圖3(a)的定位。 如此一'來，若依次對捲帶基板1 〇 〇之預定區塊長的電 路基板1 0 1施以預熱、峰値熱及冷卻，而完成對某電路基 板1 0 1的回流處理的話，則捲帶基板1 00會僅被搬送電路 基板101的預定區塊長，而如圖3(a)〜（e)所示，依次賦 予預熱、峰値熱及冷卻，對下個電路基板1 0 1進行回流處 理。 又，基於某種原因，例如從圖1所述的裝載機21至 卸載機2 5間的生產線停止時，在預熱區塊1 1 1或正式加 熱區塊1 1 2的加熱處理中，預熱區塊1 1 1或正式加熱區塊 1 1 2會自捲帶基板100離開。藉此，可避免對捲帶基板 1〇〇加熱至所需以上。 另一方面，在生產線恢復時，會再度施以預熱、峰値 (26) (26)200402811 熱及冷卻。此刻，當捲帶基板]〇 〇之預定區塊長的電路基 板1 〇 1的温度，分別如圖5的虛線所示①〜④那樣降低時 ，首先會分別對應於①〜③來慢慢地使預熱區塊1 Π上升 ，使捲帶基板1 0 〇之預定區塊長的電路基板]〇 1的温度上 升至圖5的實線所示的位置。其次，可使正式加熱區塊 ]1 2接觸於電路基板1 0 1，而來施以峰値熱。藉此，在生 產線恢復後，不會對製品造成損傷，而能夠繼續進行回流 處理。 如此一來，在上述第6實施形態中，可藉由上升移動 來使預熱區塊1 1 1慢慢地由定位接近至捲帶基板1 0 0之預 定區塊長的電路基板1 〇 1，而於施以預熱後，回到定位， 然後使接近配置於預熱區塊1〗1的正式加熱區塊11 2接觸 於以預定的作業流程而搬送之施以預熱的電路基板1 0 1， 而於施以峰値熱後，回到定位，然後使冷卻區塊1 1 3接近 施以峰値熱的電路基板1 0 1，而於冷卻電路基板1 〇 1後， 回到定位。 藉此，因可消除預熱區塊111與正式加熱區塊112之 間的境界温度，所以能夠容易進行製品的品質管理。又’ 由於不需要以往的燈加熱方式或遠紅外線方式遮光構造’ 因此可謀求裝置構成的簡素化。 又，基於某種原因，從圖1所述的裝載機21至卸載 機2 5間的生產線停止時，在預熱區塊1 1 1或正式加熱區 塊1 1 2的加熱處理中，預熱區塊1 1 1或正式加熱區塊1 1 2 會自捲帶基板1 〇 〇離開，所以可避免對捲帶基板1 0 0加熱 i ,Η -30- (27) (27)200402811 至所需以上，且能夠容易進行製品的品質管理。 另一方面，在生產線恢復時，當捲帶基板1 00之預定 區塊長的電路基板1 0 1的温度分別如圖5的虛線所示①〜 ④那樣降低時，首先會分別對應於①〜③來慢慢地使預熱 區塊1 1 1上升，使捲帶基板1 00之預定區塊長的電路基板 1 〇 1的温度上升至圖5的實線所示的位置，然後使正式加 熱區塊1 1 2接觸於電路基板1 01，而再度施以峰値熱，且 利用冷卻區塊1 1 3再度使施以峰値熱的電路基板1 0 1冷卻 ，因此不會對製品造成損傷，而能夠繼續進行回流處理。 又，在生產線恢復時，由於會再度施以預熱、峰値熱 及冷卻，因此可大幅度地縮短恢復.後之加熱處理或冷卻處 理的等待時間。 又，由於可利用來自冷卻區塊1 I 3的覆夾孔 Π 4的 複數個冷卻劑吹出孔1 1 5的冷卻劑來冷卻施以峰値熱的電 路基板1 〇 1，因此能夠提高電路基板1 〇 1的冷卻効率，藉 此可縮短冷卻處理時間，特別是在焊錫膏1 04爲無鉛時， 可容易防止熱氧化。 又，本實施形態中，雖是針對使預熱區塊1 1 1段階性 上升來施以預熱時，但並非只限於此例’亦可使線性上升 來施以預熱。 又，本實施形態中，雖是針對使預熱區塊1 1 1及正式 加熱區塊1 1 2由捲帶基板1 〇〇的下面側來上升移動時’ 但並非只限於此例，亦可使由捲帶基板100的上面側來下 降移動。又，本實施形態中，雖是針對將具有剖面呈〕字 (28) (28)200402811 形状的複數個冷卻劑吹出孔】]5的覆夾孔1 1 4設置於冷卻 區塊U 3時，但並非只限於此例，亦可使冷卻區塊1 ] 3形 成平板状， 且使於朝向捲帶基板1 〇〇的面側設置冷卻 劑吹出孔1 1 5。又，本實施形態中，雖是針對預熱區塊 1 1〗爲1個時，但並非只限於此例，預熱區塊1 1 1亦可爲 複數個。 圖6是表示本發明之第7實施形態的電子裝置的製造 裝置的槪略構成立體圖。 圖6中，設有使施以熱的加熱區塊2 1 1及被施以熱的 被加熱處理體的温度下降之冷卻區塊2 1 3。例如在錫焊過 程、安裝過程後所進行的回流過程中，對連接預定區塊長 的被加熱處理體（電路基板）的連續體（捲帶基板200) 進行加熱處理或冷卻處理。在此，就連接於捲帶基板200 的電路基板而言，例如可使用與圖4同樣的構成。 加熱區塊2 1 1是例如由金屬或陶瓷等所構成，且藉由 未圖示的驅動機構來自由移動於箭頭a，b方向。加熱區 塊2 1 1是慢慢地接近捲帶基板200來施以預熱，且接觸於 捲帶基板2 0 0來施以峰値熱，其詳細說明如後述。 冷卻區塊2 1 3是例如由金屬或陶瓷等所構成，且藉由 未圖不的驅動機構來自由移動於箭頭d方向。冷卻區 塊213具有：由厚度方向的上下來覆蓋夾入捲帶基板200 的覆夾孔2 1 4 (剖面呈〕字形状）。並且，在覆夾孔2 14 的內面設有複數個冷卻劑吹出孔2 1 5。 圖7是表示圖6之回流處理的側面圖。 -32- (29) 200402811 圖7中，若完成錫焊過程及安裝過程的捲帶基板2 0 0 前進至回流過程，則如圖7(a)所示，加熱區塊2] 1會從虛 線所示的初期位置上升一段於箭頭a方向，而來接近捲帶 基板2 0 0。此刻，加熱區塊2 1 1是以預定時間來接近捲帶 基板2〇0之預定區塊長的電路基板，而進行加熱處理。藉 此，在電路基板中，會施以與圖4同樣的預熱①。此預熱 ①可形成圖5之①的實線所示的温度梯度。 若加熱區塊21 1之圖7(a)的加熱處理終了，則如圖7( b)所示，加熱區塊會更上升一段於箭頭a方向，而來 接近捲帶基板200，與上述同樣的，對電路基板進行預定 時間的加熱處理。藉此，在電路基板中，施以與圖4同樣 的預熱②。此預熱②可形成圖5之②的實線所示的温度梯 度。 若加熱區塊2 1 1之圖7 (b )的加熱處理終了，則如圖 7(c)所示，加熱區塊21 1會更上升一段於箭頭a方向，而 來接近捲帶基板200，與上述同樣的，對電路基板進行預 定時間的加熱處理。藉此，在電路基板中，施以與圖4同 樣的預熱③。此預熱③可形成圖5之③的實線所示的温度 梯度。 若加熱區塊21 1之圖7(c)的加熱處理終了，則如圖7( d)所示，加熱區塊2 1 1會更上升一段於箭頭a方向，而來 接觸於捲帶基板200，與上述同樣的，對電路基板進行預 定時間的加熱處理。藉此，在電路基板中，施以與圖4同 樣的峰値熱④。此峰値熱④可形成圖5之④的實線所示的 292 - 33 - (30) (30)200402811 温度梯度。在此的峰値熱④爲焊錫融點+ ^ ’因此焊錫膏 會溶融，而使得半導體晶片會接合於電路基板上的配線。 若加熱區塊2 1 1之圖7 ( d )的加熱處理終了，則如圖 7 (e )所示，加熱區塊21 1會下降於箭頭b方向，而回到初 期位置，且冷卻區塊213會自圖7(a)所示的初期位置移動 於箭頭c方向，而使能夠藉由覆夾孔2 1 4來從上下覆蓋夾 入基板200。又，來自設於覆夾孔2]4的內面之複數個冷 卻劑吹出孔2 1 5的冷卻劑會從電路基板的上下面吹出，而 來冷卻電路基板。 藉此，電路基板會如圖4的⑤所示那樣被冷卻。此冷 卻⑤是形成圖5之⑤的實線所示的温度梯度。如此一來， 在冷卻電路基板下，半導體晶片會經由配線來固定於電路 基板，若對電路基板之預定時間的冷卻終了，則冷卻區塊 2 1 3會由圖7 (e)的狀態來移動於箭頭d方向，回到圖7 ( a) 的初期位置。 如此一來，若依次對捲帶基板200之預定區塊長的電 路基板施以預熱、峰値熱及冷卻，而完成對某電路基板的 回流處理的話，則捲帶基板200會僅被搬送電路基板的預 定區塊長，而如圖7(a)〜（e)所示，依次賦予預熱、峰値 熱及冷卻，對下個電路基板進行回流處理。 又，基於某種原因，例如從圖1所述的裝載機2 1至 卸載機2 5間的生產線停止時，在預熱區塊2 1 1的加熱處 理中，加熱區塊211會自捲帶基板200離開。藉此，可避 免對捲帶基板200加熱至所需以上。Furthermore, if the solder coating process, the mounting process, and the reflow process of all the circuit blocks B 1 1 to B 1 3 of the tape substrate 31 are completed, in the cutting area 26, the tape substrate 31 will be The circuit blocks B11 to B13 are cut off. In addition, each of the cut circuit blocks B 1 1 to B 1 3 is moved to the resin sealing area 27. For example, by encapsulating the resin 3 6 c around the semiconductor wafer 3 5 c, the circuit can be resin-sealed. Block B 1 3. Thereby, between the take-up reel 2 1 a and the take-up reel 2 5 a, only the tape substrate 3 1 can be transported, and the solder coating process of the circuit substrate 3 1 a to 3 1 c can be completed and installed. Processing and reflow processing, and can simultaneously perform solder coating processing, mounting processing and reflow processing on different circuit substrates 3 1 a to 3 1 c, thereby improving production efficiency. -25- (22) 200402811 Fig. 2 is a perspective view showing a schematic configuration of an electric device according to a second embodiment of the present invention. In FIG. 2, a preheating block to which preheating is performed is provided, and a formal heating block 11 2 is provided, and a cooling block 1 1 3 is provided to lower the temperature of the heat-treated body. For example, during the reflow process after the installation process, the heat-treated body (continuous circuit board 100) of the connection pattern length is subjected to heat treatment or cooling treatment. The preheating block I] 1 is driven by an unillustrated driving mechanism, such as metal or ceramic, and is moved freely by the arrow a, b. The preheating block 1 1 1 is slowly approaching the tape substrate 100 to explain in detail such as Described later. The main heating block 1 1 2 is, for example, arranged close to the preheating block 1 1 1 by a metal or ceramic. In addition, a driving mechanism (not shown) for official heating is freely moved by arrow a, and the main heating block 112 is in contact with the tape substrate 100 '. The detailed description thereof will be described later. The cooling block 1 1 3 is driven by an unillustrated driving mechanism such as metal or ceramic. The cooling block 113 has a clamping hole 1 for covering the plate 1 1 0 in the thickness direction. 1 4 (cross section). A plurality of coolant blow-out holes 1 1 5 are provided on the surface of the holes 1 1 4. For example, air, oxygen, nitrogen, or a fluorinated hydrocarbon can be used. The manufacturing of the sub-device 111 and the addition of the peak heat are performed in the predetermined block body of the soldering process 4 (the tape substrate is formed and used in the direction. Also, the preheating is performed, the other parts are formed, and the block 1 is 1 2 will be in the b direction. Also, it will give the peak heat structure and use the direction. Also, the cover is clamped into the tape base, and the cover is clamped. Here's the cold carbon dioxide, helium-26- (23) (23) 200402811 Here, the tape substrate] 0 0 is connected to the circuit substrate 101 of a predetermined block length as shown in FIG. 4 described later. In addition, the circuit substrate 1 01 shown in FIG. In the soldering process, a solder paste 104 is attached to the wiring 102. Furthermore, an adhesive such as ACF can be attached to the wiring I02 by transfer. In the figure, the element symbol 104 is an insulating film. In the mounting process after the soldering process, the semiconductor wafer 105 is mounted on the circuit board 101 via the solder paste 104. For some reason, for example, from the loader 21 to the unloader described in FIG. When the production line between 2 and 5 stops, the preheating block 1 1 1 or the formal heating block 1 1 In the heating process of 2, the pre-heating block 11 or the formal heating block 1 12 will leave the tape substrate 100, so that the tape substrate 100 can be prevented from being heated to more than necessary. Figure 3, 4 is the reflow process shown in Fig. 2. Fig. 5 is the temperature history of the reflow process shown in Fig. 2. In Figs. 3 to 5 'If the tape substrate 100 which has completed the soldering process and the mounting process is advanced to the reflow process, then As shown in Fig. 3 (a), the pre-heating block 1 1 1 will rise for a period in the direction of arrow a, and will be close to the tape substrate I 00. At this moment, the formal heating block 1 1 2 will be in standby for positioning. The thermal block 1 1 1 will approach the circuit board 1 0 1 with a predetermined block length of the tape substrate 10 as shown in FIG. 4 for a predetermined time, and perform heat treatment. As a result, in the circuit board 1 0 Preheating ① is given. This preheating ① is to form the temperature gradient shown by the solid line in ① of Fig. 5. If the preheating process of Fig. 3 (a) of the preheating block π 1 is completed, it is as shown in Fig. 3 (b). As shown, the pre-heating block 111 will rise one more step in the direction of arrow a, and -27- (24) 200402811 1 0], as shown by the solid line in Figure 4, Segment, while the board 101 enters, as shown by the solid lines ① ~ ③, the positioning standby substrate 101 is as shown in FIG. 3 (the substrate 100 is exposed to the coil heat treatment. 値 heat ④. Degrees. Melting here, and wiring 102 is close to the reel substrate 100, and the circuit substrate is heated for a predetermined time in the same manner as described above. As a result, preheating ② is given to the circuit substrate 101. This preheating ② is the temperature forming ② in FIG. 5 Gradient: If the heating process in Fig. 3 (b) of the preheating block 111 is finished as shown in 3 (c), the preheating block ill will rise in the direction of the arrow a to approach the tape substrate 100, as described above. Circuit-based: heat treatment for a predetermined time. As a result, a preheating coil is provided on the circuit board 1014. This preheating ③ forms a temperature gradient shown in ③ of FIG. 5. In addition, by using the preheating block 111, when the circuit substrate 101 is preheated, since the main heating block 11 2 is at ′, the heat from the main heating block 112 can be prevented from affecting the circuit. If the heating process in FIG. 3 (C) of the preheating block 111 is finished, as shown in d), the preheating block 111 will return to the positioning. At this point, the tape will be transported only in the direction of the dotted arrow in the figure for the predetermined block length of the circuit substrate 10.1. In addition, the formal heating block 112 rises with the substrate 100, and the circuit substrate 100 is added for a predetermined time. In the circuit substrate 100, as shown in FIG. 4, peak heat is given to the peak. ④ is the peak heat that forms the temperature ladder shown by the solid line in ④ of Fig. 5 ④ is the solder melting point + α, so the solder paste 〇4 will cause the semiconductor wafer 105 to be bonded to the circuit substrate 101. Figure 3 (d) of the formal heating block 112 is finished. As shown in (25) (25) 200402811 Figure 3 (e), the formal heating block 1] 2 will drop in the direction of arrow b and return to Positioning, and the cooling block 1 1 3 will move from the positioning shown in FIG. 3 (a) to the direction of the arrow c, so that the substrate 100 can be clamped from above and below by covering the holes 1 1 4. In addition, the coolant from the plurality of coolant blow-out holes 1 15 provided in the inner surface of the covering hole 1 14 is blown out from the upper and lower surfaces of the circuit board 101 to cool the circuit board 101. Thereby, the circuit board 101 is cooled as shown by ⑤ in FIG. 4. This cooling ⑤ forms a temperature gradient shown by the solid line of ⑤ in FIG. 5. In this way, when the circuit board 100 is cooled, the semiconductor wafer 105 is fixed to the circuit board 101 via the wiring 102. When the cooling of the circuit board 101 for a predetermined time has ended, the cooling block 1 1 3 will move from the state of FIG. 3 (e) to the direction of the arrow d and return to the positioning of FIG. 3 (a). In this way, if the circuit board 101 of a predetermined block length of the tape substrate 100 is sequentially subjected to preheating, peak heating, and cooling to complete the reflow process of a circuit board 101, Then, the tape substrate 100 will only be transported to a predetermined block length of the circuit substrate 101, and as shown in Figs. 3 (a) to (e), preheating, peak heating, and cooling are sequentially given to the next circuit substrate 1 0 1 is subjected to reflow treatment. For some reason, for example, when the production line from the loader 21 to the unloader 25 described in FIG. 1 is stopped, during the heating process of the preheating block 1 1 1 or the formal heating block 1 1 2, the The thermal block 1 1 1 or the formal heating block 1 1 2 will leave the tape substrate 100. This can prevent the tape substrate 100 from being heated more than necessary. On the other hand, when the production line is restored, preheating, peak heating (26) (26) 200402811 will be applied again and cooling. At this moment, when the temperature of the circuit substrate 1 of a predetermined block length of the tape substrate 〇〇 is lowered as shown by the dotted lines ① ~ ④ in FIG. 5, respectively, it will first correspond to ① ~ ③ slowly. The preheating block 1 is raised, and the temperature of the circuit board with a predetermined block length of the tape substrate 100 is increased to a position shown by a solid line in FIG. 5. Secondly, the formal heating block [12] can be brought into contact with the circuit board 101, and the peak heat can be applied. In this way, after the production line is restored, the product will not be damaged, and the reflow process can be continued. In this way, in the above-mentioned sixth embodiment, the preheating block 1 1 1 can be slowly moved from the positioning to the circuit board 1 with a predetermined block length of the tape substrate 100 by the upward movement. After preheating, return to positioning, and then bring the formal heating block 11 2 close to the preheating block 1 1 into contact with the preheated circuit board 1 that is transported in a predetermined operation flow. After the peak heat is applied, it returns to the positioning, and then the cooling block 1 13 is brought close to the circuit board 101 where the peak heat is applied, and after cooling the circuit board 101, it returns to the positioning. Accordingly, since the boundary temperature between the preheating block 111 and the main heating block 112 can be eliminated, the quality control of the product can be easily performed. In addition, since a conventional lamp heating method or far-infrared method light-shielding structure is not required, the device structure can be simplified. For some reason, when the production line from the loader 21 to the unloader 25 shown in FIG. 1 is stopped, the heating process in the preheating block 1 1 1 or the formal heating block 1 1 2 is preheated. Block 1 11 or formal heating block 1 1 2 will leave the tape substrate 100, so it can avoid heating the tape substrate 100, Η -30- (27) (27) 200402811 to the required As described above, the quality control of the product can be easily performed. On the other hand, when the production line is restored, when the temperature of the circuit board 1 01 of the predetermined block length of the tape substrate 100 is reduced as shown by the dotted line in FIG. 5 ① ~ ④, it will first correspond to ① ~ ③ Slowly raise the preheating block 1 1 1 to increase the temperature of the circuit board 1 0 of the predetermined block length of the tape substrate 100 to the position shown by the solid line in FIG. 5, and then formally heat Block 1 1 2 is in contact with the circuit board 1 01, and the peak heat is applied again, and the cooling block 1 1 3 is used to cool the circuit board 1 1 which is subjected to the peak heat again, so it will not cause damage to the product and can continue. Perform a reflow treatment. In addition, when the production line is restored, preheating, peak heating, and cooling are applied again, so the waiting time for subsequent heat treatment or cooling treatment can be greatly reduced. In addition, since the coolant from the plurality of coolant blow-out holes 1 1 5 of the sandwiching holes Π 4 of the cooling block 1 I 3 can be used to cool the circuit board 1 with peak heat, the circuit board 1 can be improved. The cooling efficiency of 1 can shorten the cooling process time, and especially when the solder paste 104 is lead-free, it can easily prevent thermal oxidation. In the present embodiment, the preheating is performed when the preheating block is raised stepwise, but it is not limited to this example, and the preheating may be performed by linearly rising. In the present embodiment, the preheating block 11 and the main heating block 1 12 are moved upward from the lower side of the tape substrate 100, but the present invention is not limited to this example. The upper surface of the tape substrate 100 is moved downward. In addition, in this embodiment, although a plurality of coolant blow-out holes having a shape of [28] (28) 200402811 in cross section]] 5 are provided in the cooling block U 3, However, the present invention is not limited to this example, and the cooling block 1] 3 may be formed into a flat plate shape, and a coolant blowout hole 1 15 may be provided on the side facing the tape substrate 100. In this embodiment, the number of the preheating blocks 1 1 1 is not limited to this example, and the number of the preheating blocks 1 1 1 may be plural. Fig. 6 is a perspective view showing a schematic configuration of an electronic device manufacturing apparatus according to a seventh embodiment of the present invention. In Fig. 6, there are provided a cooling block 2 1 3 for reducing the temperature of the heated heating block 2 1 1 and a heated to-be-processed object. For example, during the soldering process and the reflow process after the installation process, the continuum (tape substrate 200) connected to the heat-treated object (circuit substrate) with a predetermined block length is heated or cooled. Here, for the circuit board connected to the tape substrate 200, for example, the same configuration as that of FIG. 4 can be used. The heating block 2 1 1 is made of, for example, metal or ceramic, and is freely moved in the directions of arrows a and b by a driving mechanism (not shown). The heating block 2 1 1 approaches the tape substrate 200 slowly to apply preheating, and contacts the tape substrate 200 to apply peak heat, the details of which will be described later. The cooling block 2 1 3 is made of, for example, metal or ceramic, and is freely moved in the direction of arrow d by a driving mechanism (not shown). The cooling zone block 213 has a covering cover hole 2 1 4 (cross-sectional shape) covering the reel substrate 200 sandwiched by the thickness direction up and down. In addition, a plurality of coolant blow-out holes 2 1 5 are provided on the inner surface of the covering hole 2 14. FIG. 7 is a side view showing the reflow process of FIG. 6. -32- (29) 200402811 In Figure 7, if the tape substrate 2 0 0 that has completed the soldering process and the mounting process is advanced to the reflow process, as shown in Figure 7 (a), the heating block 2] 1 will change from the dotted line The initial position shown rises a step in the direction of arrow a to approach the tape substrate 200. At this moment, the heating block 2 1 1 is heated to a circuit board having a predetermined block length approaching the tape substrate 2000 at a predetermined time. As a result, the circuit board is preheated in the same manner as in FIG. 4. This preheating ① can form the temperature gradient shown by the solid line in ① of Fig. 5. If the heating process in FIG. 7 (a) of the heating block 21 1 is completed, as shown in FIG. 7 (b), the heating block will rise one more step in the direction of the arrow a to approach the tape substrate 200, as described above. Yes, the circuit substrate is heat-treated for a predetermined time. Thereby, the circuit board is preheated in the same manner as in FIG. 4. This preheating ② can form the temperature gradient shown by the solid line in ② of Fig. 5. If the heating process in FIG. 7 (b) of the heating block 2 1 1 is completed, as shown in FIG. 7 (c), the heating block 21 1 will rise one more step in the direction of the arrow a to approach the tape substrate 200. In the same manner as described above, the circuit board is subjected to a heat treatment for a predetermined time. Thereby, the circuit board is preheated in the same manner as in FIG. 4. This preheating ③ can form the temperature gradient shown by the solid line in ③ of Fig. 5. If the heating process in FIG. 7 (c) of the heating block 21 1 is completed, as shown in FIG. 7 (d), the heating block 2 1 1 will rise one more step in the direction of the arrow a to come into contact with the tape substrate 200. In the same manner as described above, the circuit substrate is subjected to a heat treatment for a predetermined time. As a result, the circuit board is subjected to the same peak heat ④ as in FIG. 4. This peak heat ④ can form a temperature gradient of 292-33-(30) (30) 200402811 shown by the solid line in ④ of Fig. 5. The peak heat ④ here is the solder melting point + ^ ′, so the solder paste will melt and the semiconductor wafer will be bonded to the wiring on the circuit board. If the heating process in FIG. 7 (d) of the heating block 2 1 1 is completed, as shown in FIG. 7 (e), the heating block 21 1 will fall in the direction of the arrow b and return to the initial position, and the cooling block 213 moves from the initial position shown in FIG. 7 (a) to the direction of the arrow c, so that the substrate 200 can be clamped from above and below by the clamp holes 2 1 4. In addition, the coolant from a plurality of coolant blowing holes 2 1 5 provided on the inner surface of the cover hole 2] 4 is blown out from above and below the circuit board to cool the circuit board. As a result, the circuit board is cooled as shown by ⑤ in FIG. 4. This cooling ⑤ forms a temperature gradient shown by the solid line of ⑤ in Fig. 5. In this way, when the circuit board is cooled, the semiconductor wafer is fixed to the circuit board via wiring. If the cooling of the circuit board is completed for a predetermined time, the cooling block 2 1 3 will move from the state of FIG. 7 (e) In the direction of arrow d, return to the initial position of Fig. 7 (a). In this way, if the circuit substrate with a predetermined block length of the tape substrate 200 is sequentially subjected to preheating, peak heating, and cooling, and the reflow processing of a certain circuit substrate is completed, the tape substrate 200 will only be transported. The predetermined block of the circuit substrate is long, and as shown in FIGS. 7 (a) to 7 (e), preheating, peak heating, and cooling are sequentially given, and the next circuit substrate is subjected to a reflow process. In addition, for some reason, for example, when the production line between the loader 21 to the unloader 25 described in FIG. 1 is stopped, the heating block 211 is self-winding during the heating process of the preheating block 2 1 1. The substrate 200 is separated. Thereby, the tape substrate 200 can be prevented from being heated more than necessary.

-34 - (31) (31)200402811 另一方面，在生產線恢復時，會再度施以預熱、峰値 熱及冷卻。此刻，當捲帶基板2 0 0之預定區塊長的電路基 板的温度，分別如圖5的虛線所示①〜④那樣降低時，會 分別對應於①〜④來慢慢地使加熱區塊2 1 1上升，可使捲 帶基板2 00之預定區塊長的電路基板的温度上升至圖5的 實線所示的位置。藉此，在生產線恢復後，不會對製品造 成損傷，而能夠繼續進行回流處理。 如此一來，在上述第7實施形態中，可藉由上升移動 來使加熱區塊2 1 1慢慢地由初期位置接近至捲帶基板2 0 0 之預定區塊長的電路基板，而施以預熱，且使接觸於電路 基板來施以峰値熱後，下降回到初期位置，然後使冷卻區 塊2 ] 3從初期位置藉由水平移動來接近被施以峰値熱的電 路基板，而於冷卻電路基板後，回到初期位置，因此不需 要像以往那樣設置複數個加熱區域，所以可達成省空間化 〇 由於可藉由上升移動來使加熱區塊2 1 1慢慢地由初期 位置接近至捲帶基板200之預定區塊長的電路基板，而施 以預熱，並使接觸於電路基板來施以峰値熱，且藉由冷卻 區塊2 1 3的覆夾孔2 1 4來使能夠從上下覆蓋夾入捲帶基板 2 0 0，又，利用來自設於覆夾孔2 1 4的內面之複數個冷卻 劑吹出孔2 1 5的冷卻劑來冷卻電路基板，因此可提高對電 路基板的加熱效率及冷卻效率，所以可縮短加熱處理或冷 卻處理所需的時間，進而能夠謀求省能源化。 又，基於某種原因，從圖3所述的裝載機2 1至卸載 -35- (32) (32)200402811 機2 5間的生產線停止時，由於可使加熱區塊2 1 I從捲帶 基板200離開，因此可避免對捲帶基板加熱至所需以上， 而能夠容易防止對製品造成損傷。並且，在生產線恢復時 ，由於會再度施以預熱、峰値熱及冷卻，因此可大幅度地 縮短恢復後之加熱處理或冷卻處理的等待時間。 又，由於可利用來自冷卻區塊2 1 3的覆夾孔 2 ] 4的 複數個冷卻劑吹出孔2 1 5的冷卻劑來冷卻被施以峰値熱的 電路基板，因此能夠提高電路基板的冷卻効率，藉此可縮 短冷卻處理時間，特別是在焊錫膏爲無鉛時，可容易防土 熱氧化。 又，本實施形態中，雖是針對使預熱區塊2 1 1段階性 上升來施以預熱及峰値熱時，但並非只限於此例，亦可使 加熱區塊2 1 1接觸於電路基板，在此狀態下，慢慢地提高 由加熱區塊2 1 1所賦予的熱，而施以預熱及峰値熱。 又，本實施的形態中，雖是針對使加熱區塊2 1 1段階 性上升來施以預熱時，但並非只限於此例，亦可使線性上 升來施以預熱。 又，本實施形態中，雖是針對使加熱區塊2 1 1由捲帶 基板2 0 0的下面側來上升移動時，但並非只限於此例，亦 可使由捲帶基板200的上面側來下降移動。 又，本實施形態中，雖是針對將具有剖面呈^字形状 的複數個冷卻劑吹出孔2 1 5的覆夾孔2 1 4設置於冷卻區塊 2 1 3時，但並非只限於此例，亦可使冷卻區塊2】3形成平 板状， 且使於朝向捲帶基板2 0 0的面側設置冷卻劑吹出 -36- (33) (33)200402811 孔 2 1 5 〇 圖8、圖9是表示本發明之第8實施形態的電子裝置 的製造方法。 在圖8中，設有：施以預熱的預熱區塊3 1 1〜3 1 3，及 施以峰値熱的正式加熱區塊3 1 4，以及使被施以峰値熱的 被加熱處理體的温度下降的冷卻區塊3 i 5。在錫焊過程、 安裝過程後進行的回流過程中，對連接預定區塊長的被加 熱處理體（電路基板3 0 1 )的連續體（捲帶基板3 0 0 )進 行加熱處理或冷卻處理。 該等預熱區塊3 1 1〜3 1 3，正式加熱區塊3 1 4及冷卻區 塊3 1 5是例如由金屬或陶瓷等所構成。並且，分別在預熱 區塊3 1 1〜3 ] 3與正式加熱區塊3 1 4之間，例如可設置 2 m m程度的空隙。可藉此空隙來防止在各個預熱區塊3 1 1 〜3 1 3與正式加熱區塊3 1 4之間直接熱傳導，且可如後述 一般使個別移動。 又，預熱區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻 區塊3 1 5可上下移動。亦即，在對捲帶基板3 00進行加熱 處理或冷卻處理時，如圖8(b)所示，預熱區塊3 1 1〜3 13 、正式加熱區塊3 1 4及冷卻區塊3 1 5會上升移動，而使能 夠接觸於捲帶基板3 00之預定區塊長的電路基板3 0 1。預 熱區塊3 1 1〜3 1 3 '正式加熱區塊3 1 4及冷卻區塊3 1 5的 上下移動可同時或個別進行。又，亦可取代上下移動預熱 區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5，而使 捲帶基板300上下移動。 -37- (34) (34)200402811 在此，於電路基板3 0 ]中，是在回流過程前的錫焊過 程中，將焊錫膏3 04附著於電路基板 301的配線3 02上 。並且，亦可在配線3 0 2上，利用轉印來附著A C F等的 黏著劑。圖中，元件符號3 0 3爲絕緣膜。而且，在錫焊過 程後的安裝過程中，會在電路基板上經由焊錫膏304 來安裝半導體晶片3 0 5。 又，若預熱區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷 卻區塊3 1 5對捲帶基板3 0 0的預定區塊長的電路基板3 0 1 接觸預定的時間而完成加熱處理或冷卻處理的話，則會下 降移動，而自捲帶基板3 0離開。若如此的預熱區塊3 1 1 〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5上下移動，則 會藉由往捲帶基板20的箭頭方向之搬送來依次對電路基 板3 0 1施以預熱、峰値熱及冷卻。在此，預熱區塊3 1 1〜 3 1 3是對捲帶基板3 00施以圖5的①〜③所示的預熱。正 式加熱區塊3 1 4是如圖5的④所示，對捲帶基板3 00施以 焊錫融點+ α的峰値熱。冷卻區塊3 1 5是如圖5的⑤所示 ，使捲帶基板3 0 0的温度下降。 其次，說明有關如此構成的半導體製造裝置之製造方 法。 在圖8(a)中，若完成錫焊過程及安裝過程之捲帶基板 3 〇〇的電路基板301前進至回流過程，則會被搬送至預熱 區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5上。 又’若完成錫焊過程及安裝過程之捲帶基板3 0 0的電路基 板3 0 1被搬送至預熱區塊3 1 1〜3 1 3、正式加熱區塊3 1 4 -38- (35) (35)200402811 及冷卻區塊3 1 5上，則預熱區塊3 1 ]〜3 1 3、正式加熱區 塊3 ] 4及冷卻區塊3 1 5會上升移動，而接觸於捲帶基板 3 0 0。此刻，首先會對捲帶基板3 0 0之預定區塊長的電路 基板3 0 1進行加熱處理（與預熱區塊3 1 1接觸預定時間） 。藉此，電路基板3 0 1會被施以圖5之①的實線所示的預 熱。 在此，當預熱區塊3 1 1僅以預定時間來接觸於電路基 板3 0 1而進行加熱處理時，在捲帶基板3 00的下游側的電 路基板 3 0 1上，預熱區塊 3 1 2〜3 1 3、正式加熱區塊 3 1 4 及冷卻區塊3 1 5會接觸，在捲帶基板3 00的下游側的電路 基板3 0 1上，施以圖5之②〜⑤的實線所示的預熱、峰値 熱及冷卻。因此，可一次對連接於捲帶基板3 00的複數個 電路基板3 0 1進行預熱區塊3 1 1〜3 1 3、正式熱區塊 3 1 4 及冷卻區塊3 1 5之預熱、峰値熱及冷卻處理，而使能夠提 高生産効率。 若預熱區塊3 0 1之預定時間的加熱處理終了，則預熱 區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5會從 捲帶基板3 00離開。其次，捲帶基板3 00會被搬送於圖 8(a)的箭頭方向。此刻的搬送行程會配合捲帶基板3 00之 預定區塊長的電路基板301。若根據預熱區塊311來完成 加熱處理的電路基板3 0 1到達預熱區塊3 1 2的位置，則往 圖8(a)的箭頭方向之捲帶基板300的搬送會被停止，預熱 區塊311〜313、正式加熱區塊314及冷卻區塊315會再 度上升。此刻，預熱區塊3 1 2會對捲帶基板3 00之預定區 -39- (36) (36)200402811 塊長的電路基板3 0 ]接觸預定時間來進行加熱處理。藉此 ，在電路基板3 0 1中，賦予圖5之②所示的預熱。 在此，當預熱區塊3 1 2僅以預定時間來接觸於電路基 板3 0 1而進行加熱處理時，預熱區塊3 1 1會接觸於捲帶基 板3 00的上游側的電路基板3 0 1，而於捲帶基板3 00的上 游側的電路基板3 中賦予圖5之①的實線所示的預熱， 且預熱區塊3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5會接 觸於捲帶基板3 00的下游側的電路基板3 0 1，而於捲帶基 板3 0 0的下游側的電路基板3 0 1中賦予圖5之③〜⑤的實 線所示的預熱、峰値熱及冷卻。 若預熱區塊3 1 2之預定時間的加熱處理終了，則預熱 區塊311〜3Γ3、正式加熱區塊3〗4及冷卻區塊315會從 捲帶基板3 00離開。其次，捲帶基板3 00會被搬送於圖 8(a)的箭頭方向。若根據預熱區塊312來完成加熱處理的 電路基板301到達預熱區塊313的位置，則往圖8(a)的箭 頭方向之捲帶基板300的搬送會被停止，預熱區塊311〜 313、正式加熱區塊314及冷卻區塊315會再度上升。此 刻，預熱區塊3 1 3會對捲帶基板3 00之預定區塊長的電路 基板3 0 1接觸預定時間來進行加熱處理。藉此，在電路基 板3 0 1中，賦予圖5之③的實線所示的預熱。 在此，當預熱區塊3 1 3僅以預定時間來接觸於電路基 板3 0 1而進行加熱處理時，預熱區塊3 1 1、3 1 2會接觸於 捲帶基板3 0 0的上游側的電路基板3 0 1，而於捲帶基板 3 00的上游側的電路基板3 0 1中賦予圖5之①及②的實線 -40- (37) (37)200402811 所示的預熱，且正式加熱區塊3 ] 4及冷卻區塊3 1 5會接觸 於捲帶基板3 0 0的下游側的電路基板3 0 1 ’而於捲帶基板 3 0 0的下游側的電路基板3 0 1中賦予圖5之④及⑤的實線 所示的峰値熱及冷卻。 若預熱區塊3 1 3之預定時間的加熱處理終了，則預熱 區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5會從 捲帶基板3 00離開。其次，捲帶基板3 00會被搬送於圖 8 ( a)的箭頭方向。若根據預熱區塊3 1 3來完成加熱處理的 電路基板3 0 1到達正式加熱區塊3 1 4的位置，則往圖8 ( a) 的箭頭方向之捲帶基板3〇〇的搬送會被停止，預熱區塊 3 ] 1〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5會再度上升 。此刻，正式加熱區塊3 1 4會對捲帶基板3 00之預定區塊 長的電路基板3 0 1接觸預定時間來進行加熱處理。藉此， 在電路基板3 0 1中，賦予圖5之④的實線所示的峰値熱， 而使焊錫膏3 (Η溶融，將半導體晶片3 〇5接合於電路基板 3 0 1上的配線3 0 2。 在此，當正式加熱區塊3 1 4僅以預定時間來接觸於電 路基板3 0 1而進行加熱處理時，預熱區塊3 1 1〜3 1 3會接 觸於捲帶基板3 0 0的上游側的電路基板3 0 1，而於捲帶基 板3 00的上游側的電路基板3 0 1中賦予圖5之①〜③的實 線所示的預熱，且冷卻區塊3 1 5會接觸於捲帶基板3 00的 下游側的電路基板301，而於捲帶基板3 00的下游側的電 路基板3 0 1中賦予圖5之⑤的實線所所示的冷卻。 若正式加熱區塊3 1 4之預定時間的加熱處理終了，則 -41 - (38) 200402811 預熱區塊3 1 1〜3 ] 3、正式加熱區塊3 1 4及冷卻區 會從捲帶基板3 00離開。其次，捲帶基板3〇〇會被 圖8(a)的箭頭方向。若根據正式加熱區塊314來完 處理的電路基板3 0 1到達冷卻區塊3 1 5的位置， 8 (a)的箭頭方向之捲帶基板3 00的搬送會被停止， 塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5 上升。此刻，冷卻區塊3 1 5會對捲帶基板3 00之預 長的電路基板3 0 1接觸預定時間來進行冷卻處理。 在電路基板3 0 1中，溫度會如圖5之⑤的實線所示 半導^體晶片3 0 5會經由配線3 02來固定於電路基板 在此，當冷卻區塊3 1 5僅以預定時間來接觸於 板3 0 1而進行溫度下降處理時，預熱區塊3 1 1〜3 ] 式加熱區塊3 1 4會接觸於捲帶基板3 00的上游側的 板3 0 1，而於捲帶基板3 00的上游側的電路基板3 < 予圖5之①〜④的實線所示的預熱及峰値熱。 如以上所述，往圖8(a)的箭頭方向來搬送捲 3 0 0，藉此來依次對預定區塊長的電路基板3 0 1施 、峰値熱及冷卻，而完成對電路基板3 0 1的回流過 又，基於某種原因，當從圖1所述的裝載機2 載機2 5間的生產線停止時’預熱區塊3 1 1〜3 1 3、 熱區塊3 1 4及冷卻區塊3 1 5會自捲帶基板3 0 0離開 捲帶基板3 00的温度不會影響品質的位置。藉此來 捲帶基板3 〇 〇加熱至所需以上。 另一方面，在生產線恢復時，會再度施以預熱 塊 3 15 搬送於 成加熱 則往圖 預熱區 會再度 定區塊 藉此， 下降， 30卜 電路基 3及正 電路基 )1中賦 帶基板 以預熱 .1至卸 正式加 ，而至 避免對 、峰値 -42 - (39) 200402811 熱及冷卻。此刻，當捲帶基板3 0 0之預定區塊長的電 板3 Ο 1的温度，例如圖5的虛線所示那樣降低時，會 9所示那樣，使預熱區塊3 1 1〜3 1 3、正式加熱區塊3 冷卻區塊3 ] 5慢慢地上升，藉此可使捲帶基板3 00之 區塊長的電路基板3 0 1的温度上升至圖5的實線所示 置。藉此，在生產線恢復後，不會對製品造成損傷， 夠繼續進行回流處理。又，亦可取代使預熱區塊 3 3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5慢慢地上升 即使捲帶基板3 0 0慢慢地下降。 又，當生產線恢復時，首先僅使預熱區塊3 1 1 -上升，在對電路基板3 0 1施以預定的預熱之後，使正 熱區塊3 1 4上升，而使能夠對被施以預熱的電路基板 施以峰値熱。此情況，亦可使正式加熱區塊3 1 4上的 基板3 0 1，例如回到預熱區塊3 1 3上，對正式加熱區：! 之峰値熱的施加途中的電路基板3 01施以預定的預熱 如此一來，在上述第4實施形態中，預熱區塊3 313會接觸於捲帶基板300之預定區塊長的電路基板 來施以①〜③的預熱，又，正式加熱區塊3 1 4會接觸 施以③的預熱的電路基板3 0 1來施以④的峰値熱，又 卻區塊 3 1 5會接觸於被施以峰値熱的電路基板3 0 1 電路基板3 0 1的温度下降。 如此一來，對捲帶基板3 00的加熱處理或冷卻處 藉由預熱區塊3 1 1〜3 1 3、正式加熱區塊3 1 4及冷卻 3 1 5的接觸來進行，而使能夠提高對捲帶基板3 0 0的 路基 如圖 14及 預定 的位 而能 1 1〜 ，亦 。：）i J 式加 30 1 電路 鬼34 〇 1 1〜 30 1 於被 ，冷 來使 理可 區塊 加熱 -43- (40) (40)200402811 効率或冷卻効率，進而縮短加熱處理或冷卻處理所需的時 間，提高生産性。又，由於不必像以往的熱風循環方式那 樣需要熱風循環用的機構，且不必像以往的燈加熱方式或 遠紫外線方式那樣需要進行局部加熱的遮光構造，因此不 會導致裝置大型化。又，由於預熱區塊31]〜313、正式 加熱區塊3 1 4及冷卻區塊3 1 5的加熱處理或冷卻處理可個 別進行，因此可容易對應配合區塊長的處理時間，且由於 預熱區塊3 1 1〜3 1 3間不會有熱的移動，因此可容易消除 預熱區塊 3 1 1〜3 1 3 c間的境界温度，而使能夠容易進行 製品的品質管理。 又，基於某種原因，從圖1所述的裝載機2 1至卸載 機2 5間的生產線停止時，由於可使預熱區塊3 1 1〜3 1 3、 正式加熱區塊3 1 4及冷卻區塊3 1 5從捲帶基板3 00離開， 因此可避免對捲帶基板3 00加熱至所需以上，而能夠容易 防止對製品造成損傷。並且，在生產線恢復時，由於會再 度施以預熱、峰値熱及冷卻，因此可大幅度地縮短恢復後 之加熱處理或冷卻處理的等待時間。 又，由於冷卻區塊3 1 5會接觸於被施以峰値熱的電路 基板3 0 1，而來冷卻電路基板3 0 1，因此可提高電路基板 3 0 1的冷卻効率，而使能夠縮短冷卻處理時間，特別是當 焊錫膏2 ] 4爲無鉛時，可容易防止熱氧化。 又，就第4實施形態而言，雖是針對預熱區塊3 1 1〜 3 1 3爲3個時來進行説明，但並非只限於此例，亦可爲2 個以下或4個以上。亦即，當預熱區塊3 1 1〜3 1 3爲1個 -44- (41) 200402811 時’可使預熱區塊3 ]]〜3 1 3慢慢地接近捲帶基板 而使能夠慢慢地施以圖5之①〜③所示的預熱。又 區塊3 1 1〜3 1 3、正式加熱區塊3 ] 4及冷卻區塊3 下動亦可同時進行，或者個別進行。又，預熱區塊 3 1 3與正式加熱區塊3〗4亦可合倂構成1個，此情 1曼慢地使1個加熱區塊接近或接觸捲帶基板3 〇 〇， 施以圖5之①〜③的實線所示的預熱及圖5之④的 示的峰値熱。 又，就第4實施形態而言，雖是針對回流處理 帶基板3 0 0在配合電路基板3 0 1的預定區塊長來搬 使預熱區塊3 ] 1〜3 1 3、正式加熱區塊3 1 4及冷卻區 上下移動，但並非只限於此例，亦可使預熱區塊 3 1 3、正式加熱區塊3 1 4及冷卻區塊3 ] 5上升，而 於捲帶基板3 0 0的情況下搬送捲帶基板3 00。 又，亦可在冷卻區塊3 1 5中設置内部中空的配 亦可在此配管内一邊流動氣體或液體，一邊進行冷 此，可在不使冷卻區塊3 1 5的外形變化下強制冷卻 塊3 1 5，提高冷卻効率。在此，就設置於冷卻區塊 配管内所流動的氣體而言，例如可使用空氣、氧氣 、二氧化碳、氦或氟代烴等。又，就設置於冷卻區 的配管内所流動的液體而言，例如可使用水或油等 亦可使設置於冷卻區塊3 1 5的配管内減圧’而藉此 提升冷卻効率。 圖1 〇是表示本發明之第5實施形態的電子裝 3# 4 -45- 3 00， ，預熱 1 5的上 3 1 1〜 況，可 藉此來 實線所 中，捲 送時， ί 塊 3 1 5 3 ] 1〜 在接觸 管，且 卻。藉 冷卻區 3 15的 、氮氣 塊3 15 〇又， 來更爲 置的製 (42) (42)200402811 造方法。 在圖1 〇U)中，除了圖8的構成以外，還設有用以輔 助進行預熱的熱空氣吹送區塊3 1 6。此熱空氣吹送區塊 3 ] 6是位於正式加熱區塊3 1 5的上方，且藉由未圖示的驅 動機構來進行上下移動。並且，此熱空氣吹送區塊3 ] 6在 生產線恢復時，會下降移動而接近捲帶基板3 00，對正式 加熱區塊3 1 5上的電路基板3 0 1施以預定的預熱。 其次，針對如此構成的半導體製造裝置的製造方法來 進行説明。 首先，若完成錫焊過程及安裝過程的捲帶基板3 00的 電路基板3 0 1前進至回流過程，則與圖1 3同樣的，預熱 區塊3 1 1〜 3 1 3、正式加熱區塊3 1 4及冷卻區塊3 1 5會上 升移動，而接觸於捲帶基板3 00，進行回流處理。 此刻，基於某種原因，從圖1所述的裝載機21至卸 載機25間的生產線停止時，如圖10(B)所示，會藉由未 圖示的驅動機構來使預熱區塊3 1 1〜3 1 3、正式加熱區塊 3 14及冷卻區塊315離開捲帶基板3 00至捲帶基板3 00的 温度不會影響品質的位置。此刻，熱空氣吹送區塊3 1 6會 藉由未圖示的驅動機構來由正式加熱區塊3 1 5的上方下降 移動，而接近捲帶基板3 00。 然後，當生產線恢復時，來自熱空氣吹送區塊3 1 6的 熱空氣會賦予電路基板3 0 1。此刻，當正式加熱區塊3 1 5 上的電路基板3 0 1的温度如圖5之④的虛線所示下降時， 會對電路基板3 0 1施以圖5之③的實線爲止的預熱。 -46- (43) (43)-34-(31) (31) 200402811 On the other hand, when the production line is restored, preheating, peak heating and cooling will be applied again. At this moment, when the temperature of the circuit board with a predetermined block length of the tape substrate 200 is reduced as shown by the dotted lines ① to ④ in FIG. 5, respectively, the heating blocks are slowly made corresponding to ① to ④. The rise of 2 1 1 can raise the temperature of the circuit board having a predetermined block length of the tape substrate 200 to a position shown by a solid line in FIG. 5. Thereby, after the production line is restored, the product will not be damaged, and the reflow process can be continued. In this way, in the seventh embodiment described above, the heating block 2 1 1 can be gradually approached from the initial position to the circuit board with a predetermined block length of the tape substrate 2 0 by the upward movement, and can be applied. After preheating and contacting the circuit board to apply peak heat, it is lowered back to the initial position, and then the cooling block 2 is moved horizontally from the initial position to approach the circuit board to which the peak heat is applied, and then cooled. After returning to the initial position after the circuit board, it is not necessary to install a plurality of heating areas as in the past, so space saving can be achieved. As the heating block 2 1 1 can be gradually approached from the initial position by moving up The circuit board with a predetermined block length of the tape substrate 200 is preheated, and the peak heat is applied to the circuit board in contact with the circuit board, and the clamping holes 2 1 4 of the block 2 1 3 are cooled to enable The circuit board is cooled by a plurality of coolant blow-out holes 2 1 5 provided on the inner surface of the cover clamping hole 2 1 4 and sandwiched between the tape substrate 200 and the tape substrate. Therefore, the circuit substrate can be improved. Heating efficiency and cooling Rate, it is possible to reduce the heating or cooling processing time required to process, and then be able to seek energy saving. In addition, for some reason, when the production line between the loader 21 and the unloader -35- (32) (32) 200402811 shown in FIG. 3 is stopped, the heating block 2 1 I can be removed from the reel Since the substrate 200 is separated, it is possible to prevent the tape substrate from being heated more than necessary, and to easily prevent damage to the product. In addition, when the production line is restored, preheating, peak heating, and cooling are applied again, so the waiting time for heat treatment or cooling treatment after restoration can be greatly reduced. In addition, the circuit board to which the peak heat is applied can be cooled by using the coolant from the plurality of coolant blow-out holes 2 1 4 of the sandwiching holes 2] 4 of the cooling block 2 1 3, thereby improving the cooling efficiency of the circuit board. This can shorten the cooling treatment time, especially when the solder paste is lead-free, it can easily prevent soil thermal oxidation. In this embodiment, although preheating and peak heat are applied to stepwise increase the preheating block 2 1 1, the heating block 2 1 1 may not be limited to this example. In this state, the circuit board gradually increases the heat given by the heating block 2 1 1 and applies preheating and peak heating. In addition, in the embodiment, the preheating is performed in order to increase the heating block 21 in steps, but it is not limited to this example, and the preheating may be performed by linearly rising. In this embodiment, the heating block 21 is moved upward from the lower side of the tape substrate 200, but this is not limited to this example, and the upper side of the tape substrate 200 may be used. Come down and move. In addition, in this embodiment, although it is set to cover the cooling holes 2 1 4 having a plurality of coolant blow-out holes 2 1 5 having a cross-sectional shape in the cross section 2 1 3, it is not limited to this example. It is also possible to form the cooling block 2] 3 into a flat plate shape, and set the coolant blowout on the side facing the tape substrate 200. -36- (33) (33) 200402811 Hole 2 1 5 〇 Figure 8, Figure 9 is a method for manufacturing an electronic device according to an eighth embodiment of the present invention. In FIG. 8, there are provided a preheating block 3 1 1 to 3 1 3 to which preheating is applied, and a formal heating block 3 1 4 to which peak heating is applied, and a heat-treated body to which peak heating is applied. Cooling blocks 3 i 5 with temperature drop. During the soldering process and the reflow process after the installation process, the continuum (tape substrate 300) that is connected to the heat-treated body (circuit substrate 300) of a predetermined block length is subjected to heat treatment or cooling treatment. The preheating blocks 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 are made of, for example, metal or ceramic. In addition, a gap of about 2 mm can be provided between the preheating block 3 1 1 to 3] 3 and the formal heating block 3 1 4 respectively. This gap can be used to prevent direct heat conduction between each of the preheating blocks 3 1 1 to 3 1 3 and the formal heating block 3 1 4, and can be individually moved as described later. In addition, the preheating blocks 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 can be moved up and down. That is, when the tape substrate 300 is heated or cooled, as shown in FIG. 8 (b), the preheating blocks 3 1 1 to 3 13, the formal heating blocks 3 1 4 and the cooling block 3 15 will rise and move, so that it can contact the circuit board 3 01 of a predetermined block length of the tape substrate 3 00. The pre-heating blocks 3 1 1 to 3 1 3 'the up and down movements of the formal heating block 3 1 4 and the cooling block 3 1 5 can be performed simultaneously or individually. Alternatively, instead of moving the preheating blocks 3 1 1 to 3 1 3 up and down, the formal heating block 3 1 4 and the cooling block 3 1 5 may be used to move the tape substrate 300 up and down. -37- (34) (34) 200402811 Here, in the circuit board 30], the solder paste 304 is attached to the wiring 302 of the circuit board 301 during the soldering process before the reflow process. In addition, an adhesive such as A C F may be attached to the wiring 302 by transfer. In the figure, the element symbol 3 0 3 is an insulating film. Furthermore, in the mounting process after the soldering process, the semiconductor wafer 305 is mounted on the circuit board via the solder paste 304. In addition, if the preheating block 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 pair the tape substrate 3 0 0 with a predetermined block length of the circuit substrate 3 0 1 in contact with the predetermined If the heating or cooling process is completed in time, it will move down and leave the self-winding substrate 30. If such a preheating block 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 are moved up and down, the circuit will be sequentially transferred by the arrow direction of the tape substrate 20 The substrate 3 0 1 is preheated, peak-heated, and cooled. Here, the preheating blocks 3 1 1 to 3 1 3 are preheated as shown in ① to ③ of FIG. 5 to the tape substrate 3 00. In the normal heating block 3 1 4, as shown in (4) in FIG. 5, the tape substrate 3 00 is subjected to a peak melting heat of solder melting point + α. The cooling block 3 1 5 is shown as ⑤ in FIG. 5, and the temperature of the tape substrate 300 is reduced. Next, a method for manufacturing a semiconductor manufacturing apparatus configured as described above will be described. In FIG. 8 (a), if the circuit substrate 301 of the tape substrate 3OO that has completed the soldering process and the mounting process is advanced to the reflow process, it will be transferred to the preheating block 3 1 1 to 3 1 3. Formal Heating block 3 1 4 and cooling block 3 1 5. If the soldering process and the mounting process of the tape substrate 3 0 0 are completed, the circuit substrate 3 0 1 is transferred to the preheating block 3 1 1 to 3 1 3, and the formal heating block 3 1 4 -38- (35 ) (35) 200402811 and cooling block 3 1 5, then the preheating block 3 1] ~ 3 1 3, the formal heating block 3] 4 and the cooling block 3 1 5 will move up and contact the tape. Substrate 3 0 0. At this moment, the circuit substrate 301 with a predetermined block length of the tape substrate 300 is firstly subjected to heat treatment (contacting the preheating block 311 for a predetermined time). As a result, the circuit board 3 01 is preheated as shown by the solid line in (1) of FIG. 5. Here, when the preheating block 3 1 1 is in contact with the circuit substrate 3 01 for a predetermined time and is subjected to a heat treatment, the preheating block is preheated on the circuit substrate 3 01 on the downstream side of the tape substrate 300. 3 1 2 ~ 3 1 3. The formal heating block 3 1 4 and the cooling block 3 1 5 are in contact with each other. On the circuit board 3 0 1 on the downstream side of the tape substrate 3 00, ② to ⑤ in FIG. 5 are applied. The preheating, peak heating, and cooling shown by the solid lines. Therefore, a plurality of circuit substrates 3 0 1 connected to the tape substrate 3 00 can be preheated 3 1 1 to 3 1 3, and the formal thermal block 3 1 4 and the cooling block 3 1 5 can be preheated at one time. , Peak heating and cooling treatment, which can improve production efficiency. If the heating process of the preheating block 3 01 is completed in a predetermined time, the preheating block 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 will be removed from the tape substrate 3 00 go away. Next, the tape substrate 300 is transported in the direction of the arrow in Fig. 8 (a). The transport stroke at this time will be matched with the circuit board 301 having a predetermined block length of the tape substrate 300. If the circuit board 3 0 1 which has been subjected to the heat treatment according to the pre-heating block 311 reaches the position of the pre-heating block 3 1 2, the conveyance of the tape substrate 300 to the arrow direction in FIG. 8 (a) will be stopped, and the pre-heating will be stopped. The hot blocks 311 to 313, the formal heating block 314 and the cooling block 315 will rise again. At this moment, the preheating block 3 12 will contact the predetermined area of the tape substrate 3 00 -39- (36) (36) 200402811 long circuit substrate 3 0] for a predetermined time to perform the heat treatment. Thereby, the circuit board 301 is provided with the preheating shown in (2) of FIG. 5. Here, when the preheating block 3 1 2 is in contact with the circuit substrate 3 0 1 and heat-treated only for a predetermined time, the preheating block 3 1 1 is in contact with the circuit substrate on the upstream side of the tape substrate 300. 3 0 1 and the circuit board 3 on the upstream side of the tape substrate 3 00 is provided with the preheating shown by the solid line in (1) of FIG. 5, and the preheating block 3 1 3, the formal heating block 3 1 4 and The cooling block 3 1 5 is in contact with the circuit board 3 0 1 on the downstream side of the tape substrate 3 00, and the circuit board 3 0 1 on the downstream side of the tape substrate 3 0 0 Preheating, peak heating and cooling shown by the solid line. If the heating process of the preheating block 3 12 is completed within a predetermined time, the preheating blocks 311 to 3Γ3, the formal heating block 3〗 4, and the cooling block 315 will leave from the tape substrate 300. Next, the tape substrate 300 is transported in the direction of the arrow in Fig. 8 (a). If the circuit substrate 301 that has completed the heat treatment according to the preheating block 312 reaches the position of the preheating block 313, the transport of the tape substrate 300 to the arrow direction in FIG. 8 (a) will be stopped, and the preheating block 311 ~ 313, the formal heating block 314 and the cooling block 315 will rise again. At this time, the preheating block 3 1 3 contacts the circuit substrate 3 0 1 having a predetermined block length of the tape substrate 3 00 for a predetermined time to perform a heat treatment. Thereby, the circuit board 3 01 is provided with the preheating shown by the solid line in (3) of FIG. 5. Here, when the preheating block 3 1 3 is in contact with the circuit substrate 3 0 1 and heat-treated only for a predetermined time, the preheating block 3 1 1, 3 1 2 may contact the tape substrate 3 0 0 The circuit board 3 0 1 on the upstream side and the circuit board 3 0 1 on the upstream side of the take-up substrate 3 00 are provided with solid lines ① and ② in FIG. 5 as shown in -40- (37) (37) 200402811. Heat and formally heat the block 3] 4 and the cooling block 3 1 5 will contact the circuit board 3 0 1 ′ downstream of the tape substrate 3 0 0 and the circuit board 3 3 downstream of the tape substrate 3 0 In 3 01, the peak heat and cooling shown by the solid lines of ④ and ⑤ in FIG. 5 are given. If the heating process at the predetermined time of the preheating block 3 1 3 is completed, the preheating block 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 will be removed from the tape substrate 3 00 go away. Next, the tape substrate 300 is carried in the direction of the arrow in FIG. 8 (a). If the circuit board 3 0 1 that has been subjected to the heat treatment according to the preheating block 3 1 3 reaches the position of the formal heating block 3 1 4, the tape substrate 300 will be transported to the tape substrate in the direction of the arrow in FIG. 8 (a). Being stopped, the preheating block 3] 1 ~ 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 will rise again. At this moment, the formal heating block 3 1 4 contacts the predetermined length of the circuit substrate 3 01 of the tape substrate 3 00 for a predetermined time to perform the heat treatment. Thereby, the peak heat shown by the solid line of (4) in FIG. 5 is given to the circuit board 3 01, and the solder paste 3 (Η is melted, and the semiconductor wafer 3 05 is bonded to the circuit board 3 01. Wiring 3 0 2. Here, when the main heating block 3 1 4 is in contact with the circuit board 3 0 1 for a predetermined time and is subjected to a heat treatment, the preheating block 3 1 1 to 3 1 3 will contact the tape. The circuit board 3 0 1 on the upstream side of the substrate 3 0 0, and the circuit board 3 0 1 on the upstream side of the take-up substrate 3 00 are provided with the preheating shown by the solid lines in Figs. The block 3 1 5 is in contact with the circuit board 301 downstream of the tape substrate 300, and the circuit board 3 0 1 downstream of the tape substrate 300 is provided with the cooling shown by the solid line in FIG. 5. If the heating process for the predetermined time of the formal heating block 3 1 4 is completed, -41-(38) 200402811 Preheating block 3 1 1 ~ 3] 3. The formal heating block 3 1 4 and the cooling area will be removed from the roll. The tape substrate 300 leaves. Next, the tape substrate 300 will be directed in the direction of the arrow in FIG. 8 (a). If the circuit substrate 3 0 1 which has been processed according to the formal heating block 314 reaches cooling, At the position of block 3 1 5, the transfer of the reel substrate 3 00 in the arrow direction of 8 (a) will be stopped. Block 3 1 1 to 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 will rise. At this moment, the cooling block 3 15 will contact the pre-length circuit substrate 3 01 of the tape substrate 3 00 for a predetermined time to perform the cooling treatment. In the circuit substrate 3 01, the temperature will be as shown in Fig. 5 ⑤. The semiconductor wafer 3 0 5 shown in the line is fixed to the circuit substrate via the wiring 3 02. When the cooling block 3 1 5 contacts the board 3 0 1 for a predetermined time and performs a temperature reduction process, the Hot block 3 1 1 ~ 3] The heating block 3 1 4 will contact the plate 3 0 1 on the upstream side of the tape substrate 3 00, and the circuit substrate 3 on the upstream side of the tape substrate 3 00 < The preheating and peak heating shown by the solid lines ① to ④ in Fig. 5. As described above, the volume 3 0 0 is transported in the direction of the arrow in Fig. 8 (a), and the predetermined block length is sequentially Circuit board 3 01 application, peak heating and cooling, and complete reflow of circuit board 3 01, for some reason, when the production line from loader 2 to loader 2 5 stops as shown in Figure 1 'The preheating block 3 1 1 ~ 3 1 3, the hot block 3 1 4 and the cooling block 3 1 5 will leave the tape substrate 3 0 0 from the temperature at which the tape substrate 3 00 will not affect the quality. Borrow Here, the tape substrate 300 is heated to more than necessary. On the other hand, when the production line is restored, the preheating block 3 15 will be applied again and transferred to the heating. Descending, circuit board 3 and circuit board 3) Pre-heat the belt substrate in 1). 1 until unloading, and avoid heating, cooling, and peaking -42-(39) 200402811. At this moment, when the temperature of the electric board 3 0 1 with a predetermined block length of the tape substrate 3 0 0 is lowered as shown by the dotted line in FIG. 5, the preheated block 3 1 1 to 3 will be made as shown in FIG. 9. 1 3. Formal heating block 3, cooling block 3] 5 slowly rises, so that the temperature of the circuit board 3 0 1 with a block length of the tape substrate 3 00 can be raised to the position shown by the solid line in FIG. 5 . Therefore, after the production line is restored, the product will not be damaged, and the reflow process can be continued. Alternatively, the preheating block 3 3 1 3, the formal heating block 3 1 4 and the cooling block 3 1 5 may be slowly raised even if the tape substrate 3 0 0 is slowly lowered. When the production line is restored, only the preheating block 3 1 1-is raised first, and after a predetermined preheating is applied to the circuit board 3 0 1, the positive heating block 3 1 4 is raised, so that the The preheated circuit board is subjected to peak heat. In this case, it is also possible to make the substrate 3 0 1 on the formal heating block 3 1 4, for example, return to the preheating block 3 1 3 to the circuit heating substrate 3 01 in the middle of the formal heating area:! In this way, in the fourth embodiment described above, the preheating block 3 313 contacts the circuit board of a predetermined block length of the tape substrate 300 to perform preheating ① ~ ③, and , The formal heating block 3 1 4 will contact the preheated circuit substrate 3 0 1 with ③ to apply the peak heat of ④, but the block 3 1 5 will contact the circuit substrate 3 with peak heat. 1 The temperature of the circuit board 3 0 1 drops. In this way, the heating treatment or cooling of the tape substrate 300 is performed by contacting the preheating blocks 3 1 1 to 3 1 3, the formal heating blocks 3 1 4 and the cooling 3 1 5. Improve the subgrade of the tape substrate 3 0 0 as shown in FIG. 14 and the predetermined position to 1 1 to 1. :) i J type plus 30 1 circuit ghost 34 〇1 1 ~ 30 1 Yu quilt, cold to make Leco block heating -43- (40) (40) 200402811 efficiency or cooling efficiency, and then shorten the heating or cooling process The time required to improve productivity. In addition, since a mechanism for hot air circulation is not required as in the conventional hot air circulation method, and a light-shielding structure for local heating is not required like the conventional lamp heating method or the far-ultraviolet method, the device does not increase in size. In addition, since the pre-heating block 31] to 313, the formal heating block 3 1 4 and the cooling block 3 1 5 can be individually heated or cooled, it can easily correspond to the long processing time of the matching block, and because There is no heat movement between the preheating blocks 3 1 1 to 3 1 3, so the boundary temperature between the preheating blocks 3 1 1 to 3 1 3 c can be easily eliminated, and the quality control of the product can be easily performed. In addition, for some reason, when the production line from the loader 21 to the unloader 25 described in FIG. 1 is stopped, the preheating block 3 1 1 to 3 1 3 can be heated officially. And the cooling block 3 1 5 is separated from the tape substrate 300, so that the tape substrate 300 can be prevented from being heated more than necessary, and damage to the product can be easily prevented. In addition, when the production line is restored, preheating, peak heating, and cooling are applied again, so the waiting time for heat treatment or cooling treatment after restoration can be greatly reduced. In addition, since the cooling block 3 1 5 contacts the circuit board 3 0 1 to which the peak heat is applied, and cools the circuit board 3 0 1, the cooling efficiency of the circuit board 3 0 1 can be improved, and the cooling process can be shortened. Time, especially when the solder paste 2] 4 is lead-free, can easily prevent thermal oxidation. In the fourth embodiment, the preheating blocks 3 1 1 to 3 1 3 are described, but the present invention is not limited to this example, and may be two or less or four or more. That is, when the preheating block 3 1 1 to 3 1 3 is one -44- (41) 200402811 'the preheating block 3 can be made]] ~ 3 1 3 slowly approach the tape substrate to enable Slowly apply the preheating shown in (1) to (3) in Figure 5. Blocks 3 1 1 ~ 3 1 3, formal heating block 3] 4 and cooling block 3 can be moved simultaneously or separately. In addition, the pre-heating block 3 1 3 and the formal heating block 3 〖4 may also be combined to form one. In this case, 1 heating block is slowly brought close to or in contact with the tape substrate 3 00. The preheating indicated by the solid line of ① to ③ of 5 and the peak heating shown by ④ of FIG. 5. In the fourth embodiment, the preheating block 3 is moved for the reflow processing of the substrate 3 with a predetermined block length that matches the circuit board 3 0 1] 1 to 3 1 3. Formal heating zone The block 3 1 4 and the cooling zone move up and down, but it is not limited to this example. The preheating block 3 1 3, the formal heating block 3 1 4 and the cooling block 3] 5 can be raised, and the tape substrate 3 In the case of 0 0, the tape substrate 300 is transported. It is also possible to provide a hollow internal piping in the cooling block 3 1 5 or to perform cooling while flowing gas or liquid in the piping. Forced cooling can be performed without changing the shape of the cooling block 3 1 5 Block 3 1 5 to improve cooling efficiency. Here, as the gas flowing in the piping provided in the cooling block, for example, air, oxygen, carbon dioxide, helium, or fluorinated hydrocarbon can be used. As for the liquid flowing in the piping provided in the cooling zone, for example, water or oil can be used, or the inside of the piping provided in the cooling block 3 1 5 can be reduced ', thereby improving the cooling efficiency. FIG. 10 is an electronic device 3 # 4 -45- 3 00, showing the fifth embodiment of the present invention, and preheating the top 3 1 1 to 15 of 15, which can be used as a solid line, and when reeling, ί Block 3 1 5 3] 1 ~ but in contact with the tube. (42) (42) 200402811 manufacturing method by cooling zone 3 15 and nitrogen block 3 150. In FIG. 10U), in addition to the configuration of FIG. 8, a hot air blowing block 3 1 6 for assisting preheating is provided. The hot air blowing block 3] 6 is located above the formal heating block 3 1 5 and is moved up and down by a driving mechanism (not shown). In addition, when the hot air blowing block 3] 6 is restored, it will move downward and approach the tape substrate 300, and apply a predetermined preheat to the circuit substrate 3 01 on the formal heating block 3 1 5. Next, a manufacturing method of the semiconductor manufacturing apparatus configured as described above will be described. First, if the circuit board 3 0 1 of the tape substrate 3 00 which has completed the soldering process and the mounting process is advanced to the reflow process, as in FIG. 13, the preheating block 3 1 1 to 3 1 3, the formal heating zone The blocks 3 1 4 and the cooling block 3 1 5 will move up and come into contact with the tape substrate 3 00 for reflow processing. At this moment, for some reason, when the production line from the loader 21 to the unloader 25 described in FIG. 1 is stopped, as shown in FIG. 10 (B), the preheating block is caused by a driving mechanism (not shown). 3 1 1 to 3 1 3. The temperature at which the formal heating block 3 14 and the cooling block 315 leave the tape substrate 300 to the tape substrate 300 will not affect the quality. At this moment, the hot air blowing block 3 1 6 is lowered and moved from the top of the formal heating block 3 1 5 by a driving mechanism (not shown), and approaches the tape substrate 3 00. Then, when the production line resumes, the hot air from the hot air blowing block 3 1 6 will be given to the circuit board 3 0 1. At this moment, when the temperature of the circuit substrate 3 0 1 on the officially heated block 3 1 5 is lowered as indicated by the dotted line in FIG. 5 ④, the circuit substrate 3 0 1 is applied with a pre-up to the solid line in FIG. 5 heat. -46- (43) (43)

200402811 若對正式加熱區塊3〗5上的電路基板3 0 ] 則熱空氣吹送區塊3 1 6會如圖1 0 ( c )所示，藉 驅動機構來上升移動，而自捲帶基板3 0 0離開 ，預熱區塊 3 1 1〜3 1 3、正式加熱區塊 3 1 4 3 15會上升移動，而接觸於捲帶基板3 0 0，繼 通常的加熱處理及冷卻處理。藉此，在生產線 會對製品產生損傷，繼續進行回流處理。 如此，在上述第5實施形態中，基於某種 1所述的裝載機2 1至卸載機2 5間的生產線停 由未圖示的驅動機構來使預熱區塊3 1 1〜3 1 3 區塊314及冷卻區塊315離開捲帶基板300 3 00的温度不會影響品質的位置，且藉由未圖 構來使熱空氣吹送區塊3 1 6由正式加熱區塊3 降移動，而接近捲帶基板.3 00，當生產線恢復 路基板3 0 1施以來自熱空氣吹送區塊3 1 6的熱 ，因此可以確實地避免在生產線停止時對製品 且能夠大幅度地縮短恢復後進行通常運轉的等 被施以預熱的電路基板3 0 1而言，可避免正 3 1 5所產生的熱影響。 此外，就上述第5實施形態而言，雖是針 板3 00的下面側來使預熱區塊3 1 1〜3 1 3、正 3 1 4及冷卻區塊3 1 5上升移動時進行説明，但 此例，亦可由捲帶基板3 00的上面側來使下降 況，熱空氣吹送區1鬼316可由捲帶基板300的 一 47- 施以預熱， •由未圖示的 。另一方面 及冷卻區塊 續進行上述 恢復後，不 原因，從圖 止時，會藉 、正式加熱 至捲帶基板 示的驅動機 1 5的上方下 時，可對電 空氣之預熱 造成損傷， 待時間，對 式加熱區塊 對由捲帶基 式加熱區塊 並非只限於 移動。此情 下面側來使 (44) (44)200402811 上升移動。 圖]]是表示本發明之第]〇實施形態的電子裝置的製 造方法。 在圖1 1 ( a)中設有：施以預熱的預熱區塊4 1 2，及施 以峰値熱的正式加熱區塊4 1 3，以及使被施以峰値熱的被 加熱處理體的温度下降的冷卻區塊4 1 4。並且，在預熱區 塊4 1 2的前段配置有避免對預熱區塊4 1 2之加熱處理前的 捲帶基板400傳達熱的冷卻區塊41 1。在圖1 1(a)的例子 中，基於説明方便起見，預熱區塊4 1 2爲1個。 就如此的構成而言，當預熱區塊4 1 2接觸於捲帶基板 4 〇 〇的預定區塊長的電路基板而如圖5所述被施以①〜③ 的預熱時，施以①的預熱前的捲帶基板4 00的預定區塊長 的電路基板會接觸冷卻區塊4 1 1。在此，由於冷卻區塊 4 ] 1會使施以①的預熱前的電路基板400冷卻至常温，因 此可避免預熱區塊4 1 2之加熱處理前的捲帶基板400的温 度上升。 如此一來，在圖1 1(a)的實施形態中，對施以圖5之 ①的預熱前的捲帶基板400的預定區塊長的電路基板而言 ，由於會接觸冷卻區塊4 1 1冷卻至常温程度，因此可迴避 預熱區塊412之加熱處理前的捲帶基板400的温度上升， 而使能夠容易進行製品的品質管理。 另一方面，在圖1 1(b)中設有：施以預熱的預熱區塊 5 1 2，及施以峰値熱的正式加熱區塊5 1 4，以及使被施以 峰値熱的被加熱處理體的温度下降的冷卻區塊5 1 5。並且 -48- (45) (45)200402811 ，在預熱區塊5 1 2的前段配置有避免對預熱區塊5 ] 2之加 熱處理前的捲帶基板5 0 0傳達熱的冷卻區塊5 1 1。而且， 在預熱區塊5 1 2與正式加熱區塊5 1 4之間配置有避免對正 式加熱區塊5 1 4之加熱處理前的捲帶基板5 00傳達熱的冷 卻區塊5 1 3。在圖1 1 (b)的例子中，基於説明方便起見， 預熱區塊5 1 2爲1個。 就如此的構成而言，當加熱區塊5 1 4接觸於捲帶基板 5 〇〇之預定區塊長的電路基板而施以峰値熱時，對施以峰 値熱前的捲帶基板5 00之預定區塊長的電路基板而言，由 於會接觸冷卻區塊5 1 3而冷卻，因此可迴避正式加熱區塊 5 1 4之加熱處理前的捲帶基板5 0 0的温度上升。 如此一來，在圖1 1 (b)的實施形態中，對施以峰値熱 前的捲帶基板5 0 0之預定區塊長的電路基板而言，由於會 接觸冷卻區塊5 ] 3而冷卻，因此可迴避正式加熱區塊5 1 4 之加熱處理前的捲帶基板500的温度上升，而使能夠容易 進行製品的品質管理。 又，就第6實施形態而言’雖是針對預熱區塊5 1 2爲 1個時來進行説明，但並非只限於此例’亦可爲2個以下 或4個以上，當預熱區塊5 1 2爲複數時，可分別於之間配 置冷卻區塊，來迴避施以預熱時後續的捲帶基板5 0 0的温 度上升，因此更能夠容易進行製品的品質管理。 圖1 2是表示本發明之第7實施形態的電子裝置的製 造裝置的槪略構成立體圖。 在圖12中，在捲帶基板601中配置有沿著長度方向 -49- (46) (46)200402811 而連接的電路區塊603，且於各電路區塊603中設有電子 零件搭載區域。並且，在捲帶基板6 0 1的兩側，以預定間 ， 距而設有供以搬送捲帶基板60]的送孔602。又，捲帶基 -板60 1的材質，例如可使用聚醯亞胺等。又，搭載於各電 路區塊603上的電子零件，例如有半導體晶片、晶片電容 器、電阻元件、線圏或連接器等。 另一方面，在捲帶基板6 0 1的回流區域中，加熱區塊 611〜614會取預定的間隔而沿著捲帶基板601的搬送方 • 向排列配置。並且在加熱區塊6 1 3上配置有突起部6 1 7會 向下設置的壓板616，而且在加熱區塊611〜614的旁邊 配置有擋板615a、615b。 在此，加熱區塊6 1 1、6 1 2的温度可設定成依次增高 於比焊錫融點還要小的範圍內，加熱區塊6 1 3的温度可設 定成焊錫融點以上，加熱區塊6 1 4的温度可設定成比加熱 區塊6 1 ]、6 1 2的温度還要小。又，加熱區塊1 1 1〜6 1 4及 壓板616可分別獨立上下移動，且擋板 615a、615b可水 ® 平移動於捲帶基板6 0 1的短邊方向，又，加熱區塊6 1 1〜 6 1 4，擋板6 1 5 a、6 1 5b及壓板6 1 6是以能夠沿著捲帶基板 601的搬送方向而一體滑動之方式來支持著。又，設置於 壓板6 1 6的突起部6 1 7的間隔可設定成對應於電路區塊 6 〇 3的長度。 又，加熱區塊611〜614及擋板615a、615b的材質， 例如可使用含金屬，金屬化合物或合金的構件，或者陶瓷 。加熱區塊6 1 1〜6 1 4的材質，例如可使用鐵或不鏽鋼等200402811 If the circuit board 3 0 on the formal heating block 3〗 5 is heated, the hot air blowing block 3 1 6 will be moved upward by the driving mechanism as shown in FIG. 10 (c), and the substrate 3 is self-rolled. After leaving 0 0, the preheating block 3 1 1 ~ 3 1 3. The formal heating block 3 1 4 3 15 will move up and contact the tape substrate 3 0 0, following the usual heating and cooling processes. This will damage the product on the production line and continue the reflow process. As described above, in the fifth embodiment, the preheating block 3 1 1 to 3 1 3 is stopped by a drive mechanism (not shown) based on the production line between the loader 21 to the unloader 25 according to a certain type 1. The temperature at which the block 314 and the cooling block 315 leave the tape substrate 300 3 00 does not affect the quality, and the hot air blowing block 3 1 6 is moved from the officially heated block 3 by the unillustrated structure, and It is close to the tape substrate. 3 00. When the production line recovers the circuit substrate 3 0 1 from the hot air blowing block 3 1 6, it can reliably avoid the product when the production line is stopped and can greatly shorten the recovery. In the case of a normally-operated circuit board 3 01 that has been preheated, the thermal influence of the positive 3 1 5 can be avoided. In addition, in the fifth embodiment described above, the preheating blocks 3 1 1 to 3 1 3, the positive 3 1 4 and the cooling block 3 1 5 will be described below while moving down the needle plate 3 00. However, in this example, it can also be lowered by the upper side of the tape substrate 300, and the hot air blowing zone 1 ghost 316 can be preheated by a 47- of the tape substrate 300. • Not shown. On the other hand, after the above-mentioned recovery is continued in the cooling block, for no reason, from the end of the figure, it will be borrowed and officially heated to the top and bottom of the driver 15 shown on the tape substrate, which may cause damage to the preheating of the electric air. Waiting time, the pair-type heating block is not limited to moving by the tape-based heating block. In this case, (44) (44) 200402811 moves up. Figure]] shows a method of manufacturing an electronic device according to a tenth embodiment of the present invention. In Fig. 1 (a), there are provided a preheating block 4 1 2 to which preheating is applied, a formal heating block 4 1 3 to which peak heat is applied, and a temperature of a heated object to be subjected to peak heat. Falling cooling block 4 1 4. In addition, a cooling block 41 1 is disposed at a front stage of the preheating block 4 1 2 to prevent the tape substrate 400 from transmitting heat to the preheating block 4 12 before the heat treatment. In the example of FIG. 11 (a), for convenience of description, there is one preheating block 4 1 2. With such a configuration, when the preheating block 4 12 is in contact with a circuit board of a predetermined block length of the tape substrate 4 00 and is preheated with ① ~ ③ as described in FIG. 5, ① The circuit board with a predetermined block length of the tape substrate 400 before the preheating will contact the cooling block 4 1 1. Here, since the cooling block 4] 1 cools the circuit substrate 400 before the preheating to ① to normal temperature, the temperature rise of the tape substrate 400 before the heat treatment of the preheating block 4 1 2 can be avoided. In this way, in the embodiment of FIG. 11 (a), the circuit board having a predetermined block length of the tape substrate 400 before the preheating of FIG. Since 1 1 is cooled to a normal temperature, the temperature rise of the tape substrate 400 before the heat treatment of the preheating block 412 can be avoided, and product quality management can be easily performed. On the other hand, in FIG. 11 (b), there are provided a preheating block 5 1 2 to which preheating is applied, and a formal heating block 5 1 4 to which peak heating is applied, and heating by which peak heating is applied is performed. Cooling block 5 1 5 where the temperature of the processing body drops. And -48- (45) (45) 200402811, a pre-heating block 5 1 2 is provided with a pre-heating block substrate 5 0 0 before the tape substrate 5 0 0 to transmit heat to the cooling block. 5 1 1. Further, a cooling block 5 1 3 is provided between the preheating block 5 1 2 and the main heating block 5 1 4 to prevent heat from being transmitted to the tape substrate 5 00 before the heat treatment of the main heating block 5 1 4. . In the example of FIG. 1 (b), for convenience of description, the number of preheating blocks 5 1 2 is one. With such a configuration, when the heating block 5 1 4 is in contact with a circuit substrate of a predetermined block length of the tape substrate 5000 and the peak heat is applied, a predetermined area of the tape substrate 500 before the peak heat is applied. As for the long circuit board, since it will contact the cooling block 5 1 3 for cooling, the temperature rise of the tape substrate 5 0 before the heat treatment of the main heating block 5 1 4 can be avoided. In this way, in the embodiment shown in FIG. 11 (b), the circuit board with a predetermined block length of the tape substrate 5 0 0 before the peak heating is applied is cooled by contacting the cooling block 5] 3. Therefore, the temperature rise of the tape substrate 500 before the heat treatment of the main heating block 5 1 4 can be avoided, and the quality control of the product can be easily performed. In the sixth embodiment, 'the description is given for the case where the number of preheating blocks 5 1 2 is one, but it is not limited to this example'. It may be two or less or four or more. When the number of blocks 5 1 2 is plural, cooling blocks can be respectively arranged between them to avoid the temperature rise of the subsequent tape substrate 500 during the preheating, so it is easier to perform product quality management. Fig. 12 is a perspective view showing a schematic configuration of a manufacturing apparatus for an electronic device according to a seventh embodiment of the present invention. In FIG. 12, a circuit board 603 connected along the length direction -49- (46) (46) 200402811 is arranged in the tape substrate 601, and an electronic component mounting area is provided in each circuit block 603. In addition, on both sides of the tape substrate 601, feed holes 602 are provided at predetermined intervals to carry the tape substrate 60]. As the material of the tape base plate 60 1, for example, polyimide can be used. The electronic components mounted on each circuit block 603 include, for example, a semiconductor wafer, a chip capacitor, a resistance element, a coil, or a connector. On the other hand, in the reflow area of the tape substrate 601, the heating blocks 611 to 614 are arranged at predetermined intervals along the conveyance direction of the tape substrate 601. Further, a pressing plate 616 is provided on the heating block 6 1 3 so that the protruding portion 6 1 7 can be downwardly arranged, and baffles 615a and 615b are disposed beside the heating blocks 611 to 614. Here, the temperature of the heating blocks 6 1 1 and 6 1 2 can be set to sequentially increase above a range smaller than the solder melting point, and the temperature of the heating block 6 1 3 can be set above the solder melting point. The temperature of block 6 1 4 can be set lower than the temperature of heating blocks 6 1], 6 1 2. In addition, the heating block 1 1 1 to 6 1 4 and the pressing plate 616 can be independently moved up and down, respectively, and the baffles 615a and 615b can be horizontally moved in the short side direction of the tape substrate 6 0 1 and the heating block 6 1 1 to 6 1 4, the baffles 6 1 5 a, 6 1 5b, and the pressure plate 6 1 6 are supported so as to be able to slide integrally along the transport direction of the tape substrate 601. The interval between the protruding portions 6 1 7 provided on the pressure plate 6 1 6 can be set to correspond to the length of the circuit block 6 03. In addition, as the material of the heating blocks 611 to 614 and the baffles 615a and 615b, for example, a member containing a metal, a metal compound or an alloy, or ceramics can be used. Material of heating block 6 1 1 ~ 6 1 4; for example, iron or stainless steel can be used

-50- (47) (47)200402811 ，藉此來抑止加熱區塊6 ]]〜6 I 4的熱膨脹，而使捲帶基 板6 0 ]能夠精度良好地搬送於加熱區塊6 ] 1〜6 1 4上。 又，各加熱區塊6 1 1〜6 I 4的長度可設定成對應於複 數個電路區塊603的長度’擋板615a、615b的大小可設 定成4個加熱區塊6 1 1〜6 1 4的大小加上加熱區塊6丨〗〜 6 1 4間的空隙的大小的値，壓板6 1 6的大小可設定成對應 於加熱區塊6 1 3的大小。並且，各加熱區塊6 1 1〜6 1 4的 長度並非一定要設定成1個電路區塊6 0 3的長度的整數倍 ，亦可產生尾數。 又，加熱區塊 6 1 1〜6 1 4的形状，至少與捲帶基板 60 1的接觸面可設定成平坦狀，例如可使加熱區塊6 1 1〜 6 1 4形成板状。 圖1 3是表示圖1 2之回流處理的側面圖，圖1 4是表 示圖1 2之回流處理的流程圖。 在圖13、1 4中，例如在圖1的焊錫塗佈區域2 2及安 裝區域23中，被進行焊錫膏印刷及電子零件的安裝處理 之捲帶基板601會被搬送至加熱區塊611〜614上（圖14 的步驟S 1 )。並且，在加熱區塊6 1 1〜6 1 4上搬送捲帶基 板601時，可使捲帶基板601接觸於加熱區塊611〜6 14 的情況下來搬送。藉此，在使加熱區塊6 1 1〜6 1 4接觸於 捲帶基板6 0 1來加熱捲帶基板6 0 1時，可省略加熱區塊 6 1 1〜6 1 4的移動動作，進而能夠縮短回流處理的作業流 程時間。在此，可使加熱區塊6 1 1〜6 1 4形成板状，而使 捲帶基板6 0 1接觸於加熱區塊6 1 1〜6 1 4的上面時能夠順 -51 - (48) (48)200402811 暢地搬送捲帶基板6 0 1。 其次，如圖1 3 (b)所示，若被進行焊錫膏印刷及電子 零件的安裝處理之捲帶基板60 1被搬送於加熱區塊6 1 1〜 6 1 4上，則捲帶基板60 1的搬送會只被停止預定的時間（ 圖14的步驟S2、S4)，進行各加熱區塊61 1〜614之捲帶 基板6 0 1的加熱。在此，加熱區塊6 1 1〜6 1 4是沿著捲帶 基板6 0 1的搬送方向而並列配置，加熱區塊6 1 1、6 1 2的 温度是被設定成依次增高於比焊錫融點還要小的範圍內， 加熱區塊6 1 3的温度是被設定成焊錫融點以上，加熱區塊 6 1 4的温度是被設定成比加熱區塊6 1 1、6 1 2的温度還要 小。 因此，可於加熱區塊6 1 1、6 1 2上的電路區塊6 03進 行預熱，於加熱區塊6 1 3上的電路區塊6〇3進行正式加熱 ，於加熱區塊614上的電路區塊603進行冷卻，亦即能夠 一次對捲帶基板601上不同的電路區塊603進行預熱、正 式加熱及冷卻。 在此，若捲帶基板601被靜止於加熱區塊61 1〜614 上，則壓板6 1 6會下降於加熱區塊6 1 3上，可隔著突起部 6 1 7來按壓加熱區塊6 1 3上的電路區塊603。藉此，即使 捲帶基板6 0 1變形，例如形成裙帶菜狀，還是能夠均一地 將熱傳達至捲帶基板60 1，進而可以安定地進行焊錫溶融 處理。並且，可使突起部6 1 7的間隔對應於電路區塊6 0 3 的長度，而於電路區塊603的境界按壓電路區塊603，防 止配置於電路區塊603上的電子零件遭受到機械性的損傷 -52 - (49) (49)200402811 又，若停止捲帶基板60 1的搬送後僅經過預定的時間 ，則捲帶基板6 0 1會只被搬送預定的長度，使捲帶基板 6 0 1上的特定電路區塊6 0 3依次靜止於各加熱區塊6 1 !〜 6 1 4上，而使能夠連續進行捲帶基板6 〇 1上的特定電路區 塊ό 0 3的預熱、正式加熱及冷卻。因此，可階段性地使捲 帶基板6 0 1上的特定電路區塊6 〇 3的温度上升，進而可以 一面防止對電路區塊603造成熱損傷，一面進行回流處理 ’並且能夠迅速地使被焊錫溶融的電路區塊6 0 3的温度下 降，抑止焊錫熱氧化，而來提高製品品質。 又，可使捲帶基板6 0 1上的特定電路區塊6 03依次接 觸於各加熱區塊6 1 1〜6 1 4上，藉此一方面能消除境界的 温度差，另一方面可使電路區塊6〇3的温度上升及下降迅 速化，而使電路區塊603能夠迅速地加溫至設定温度，進 而可以有效率地進行回流處理。 因此，如圖1所示，即使在同一捲帶基板601上，於 焊錫塗佈處理及安裝處理的後連續進行回流處理，還是能 夠防止回流處理被限速而使得焊錫塗佈處理及安裝處理停 滯，製造効率變差。 亦即，即使焊錫塗佈區域22及安裝區域23的電路區 塊6 0 3的焊錫塗佈處理及安裝處理分別終了，還是會因 爲回流區域24的電路區塊603的回流處理尙未終了，而 使得捲帶基板60 1至回流區域24的電路區塊603的回流 處理終了爲止無法搬送。因此，與焊錫塗佈處理及安裝處 -53- (50) (50)200402811 理相較下，當回流處理較費時時，至回流區域2 4的電路 區塊6 0 3的回流處理終了爲止，必須分別使焊錫塗佈區域 22及安裝區域23的電路區塊603的焊錫塗佈處理及安裝 處理待機，而導致焊錫塗佈區域2 2及安裝區域2 3的作動 効率會降低，進而使得製造効率變差。 在此，可使捲帶基板6 01接觸於加熱區塊6 ] 1〜6 1 4 上，而來令捲帶基板6 01能夠迅速地加熱至設定温度，進 而可以使回流處理迅速化。因此，即使是在一次進行焊錫 塗佈處理、安裝處理及回流處理時，照樣能夠防止回流處 理被限速而導致圖3的焊錫塗佈區域22及安裝區域23的 作動効率降低，而使生産効率能夠提升。 又，可沿著捲帶基板6 0 1的搬送方向來並列配置複數 個加熱區塊 6 1 1〜6 1 4，而使能夠在不增加回流處理的時 間下，階段性地提高電路區塊603的温度，可一面防止熱 損傷，一面進行回流處理。 因此，即使是在一次進行焊錫塗佈處理、安裝處理及 回流處理時，照樣可以防止回流處理被限速，且能夠謀求 回流處理之温度履歷的最適化，而不使製品品質劣化，提 高生産効率。 在此，於1次的搬送作業流程所被搬送的捲帶基板 601的長度，例如在圖3的焊錫塗佈區域2 2中，可使對 應於1次的搬送作業流程所被塗佈的焊錫塗佈區域的長度 。又，於1次的搬送作業流程所被塗佈的焊錫塗佈區域的 長度，可設定成1個電路區塊6 0 3的長度的整數倍。 -54- (51) (51)200402811 又，於圖1的焊錫塗佈區域2 2中，可以1次的搬送 作業流程來一次針對複數個電路區塊603進行焊錫塗佈， 藉此而能夠一次針對複數個電路區塊603來階段性地進行 回流處理，而不會使製品品質劣化，提高生産効率。 又’於1次的搬送作業流程所被塗佈的焊錫塗佈區域 的長度與各加熱區塊6 1 ]〜6 1 4的長度並非一定要一致， 亦可使加熱區塊6 1 1〜6 1 4的長度比1次的搬送作業流程 所被塗佈的焊錫塗佈區域的長度還要長。藉此，即使捲帶 基板601的電路區塊60 3的長度被變更，照樣可在不更 換加熱區塊 6 1 1〜6 1 4的情況下，一邊使特定的電路區塊 6 0 3能夠在所有的加熱區塊6 1 1〜6 1 4上加熱至預定時間 以上，一邊搬送捲帶基板60 1，進而可以一方面抑止製品 品質劣化，一方面能夠提高生産効率。 例如，1次的搬送作業流程所被塗佈的焊錫塗佈區域 的長度的最大値，例如可設定成3 2 0mm，各加熱區塊61 1 〜614的長度，例如可設定成361mm。又，圖12之送孔 6 0 2的1間距，例如可設定成4.7 5 m m，1個電路區塊6 0 3 的長度，例如可在送孔602的6〜1 5個間距份量的長度範 圍內變更。此情況，1次的搬送作業流程所被塗佈的焊錫 塗佈區域的長度，可在不超越最大値=3 20mm的範圍內， 以能夠使電路區塊. 603的個數形成最多的方式來加以設定 。例如，若1個電路區塊6 0 3的長度爲送孔602的8個間 距份量的長度，則1個電路區塊6 03的長度會形成4.75x8 =3 8 mm，1次的搬送作業流程所被塗佈的焊錫塗佈區域 -55- (52) (52)200402811 的長度可形成8個電路區塊603的長度= 3〇4mmS320mm 。因此，可設定成]次的搬送作業流程所被搬送的捲帶基 板6 0 1的長度=3 0 4 m m。 又，若使各加熱區塊6 1 1〜6 1 4的長度比1次的搬送 作業流程所被塗佈的焊錫塗佈區域的長度還要長，且將1 次的搬送作業流程所被搬送的捲帶基板60 1的長度設定成 焊錫塗佈區域的長度，則同一電路區塊603的至少一部份 會被複數次靜止於同一加熱區塊6 1 1〜6 1 4上，而導致會 產生加熱時間變長的部份。因應於此，可藉由使加熱溫度 具有一界限的方式來設定加熱區塊611〜614的温度及作 業流程時間，而使能夠維持回流處理時的品質。 又，可以預定間隔來隔開配置加熱區塊 6 1 1〜6 1 4， 藉此來消除加熱區塊6 1 1〜6 1 4間的境界温度，而使電路 區塊603的全體區域能夠均一地保持於設定温度，進而可 以使回流處理時的製品品質維持一定。 又，當以預定間隔來隔開配置加熱區塊6 1 1〜6 1 4時 ，亦可於加熱區塊6 1 1〜6 1 4間的空隙中設置特氟綸（註冊 商標）等的絕緣性樹脂，藉此來使加熱區塊6 1 1〜6 1 4間的 熱傳導能夠更低。 其次’如圖1 3 (c)所示，例如當圖1的焊錫塗佈區域 22或安裝區域23等發生問題時（圖14的步驟S3)，會使 加熱區塊61 1〜614的位置下降（圖14的步驟S5)。然後， 以擋板6 1 5 a、6 1 5 b能夠到達加熱區塊6 1 1〜6 1 4上的方式 ，使擋板615a、61 5b水平移動，在捲帶基板601的上下 -56- (53) (53)200402811 插入檔板6]5a、615b(圖14的步驟S6)。 藉此，即使圖]的焊錫塗佈區域22或安裝區域23等 發生的問題，而造成捲帶基板60 1的搬送長時間停止時， 照樣可以防止捲帶基板601的加熱狀態拉長至必要以上， 而使能夠減少焊錫的熱氧化或接觸不良等。 又，可藉由在捲帶基板601的上下插入擋板615a、 6 15b來使捲帶基板601上下的温度分布均一化，而使能 夠防止捲帶基板60 1變形，例如形成裙帶菜狀。 其次，如圖13(d)〜圖13(f)所示，若在圖1的焊錫塗 佈區域22或安裝區域23等發生的問題被解除（圖14的步 驟S 7)，則會拔出擋板615a、6] 5b (圖14的步驟S 8)。然 後，一邊使加熱區塊6 ] 1〜6 1 4的位置段階性地上升（圖 1 4的步驟S 9)，一邊使加熱區塊6 1 1〜6〗4接觸於捲帶基 板 601。 藉此，即使加熱區塊6 1 1〜6 1 4長時間持續處於脫離 捲帶基板601的狀態，而造成加熱區塊61 1〜614上的捲 帶基板 6 0 1冷卻時，照樣能夠在停止搬送捲帶基板6 0 1 下，階段性地使各加熱區塊61 1〜614上的電路區塊603 的温度上升。 因此，爲了分別使各加熱區塊6 1 1〜6 1 4上的電路區 塊603的温度階段性地上升時，不必使捲帶基板60 1捲回 於相反方向，而來重新搬送捲帶基板6 0 1，所以可在不使 搬送系統複雑化下，再度開始進行回流處理。 又，上述實施形態中，雖是針對在使捲帶基板60 1迴 -57- (54) 200402811 避加熱狀態時，使全體加熱區塊 6 ] 1〜6 1 4從捲帶基板 6 〇 1脫離的方法來進行説明，但亦可例如使加熱區塊6 Π 、6 ] 2、6 1 4原封不動地接觸於捲帶基板6 0 1，而僅使加熱 區塊6 13從捲帶基板60 1脫離。藉此，例如當圖1的焊錫 塗佈區域22或安裝區域23等發生問題，而導致捲帶基板 60 1的搬送長時間停止時，照樣可以一邊持續對捲帶基板 601的電路區塊6 03施以預熱，一邊使正式加熱中斷，進 而能夠降低製品不良率。 又，圖1 2的實施形態中，雖是針對並列設置4個加 熱區塊6 1 1〜6 1 4的方法來進行說明，但亦可並列設置5 個以上的加熱區塊 6 1 1〜6 1 4，而使能夠更緩和地進行電 路區塊6 03的預熱，或者階段性地進行電路區塊603的冷 卻。 又，雖是針對在平板上構成各加熱區塊6 1 1〜6 1 4的 方法來進行説明，但亦可在加熱區塊6 1 I〜6 1 4的接觸面 中，例如在接觸於配置有半導體晶片的區域的部分設置凹 部，藉此來防止加熱區塊6 1 1〜6 1 4直接接觸於配置有半 導體晶片的區域。因此，在捲帶基板60 1上安裝不耐熱的 半導體晶片時，可防止對半導體晶片造成熱損傷。 圖1 5是表示本發明之第8實施形態的電子裝置的製 造裝置的槪略構成立體圖。 在圖15中，在捲帶基板601a、601b中分別配置有電 路區塊6〇3a、603b(沿著長度方向而連接），且在各電 路區塊603a、603b中分別設有電子零件搭載區域。並且 31? -58- (55) (55)200402811 ，在各捲帶基板60 ] a、60 1 b的兩側分別設有供以搬送各 捲帶基板601a、601b的送孔602a、602b (以預定的間距 來設置）。 並且，在加熱區塊6 1 1〜6 1 4上並列配置有2條的捲 帶基板 601a、601b。而且，在使該等 2條的捲帶基板 6 0 1 a、6 0 ] b接觸於加熱區塊6 1 1〜6 1 4上來進行搬送。藉 此，可在加熱區塊 6 1 1〜6 1 4上一次對 2條的捲帶基板 6 〇 ]進行回流 理，而使生産効率提高。 在此，雖是針對在加熱區塊611〜614上並列搬送2 條的捲帶基板 601a、601b時來進行說明，但並非只限於 此，亦可在加熱區塊6 1 1〜6 1 4上並列搬送3條以上的捲 帶基板。 圖1 6是表示本發明之第9實施形態的電子裝置的製 造裝置的側面圖。 在圖16(a)中，回流爐711是藉由具有軌道713的支 持台7 I 2來予以支持著。在此，回流爐7 η是例如在進行 錫焊過程、安裝過程後的回流過程中，對連接於捲帶基板 7 〇〇的被加熱處理體，亦即電路基板進行加熱處理或冷卻 處理者’且設有階段性地使電路基板的温度上升之加熱區 域72 1〜724，及階段性地使電路基板的温度下降之冷卻 區域7 2 5。並且，回流爐7可一次處理連接於捲帶基板 7 0 0的複數個電路基板，或者一個一個地處理連接於捲帶 基板7 〇 0的電路基板。 又，如圖2〇(b)、（c)所示，回流爐71 1會沿著支持台 -59- (56) 200402811 7 ] 2的軌道7 ] 3而自由移動於 b方向是沿著捲帶基板7 0 0的 流爐7 1 1可在自由移動於箭頭 熱區域721〜724及冷卻區域 距之位置上。 【圖式簡單說明】 圖1是表示第1實施形態 圖2是表示第2實施形態 圖3是表示圖2的回流處 圖4是表示圖2的回流處 圖5是表不圖2的回流處 圖6是表示第3實施形態 圖7是表示圖6的回流處 圖8是表示第4實施形·態 圖9是表示第4實施形態 圖10是表示第5實施形喪 圖1 1是表示第6實施形喪 圖12是表示第7實施形| 圖1 3是表示圖1 2的回流 圖1 4是表示圖1 2的回流 圖1 5是表示第8實施形青 圖1 6是表示第9實施形竟 圖17是表示以往電子裝| 箭頭a — b方向。此箭頭a — 搬送方向者。如此一來，回 :a— b方向下，設定於使加 72 5對準電路基板的製品間 之電子裝置的製造方法。 之電子裝置的製造裝置。 理。 理。 理的溫對履歷。 之電子裝置的製造裝置。 理。 之電子裝置的製造方法。 之電子裝置的製造方法。 i之電子裝置的製造方法。 I之電子裝置的製造方法。 I之電子裝置的製造裝置。 處理。 處理的流程圖。 _之電子裝置的製造裝置。 之電子裝置的製造裝置。 ί的製造方法。 -60- (57) (57)200402811 【符號之說明】 31、 ]00、 200、 300、 601、 700 ：捲帶基板 3 1 a 〜3 1 c、] 0 1、3 0 1、8 0 I :電路基板 32a〜32c、 102、 302、 802 ：配線 3 3 a 〜3 3 c、10 3、3 0 3、8 0 3 ：絕緣膜 34a〜34c、 104、 304、 804 ：焊錫膏 35b、35c、105、305、805:半導體晶片 3 6 c :封裝樹脂 B 1 1〜B 1 3 :電路區塊 2 ]:裝載機 2 1 a ·捲出捲軸 2 2 :焊錫塗佈區域 2 3 :安裝區域 2 4 :回流區域 2 5 :卸載機 2 5 a :捲取捲軸 2 6 :切斷區域 2 7 :樹脂封裝區域 111、 311 〜313、412、512:預熱區塊 112、 314、413、514:正式加熱區塊 113、 213、 315、 411、 414、 511、 513、 515、 825a〜825c :冷却區塊 1 1 4、2 1 4 :覆夾孔 1 1 5、2 1 5 :吹出孔 -61 - (58) (58)200402811 2 ] ]、6 1 1〜6 1 4 :加熱區塊 3 1 6 :熱空氣吹送區塊 6 0 2 :送孔 615a、 615b:擋板 6 1 6 :壓板 6 1 7 :突起部 7 1 1 :回流爐 7 1 2 :支持台 7 1 3 :軌道 7 2 1〜7 2 4 :加熱區域 7 2 5 :冷却區域-50- (47) (47) 200402811 to suppress the thermal expansion of the heating block 6]] ~ 6 I 4 so that the tape substrate 6 0] can be accurately transferred to the heating block 6] 1 to 6 1 4 on. The length of each heating block 6 1 1 to 6 I 4 can be set to correspond to the length of the plurality of circuit blocks 603. The size of the baffles 615a and 615b can be set to four heating blocks 6 1 1 to 6 1 The size of 4 plus the size of the gap between the heating block 6 丨 ～ 6 1 4, the size of the pressure plate 6 1 6 can be set to correspond to the size of the heating block 6 1 3. In addition, the length of each heating block 6 1 1 to 6 1 4 is not necessarily set to an integer multiple of the length of one circuit block 603, and a mantissa can also be generated. In addition, the shape of the heating blocks 6 1 1 to 6 1 4 can be set to be flat at least in contact with the tape substrate 60 1. For example, the heating blocks 6 1 1 to 6 1 4 can be formed into a plate shape. Fig. 13 is a side view showing the reflow process of Fig. 12, and Fig. 14 is a flowchart showing the reflow process of Fig. 12. In FIGS. 13 and 14, for example, in the solder coating area 22 and the mounting area 23 of FIG. 1, the tape substrate 601 that is subjected to solder paste printing and electronic component mounting processing is transferred to the heating block 611 to 614 (step S 1 in FIG. 14). In addition, when the tape substrate 601 is transported on the heating blocks 6 1 1 to 6 1 4, the tape substrate 601 can be transported while being brought into contact with the heating blocks 611 to 6 14. With this, when the heating block 6 1 1 to 6 1 4 is brought into contact with the tape substrate 6 01 to heat the tape substrate 6 01, the moving operation of the heating block 6 1 1 to 6 1 4 can be omitted, and further, It is possible to reduce the workflow time of the reflow process. Here, the heating block 6 1 1 to 6 1 4 can be formed into a plate shape, and the tape substrate 6 0 1 can contact the upper surface of the heating block 6 1 1 to 6 1 4 -51-(48) (48) 200402811 Smoothly transport the tape substrate 6 0 1. Next, as shown in FIG. 13 (b), if the tape substrate 60 1 that has been subjected to solder paste printing and electronic component mounting processing is transferred to the heating block 6 1 1 to 6 1 4, the tape substrate 60 The conveyance of 1 is stopped for a predetermined time (steps S2 and S4 in FIG. 14), and the tape substrate 6 0 1 of each heating block 61 1 to 614 is heated. Here, the heating blocks 6 1 1 to 6 1 4 are arranged side by side along the conveyance direction of the tape substrate 6 0 1, and the temperatures of the heating blocks 6 1 1 and 6 1 2 are set to sequentially increase higher than the specific solder. In the range where the melting point is even smaller, the temperature of the heating block 6 1 3 is set to be higher than the solder melting point, and the temperature of the heating block 6 1 4 is set to be higher than that of the heating block 6 1 1, 6 1 2 The temperature is even lower. Therefore, preheating can be performed on the circuit block 6 03 on the heating block 6 1 1 and 6 1 2, and can be officially heated on the circuit block 6 03 on the heating block 6 1 3 and on the heating block 614. The circuit block 603 is cooled, that is, different circuit blocks 603 on the tape substrate 601 can be preheated, formally heated, and cooled at a time. Here, if the tape substrate 601 is stationary on the heating block 61 1 to 614, the pressure plate 6 1 6 will be lowered on the heating block 6 1 3 and the heating block 6 can be pressed through the protruding portion 6 1 7 1 on circuit block 603. Thereby, even if the tape substrate 601 is deformed, for example, it is formed into a wakame shape, heat can be uniformly transmitted to the tape substrate 601, and solder melting processing can be performed stably. In addition, the interval between the protruding portions 6 1 7 can correspond to the length of the circuit block 603, and the circuit block 603 is pressed against the boundary of the circuit block 603 to prevent the electronic parts arranged on the circuit block 603 from being subjected to mechanical damage. Sexual damage -52-(49) (49) 200402811 If the tape substrate 60 1 is stopped for only a predetermined period of time after being transported, the tape substrate 6 0 1 will only be conveyed by a predetermined length to make the tape substrate The specific circuit block 6 0 3 on 6 0 1 is stationary at each heating block 6 1! ~ 6 1 4 in turn, so that the pre-processing of the specific circuit block 6 0 3 on the tape substrate 6 0 1 can be performed continuously. Heat, formal heating and cooling. Therefore, the temperature of the specific circuit block 603 on the tape substrate 601 can be increased in stages, and the thermal damage to the circuit block 603 can be prevented, and the reflow treatment can be performed, and the substrate can be quickly made. The temperature of the solder-melted circuit block 603 drops, which suppresses the thermal oxidation of the solder and improves the product quality. In addition, the specific circuit block 6 03 on the tape substrate 6 01 can be sequentially contacted with each of the heating blocks 6 1 1 to 6 1 4, thereby eliminating the temperature difference in the realm on the one hand and The temperature rise and fall of the circuit block 603 are rapidly accelerated, so that the circuit block 603 can be quickly heated to the set temperature, and then the reflow processing can be performed efficiently. Therefore, as shown in FIG. 1, even if the reflow process is continuously performed after the solder coating process and the mounting process on the same tape substrate 601, the reflow process can be prevented from being limited in speed and the solder coating process and the mounting process can be stopped. , Manufacturing efficiency becomes worse. That is, even if the solder coating process and the mounting process of the circuit block 603 of the solder coating area 22 and the mounting area 23 are respectively completed, the reflow process of the circuit block 603 of the reflow area 24 is not completed, and This makes it impossible to transport the tape substrate 601 to the circuit block 603 of the reflow region 24 until the reflow process is completed. Therefore, compared with the solder coating process and installation place -53- (50) (50) 200402811, when the reflow process is time-consuming, until the reflow process of the circuit block 6 0 3 in the reflow region 24 is completed, The solder coating processing and mounting processing of the circuit block 603 of the solder coating area 22 and the mounting area 23 must be made standby respectively, which results in a decrease in the operating efficiency of the solder coating area 22 and the mounting area 23, thereby making manufacturing efficiency Worse. Here, the tape substrate 60 01 can be brought into contact with the heating block 6] 1 to 6 1 4, so that the tape substrate 60 01 can be quickly heated to a set temperature, and the reflow process can be speeded up. Therefore, even when the solder coating process, the mounting process, and the reflow process are performed once, it is still possible to prevent the speed of the reflow process from being restricted to reduce the operating efficiency of the solder coating region 22 and the mounting region 23 in FIG. 3, thereby increasing production efficiency. Able to improve. In addition, a plurality of heating blocks 6 1 1 to 6 1 4 can be arranged in parallel along the conveying direction of the tape substrate 601, so that the circuit block 603 can be increased in stages without increasing the reflow processing time. The temperature can be reflowed while preventing thermal damage. Therefore, even when the solder coating process, the mounting process, and the reflow process are performed at one time, the reflow process can be prevented from being limited in speed, and the temperature history of the reflow process can be optimized without deteriorating product quality and improving production efficiency. . Here, the length of the tape substrate 601 conveyed in a single transfer operation flow, for example, in the solder coating area 22 shown in FIG. 3, can be applied to the solder that is applied in accordance with the single transfer operation flow. The length of the coated area. In addition, the length of the solder-coated area to be coated in a single transfer operation flow can be set to an integer multiple of the length of one circuit block 603. -54- (51) (51) 200402811 Furthermore, in the solder coating area 22 of FIG. 1, the solder coating can be performed on a plurality of circuit blocks 603 at a time by a single transfer operation flow. The reflow process is performed step by step for a plurality of circuit blocks 603 without deteriorating product quality and improving production efficiency. Also, the length of the solder coating area to be coated in a single transfer operation flow does not necessarily match the length of each heating block 6 1] to 6 1 4, and the heating block 6 1 1 to 6 may also be used. The length of 14 is longer than the length of the solder-coated area to be coated in a single transfer operation. Thereby, even if the length of the circuit block 60 3 of the tape substrate 601 is changed, the specific circuit block 6 0 3 can be used without changing the heating block 6 1 1 to 6 1 4. All the heating blocks 6 1 1 to 6 1 4 are heated for more than a predetermined time, and while the tape substrate 60 1 is being conveyed, the quality deterioration of the product can be suppressed on the one hand, and the production efficiency can be improved on the other. For example, the maximum length of the length of the solder coating area to be coated in a single transfer operation process can be set to, for example, 320 mm, and the length of each heating block 61 1 to 614 can be set to, for example, 361 mm. In addition, the 1 pitch of the feeding hole 6 0 2 in FIG. 12 can be set to, for example, 4.75 mm, and the length of one circuit block 6 0 3 can be, for example, the length range of 6 to 15 pitches of the feeding hole 602. Change. In this case, the length of the solder coating area to be coated in a single transfer operation flow can be within a range not exceeding a maximum of 値 = 3 20mm, so as to form the largest number of circuit blocks. 603 Set it. For example, if the length of one circuit block 603 is the length of the eight pitch portions of the feed hole 602, the length of one circuit block 603 will form 4.75x8 = 3 8 mm. One transfer operation flow The length of the coated solder-coated area -55- (52) (52) 200402811 can form eight circuit blocks 603 = 304mmS320mm. Therefore, it is possible to set the length of the tape substrate 6 0 1 to be conveyed in the conveying process of 3 times = 3 0 4 m m. In addition, if the length of each heating block 6 1 1 to 6 1 4 is longer than the length of the solder coating area applied in a single transfer operation flow, and the single transfer operation flow is transferred The length of the tape substrate 60 1 is set to the length of the solder coating area. At least a part of the same circuit block 603 will be stationary on the same heating block 6 1 1 to 6 1 4 multiple times. A portion where the heating time becomes longer is generated. For this reason, the temperature of the heating blocks 611 to 614 and the operation process time can be set by setting the heating temperature to have a limit, so that the quality at the time of reflow processing can be maintained. In addition, the heating blocks 6 1 1 to 6 1 4 may be arranged at predetermined intervals, thereby eliminating the boundary temperature between the heating blocks 6 1 1 to 6 1 4 and making the entire area of the circuit block 603 uniform. By keeping the temperature at the set temperature, the product quality during the reflow process can be maintained constant. In addition, when the heating blocks 6 1 1 to 6 1 4 are arranged at predetermined intervals, an insulation such as Teflon (registered trademark) may be provided in the gap between the heating blocks 6 1 1 to 6 1 4. In this way, the heat conduction between the heating blocks 6 1 1 to 6 1 4 can be lowered. Secondly, as shown in FIG. 13 (c), for example, when a problem occurs in the solder coating area 22 or the mounting area 23 in FIG. 1 (step S3 in FIG. 14), the positions of the heating blocks 61 1 to 614 are lowered. (Step S5 in FIG. 14). Then, the baffles 6 1 5 a and 6 1 5 b can reach the heating blocks 6 1 1 to 6 1 4 so that the baffles 615a and 61 5b are horizontally moved, and the upper and lower sides of the tape substrate 601 -56- (53) (53) 200402811 Insertion baffle 6] 5a, 615b (step S6 in FIG. 14). With this, even if the problem occurs in the solder coating area 22 or the mounting area 23, which causes the tape substrate 60 1 to stop being transported for a long time, the heating state of the tape substrate 601 can be prevented from being stretched to more than necessary. In order to reduce the thermal oxidation of solder or poor contact. Furthermore, by inserting the baffles 615a and 6 15b above and below the tape substrate 601, the temperature distribution above and below the tape substrate 601 can be made uniform, and the tape substrate 601 can be prevented from being deformed, such as a wakame dish. Next, as shown in FIGS. 13 (d) to 13 (f), if the problem occurred in the solder coating area 22 or the mounting area 23 in FIG. 1 is resolved (step S7 in FIG. 14), it will be pulled out. The shutters 615a, 6] 5b (step S8 in FIG. 14). Then, while raising the positions of the heating blocks 6] 1 to 6 1 4 in steps (step S 9 in FIG. 14), the heating blocks 6 1 1 to 6] 4 are brought into contact with the tape substrate 601. Thereby, even if the heating block 6 1 1 to 6 1 4 continues to be detached from the tape substrate 601 for a long time, and the tape substrate 6 0 1 on the heating block 61 1 to 614 is cooled, it can still be stopped. When the tape substrate 600 is conveyed, the temperature of the circuit block 603 on each of the heating blocks 61 1 to 614 is gradually increased. Therefore, in order to gradually increase the temperature of the circuit block 603 on each of the heating blocks 6 1 1 to 6 1 4, it is not necessary to rewind the tape substrate 60 1 in the opposite direction to re- convey the tape substrate. 601, so the reflow process can be started again without reinstatement of the transport system. Moreover, in the above-mentioned embodiment, when the tape substrate 60 is brought back to 1 -57- (54) 200402811, the entire heating block 6] 1 to 6 1 4 is detached from the tape substrate 6 〇1 in the heating-avoided state. The method is described, but for example, the heating block 6 Π, 6] 2, 6 1 4 may be brought into contact with the tape substrate 6 0 1, and only the heating block 6 13 is removed from the tape substrate 60 1. Break away. Therefore, for example, when a problem occurs in the solder coating area 22 or the mounting area 23 in FIG. 1 and the conveyance of the reel substrate 60 1 is stopped for a long time, the circuit block 6 03 of the reel substrate 601 can be continued while still being used. Preheating can be used to interrupt the formal heating, which can further reduce the product defect rate. In the embodiment of FIG. 12, the method of providing four heating blocks 6 1 1 to 6 1 4 in parallel is described, but five or more heating blocks 6 1 1 to 6 may be installed in parallel. 1 to 4, so that the circuit block 603 can be warmed up more gently, or the circuit block 603 can be cooled in stages. In addition, although the method of forming each of the heating blocks 6 1 1 to 6 1 4 on the flat plate has been described, the contact surfaces of the heating blocks 6 1 I to 6 1 4 may be arranged in contact, for example. A recessed portion is provided in a region having a semiconductor wafer, thereby preventing the heating blocks 6 1 1 to 6 1 4 from directly contacting the region where the semiconductor wafer is disposed. Therefore, when a heat-resistant semiconductor wafer is mounted on the tape substrate 601, thermal damage to the semiconductor wafer can be prevented. Fig. 15 is a perspective view showing a schematic configuration of an electronic device manufacturing device according to an eighth embodiment of the present invention. In FIG. 15, circuit blocks 603a and 603b (connected along the length direction) are arranged in the tape substrates 601a and 601b, respectively, and electronic component mounting areas are provided in the circuit blocks 603a and 603b, respectively. . And 31? -58- (55) (55) 200402811, on each side of each tape substrate 60] a, 60 1 b are provided with feeding holes 602a, 602b (to A predetermined pitch). In addition, two tape substrates 601a and 601b are arranged in parallel on the heating blocks 6 1 1 to 6 1 4. Then, the two tape substrates 6 0 1 a, 6 0] b are brought into contact with the heating blocks 6 1 1 to 6 1 4 and transferred. Thereby, the two reel substrates 6 can be reflowed in the heating block 6 1 1 to 6 1 4 at a time, thereby improving the production efficiency. Here, the description is given of the case where two tape substrates 601a and 601b are transported in parallel on the heating blocks 611 to 614. However, the present invention is not limited to this, and may be performed on the heating blocks 6 1 1 to 6 1 4 3 or more tape substrates are conveyed side by side. Fig. 16 is a side view showing a device for manufacturing an electronic device according to a ninth embodiment of the present invention. In Fig. 16 (a), the reflow furnace 711 is supported by a support table 7 I 2 having a rail 713. Here, the reflow furnace 7 η is, for example, a person who heat-processes or cools the heated substrate connected to the tape substrate 700 during the reflow process after the soldering process and the mounting process. In addition, there are provided heating regions 72 1 to 724 that gradually increase the temperature of the circuit board, and cooling regions 7 2 5 that gradually decrease the temperature of the circuit board. In addition, the reflow furnace 7 can process a plurality of circuit substrates connected to the tape substrate 700 at a time, or process the circuit substrates connected to the tape substrate 700 one by one. In addition, as shown in FIGS. 2 (b) and (c), the reflow furnace 71 1 will move freely in the direction of b along the roll along the track 7] 3 of the support table -59- (56) 200402811 7] 2 The flow furnace 7 1 1 with a substrate 7 0 can be freely moved at the positions of the arrow hot areas 721 to 724 and the distance between the cooling areas. [Brief description of the drawings] FIG. 1 shows a first embodiment, FIG. 2 shows a second embodiment, FIG. 3 shows a reflow point of FIG. 2, FIG. 4 shows a reflow point of FIG. 2, and FIG. 5 shows a reflow point of FIG. 2. Fig. 6 shows a third embodiment. Fig. 7 shows a reflow point of Fig. 6. Fig. 8 shows a fourth embodiment. Fig. 9 shows a fourth embodiment. Fig. 10 shows a fifth embodiment. Fig. 11 shows a first embodiment. Fig. 12 shows the seventh embodiment | Fig. 13 shows the reflow of Fig. 12 Fig. 14 shows the reflow of Fig. 12 Fig. 15 shows the eighth embodiment Fig. 16 shows the ninth embodiment Fig. 17 shows a conventional electronic device | arrow a-b direction. This arrow a — the direction of transport. In this way, in the direction of: a-b, the manufacturing method of the electronic device is set between the products where the plus 72 5 is aligned with the circuit board. Electronic device manufacturing device. Management. Management. Reasonable warm resume. Electronic device manufacturing device. Management. Manufacturing method of electronic device. Manufacturing method of electronic device. Manufacturing method of electronic device of i. I. Manufacturing method of electronic device. I. Manufacturing device for electronic devices. deal with. Process flow chart. _ 的 Manufacturer of electronic devices. Electronic device manufacturing device. ί manufacturing method. -60- (57) (57) 200402811 [Description of Symbols] 31,] 00, 200, 300, 601, 700: Tape substrate 3 1 a to 3 1 c,] 0 1, 3 0 1, 8 0 I : Circuit boards 32a to 32c, 102, 302, 802: Wiring 3 3a to 3 3c, 10 3, 3 0, 8 0 3: Insulation films 34a to 34c, 104, 304, 804: Solder paste 35b, 35c , 105, 305, 805: Semiconductor wafer 3 6 c: Packaging resin B 1 1 ~ B 1 3: Circuit block 2]: Loader 2 1 a · Take-up reel 2 2: Solder coating area 2 3: Mounting area 2 4: reflow area 2 5: unloader 2 5 a: take-up reel 2 6: cutting area 2 7: resin encapsulation area 111, 311 to 313, 412, 512: preheating block 112, 314, 413, 514 : Formal heating block 113, 213, 315, 411, 414, 511, 513, 515, 825a ~ 825c: Cooling block 1 1 4, 2 1 4: Covering hole 1 1 5, 2 1 5: Blowout hole- 61-(58) (58) 200402811 2]], 6 1 1 ~ 6 1 4: heating block 3 1 6: hot air blowing block 6 0 2: sending hole 615a, 615b: baffle 6 1 6: pressure plate 6 1 7: protrusion 7 1 1: reflow furnace 7 1 2: support 7 1 3: rail 7 2 1 to 7 2 4: heating area 7 2 5: Cooling area

Claims (1)

200402811 ⑴ 拾、申請專利範圍 1 · 一種電子裝置的製造裝置，其特徵爲具備：發熱 手段；該發熱手段是藉由控制與在各電路區塊中設有電子 零件搭載區域之連續體的被加熱處理區域的距離來使上述 被加熱處理區域的溫度上升。 2 .如申請專利範圍第1項之電子裝置的製造裝置， 其中上述發熱手段是藉由接近或接觸於上述連續體的被加 熱處理區域的至少一部份來使上述被加熱處理區域的溫度 上升。 3 _如申請專利範圍第2項之電子裝置的製造裝置， 其中上述發熱手段是由上述連續體的背面側或表面側來接 觸。 4 ·如申請專利範圍第1〜3項的其中任一項所記載 之電子裝置的製造裝置，其中上述發熱手段是藉由控制移 動速度或移動位置來階段性地控制被加熱處理區域的溫度 〇 5 ·如申請專利範圍第1〜3項的其中任一項所記載 之電子裝置的製造裝置，其中上述發熱手段爲上下移動或 水平移動。 6 ·如申請專利範圍第1〜3項的其中任一項所記載 之電子裝置的製造裝置，其中上述發熱手段是複數次接觸 於同一被加熱處理區域。 7 ·如申請專利範圍第1〜3項的其中任一項所記載 之電子裝置的製造裝置，其中上述發熱手段具有比塗佈於 •63- (2) (2)200402811 上述電路區塊上的焊錫塗佈區域還要大的接觸面積，一次 針對複數個電路區塊來使溫度上升。 8 ·如申請專利範圍第1〜3項的其中任一項所記載 之電子裝置的製造裝置，其中上述發熱手段具有設定溫度 不同的複數個接觸區域，藉由上述接觸區域依次接觸於上 述被加熱處理區域來階段性地使上述被加熱處理區域的溫 度上升。 9 ·如申請專利範圍第8項之電子裝置的製造裝置， 其中上述設定溫度不同的複數個接觸區域是沿著上述連續 體的搬送方向來排列配置。 1 0 ·如申請專利範圍第8項之電子裝置的製造裝置 ，其中在上述設定溫度不同的接觸區域間設有空隙。 1 1 ·如申請專利範圍第8項之電子裝置的製造裝置 ’其中上述設定溫度不同的複數個接觸區域可個別移動。 1 2 ·如申|靑專利範圍第1〜3項的其中任一項所記 載之電子裝置的製造裝置，其中與上述被加熱處理區域接 觸的上述發熱手段的接觸面爲平坦。 1 3 ·如申請專利範圍第1 2項之電子裝置的製造裝 置’其中上述發熱手段的接觸面設有對應於上述被加熱處 理區域的半導體晶片的配置位置之凹部。 1 4 ·如申請專利範圍第1〜3項的其中任一項所記 載之電子裝置的製造裝置，其中在上述連續體的被加熱處 理區域與上述發熱手段之間，更具備插拔可能的遮蔽手段 -64 - (3) (3)200402811 1 5 ·如申請專利範圍第項的其中任一項所記 載之電子裝置的製造裝置，其中更具備： 計時手段；該計時手段是用以計時上述發熱手段之上 述被加熱處理區域的加熱時間；及 脫離手段，該脫離手段是在上述加熱時間超越預定時 間時’使上述發熱手段脫離上述被加熱處理區域。 1 6 ·如申請專利範圍第2〜3項的其中任一項所記 載之電子裝置的製造裝置，其中更具備： 支持台；該支持台是用以支持上述發熱手段；及 滑動手段；g亥滑動手段是用以沿著上述連續體的搬送 方向來使上述支持台滑動。 1 7 ·如申請專利範圍第1〜3項的其中任一項所記 載之m子裝置的製造裝置，其中更具備：加熱輔助手段； 該加熱輔助手段是由與上述發熱手段不同的方向來加熱上 述連續體的被加熱處理區域。 1 8 ·如申請專利範圍第1〜3項的其中任一項所記 載之電子裝置的製造裝置，其中更具備：溫度下降手段； 該溫度下降手段是在於使藉由上述發熱手段而溫度上升的 上述被加熱處理區域的溫度下降。 1 9 ·如申請專利範圍第1 8項之電子裝置的製造裝 置’其中上述溫度下降手段具備：.平板構件；該平板構件 在面向上述被加熱處理區域的一側具有複數個冷卻劑的吹 出孔。 2 0 ·如申請專利範圍第1 8項之電子裝置的製造裝 -65- (4) (4)200402811 置’其中上述溫度下降手段具備： 由厚度方向的上下來覆蓋上述被加熱處理區域而夾入 之剖面呈π字形的覆夾孔；及 設置於上述覆夾孔的內面之複數個冷卻劑的吹出孔。 2 1 ·如申請專利範圍第1 8項之電子裝置的製造裝 置’其中上述溫度下降手段具備：比上述發熱手段的溫度 ®要低的區域，藉由上述溫度較低的區域接觸於上述連續 體的被加熱處理區域的至少一部份來使上述被加熱處理區 域的溫度下降。 2 2 ·如申請專利範圍第2 1項之電子裝置的製造裝 置’其中上述溫度較低的區域具有比藉由上述焊錫塗佈手 段而塗佈的焊錫塗佈區域還要大的接觸面積，上述溫度下 降手段是一次針對複數個電路區塊來使溫度上升。 2 3 .如申請專利範圍第2 1項之電子裝置的製造裝 置，其中上述溫度較低的區域是排列配置於上述發熱手段 的前段或後段或者上述發熱手段之間。 2 4 · —種電子裝置的製造方法，其中藉由控制在各 電路區塊中設有電子零件搭載區域之連續體的被加熱處理 區域與發熱手段的距離來使上述被加熱處理區域的溫度上 升。 2 5 .如申請專利範圍第2 4項之電子裝置的製造方 法，其中藉由接近或接觸於上述連續體的被加熱處理區域 的至少一部份來使上述被加熱處理區域的溫度上升。 2 6 .如申請專利範圍第2 5項之電子裝置的製造方 -66- (5) (5)200402811 法’其中使複數個電路區塊一次接觸於上述發熱手段。 2 /·如申請專利範圍第2 5或2 6項之電子裝置的 製造方法，其中使同一電路區塊複數次接觸於上述發熱手 2 8 ·如申請專利範圍第2 4〜2 6項的其中任一項 所記載之電子裝置的製造方法，其中具備： 將上述連續體的第1被加熱處理區域搬送至上述發熱 手段上之過程；及 藉由使搬送至上述發熱手段上的上述第1被加熱處理 區域接觸於上述發熱手段來使上述第1被加熱處理區域的 溫度上升之過程；及 將上述連續體的第2被加熱處理區域搬送至上述發熱 手段上之過程；及 藉由使搬送至上述發熱手段上的上述第2被加熱處理 區域接觸於上述發熱手段來使上述第2被加熱處理區域的 溫度上升之過程。 2 9 ·如申I靑專利軺圍第2 4〜2 6項的其中任一項 所記載之電子裝置的製造方法，其中具備： 將上述連續體的被加熱處理區域搬送至上述發熱手段 上之過程；及 藉由使上述發熱手段階段性地接近於搬送至上述發熱 手段上的被加熱處理區域來階段性地使上述加熱處理區域 的溫度上升之過程。 3 〇 .如申§靑專利車β圍第2 4〜2 6項的其中任一項 -67 - (6) (6)200402811 所記載之電子裝置的製造方法，其中具備： 在上述發熱手段之上述被加熱處理區域的加熱後或加 熱中，使上述發熱手段脫離上述被加熱處理區域之過程。 3 1 _如申請專利範圍第3 0項之電子裝置的製造方 法5其中具備··在上述被脫離的上述發熱手段與上述被加 熱處理區域之間插入遮熱板之過程。 3 2 ·如申請專利範圍第3 0項之電子裝置的製造方 法，其中具備··使由上述被加熱處理區域脫離的上述發熱 手段再度接觸於上述被加熱處理區域之過程。 3 3 ·如申請專利範圍第3 2項之電子裝置的製造方 法，其中具備··在使由上述被加熱處理區域脫離的上述發 熱手段再度接觸於上述被加熱處理區域之前，將熱風吹至 上述被加熱處理區域之過程。 3 4 ·如申I靑專利範圍第2 4〜2 6項的其中任一項 所記載之電子裝置的製造方法，其中具備： 將上述連續體的第1被加熱處理區域搬送至第1發熱 手段上，且將上述連續體的第2被加熱處理區域搬送至比 上述第1發熱手段還要高溫的第2發熱手段上之過程；及 藉由使搬送至上述第1發熱手段上的上述第1被加熱 處理區域接觸於上述第1發熱手段來使上述第1被加熱處 理區域的溫度上升，且藉由使搬送至上述第2發熱手段上 的上述第2被加熱處理區域接觸於上述第2發熱手段來使 上述第2被加熱處理區域的溫度上升至比上述第1被加熱 處理區域的溫度還要高之過程。 -68- (7) (7)200402811 3 5 ·如申請專利範圍第3 4項之電子裝置的製造方 法，其中上述第1發熱手段及上述第2發熱手段是以上述 隹1發熱手段能夠形成削段之方式來沿著上述連續體的搬 送方向而排列配置。 3 6 ·如申請專利範圍第3 4項之電子裝置的製造方 法，其中具備·· 在上述第1及第2發熱手段之上述被加熱處理區域的 加熱後或加熱中，在使上述第1發熱手段接觸於上述第工 被加熱處理區域下，使上述第2發熱手段脫離上述第2被 加熱處理區域之過程。 3 7 ·如申請專利範圍第3 6項之.電子裝置的製造方 法’其中具備：使由上述第2被加熱處理區域脫離的上述 第2發熱手段再度接觸於上述第2被加熱處理區域之過程 〇 3 8 ·如申請專利範圍第3 7項之電子裝置的製造方 法，其中具備··在使由上述第2被加熱處理區域脫離的上 述第2發熱手段再度接觸於上述第2被加熱處理區域之前 ’將熱風吹至上述第2被加熱處理區域之過程。 3 9 ·如申請專利範圍第3 8項之電子裝置的製造方 法’其中更具備：以上述發熱手段的位置能夠對應於製品 胃距之方式’沿著上述連續體的搬送方向來使支持上述發 熱手段的支持台滑動之過程。 4 0 ·如申請專利範圍第2 4〜2 6項的其中任一項 所記載之電子裝置的製造方法，其中具備：使藉由上述發 -69 - (8) (8)200402811 熱手段而溫度上升的被加熱處理區域的溫度下降之過程。 4 1 ·如申請專利範圍第4 0項之電子裝置的製造方 法，其中錯由使比上述發熱手段的溫度還要低的區域接觸 於藉由上述發熱手段而溫度上升的被加熱處理區域的至少 一部份來使上述被加熱處理區域的溫度下降。 4 2 ·如申請專利範圍第4 1項之電子裝置的製造方 法’其中上述溫度較低的區域是排列配置於上述發熱手段 的前段或後段或者上述發熱手段之間。 4 3 ·如申請專利範圍第4 0項之電子裝置的製造方 法，其中藉由使氣體吹至藉由上述發熱手段而溫度上升的 被加熱處理區域的單面或兩面來使上述被加熱處理區域的 溫度下降。 4 4 · 一種電子裝置的製造程式，其特徵是使下述步 驟執行於電腦中，該步驟是藉由控制在各電路區塊中設有 電子零件搭載區域之連續體的被加熱處理區域與發熱手段 的距離來使上述被加熱處理區域的溫度上升。200402811 ⑴ Pickup, patent application scope 1 · An electronic device manufacturing device, which is characterized by: heating means; the heating means is controlled and heated by a continuum provided with an electronic component mounting area in each circuit block The distance of the processing area increases the temperature of the heated processing area. 2. The manufacturing apparatus for an electronic device according to item 1 of the scope of patent application, wherein the heating means is to increase the temperature of the heated processing area by approaching or contacting at least a part of the heated processing area of the continuous body. . 3 _ The manufacturing device of an electronic device as described in the second item of the patent application scope, wherein the heating means is contacted by the back side or the front side of the continuous body. 4. The manufacturing apparatus of the electronic device according to any one of claims 1 to 3, wherein the heating means is to control the temperature of the area to be heated stepwise by controlling the moving speed or moving position. 5. The manufacturing apparatus of the electronic device according to any one of the items 1 to 3 of the scope of patent application, wherein the heating means is a vertical movement or a horizontal movement. 6. The manufacturing apparatus for an electronic device according to any one of claims 1 to 3, wherein the heat generating means is in contact with the same heat-treated region multiple times. 7 · The manufacturing apparatus of the electronic device according to any one of the items 1 to 3 of the scope of the patent application, wherein the heat generating means has a coating ratio higher than that applied to the circuit block described in • 63- (2) (2) 200402811 The solder-coated area also has a large contact area, and the temperature is raised for a plurality of circuit blocks at a time. 8 · The manufacturing apparatus for an electronic device according to any one of claims 1 to 3, wherein the heating means has a plurality of contact areas with different set temperatures, and the contact areas are sequentially contacted with the heated part. The processing area gradually increases the temperature of the heat-treated area. 9. The manufacturing apparatus of an electronic device according to item 8 of the scope of patent application, wherein the plurality of contact areas having different set temperatures are arranged along the conveyance direction of the continuum. 10 · The manufacturing apparatus of an electronic device as described in the eighth item of the patent application, wherein a gap is provided between the contact areas with different set temperatures. 1 1 · An electronic device manufacturing device such as the item 8 of the scope of patent application ′ wherein the plurality of contact areas with different set temperatures described above can be individually moved. 1 2 The manufacturing apparatus of an electronic device as described in any one of items 1 to 3 of the patent application, wherein the contact surface of the heating means in contact with the heat-treated region is flat. 1 3 · The manufacturing device of an electronic device according to item 12 of the scope of patent application ', wherein the contact surface of the heating means is provided with a recessed portion corresponding to the arrangement position of the semiconductor wafer to be heated. 1 4 · The manufacturing apparatus for an electronic device according to any one of the items 1 to 3 of the scope of patent application, further comprising a shield that can be inserted and removed between the heated region of the continuous body and the heating means. Means-64-(3) (3) 200402811 1 5 · The manufacturing device for an electronic device as described in any one of the items in the scope of patent application, further including: a timing means; the timing means is used to time the above-mentioned fever A heating time of the heated region; and a detaching means that detaches the heating means from the heated region when the heating time exceeds a predetermined time. 1 6 · The manufacturing apparatus for an electronic device as described in any one of the items 2 to 3 of the scope of patent application, further including: a support stand; the support stand is used to support the above-mentioned heating means; and the sliding means; g Hai The sliding means slides the support table along the conveyance direction of the continuous body. 1 7 · The manufacturing device for the m sub-device described in any one of claims 1 to 3, further including: a heating assist means; the heating assist means is heated in a direction different from the heating means The heated region of the continuous body. 18 · The manufacturing apparatus for an electronic device according to any one of claims 1 to 3 of the scope of patent application, further comprising: a temperature lowering means; the temperature lowering means is for increasing the temperature by the heat generating means. The temperature of the heat-treated region decreases. 1 9 · The manufacturing device for an electronic device according to item 18 of the scope of the patent application, wherein the temperature lowering means includes: a flat plate member; the flat plate member has a plurality of coolant blow-out holes on a side facing the heated area; . 2 0 If the manufacturing equipment of the electronic device No. 18 in the scope of patent application -65- (4) (4) 200402811, the above-mentioned temperature reduction means is provided with: A cross-section of the cladding hole having a π-shaped cross section; and a plurality of coolant blow-out holes provided on the inner surface of the cladding hole. 2 1 · The manufacturing device for an electronic device according to item 18 of the scope of the patent application, wherein the temperature lowering means includes a region lower than the temperature ® of the heating means, and the continuous body is contacted by the lower temperature region. At least a part of the heated area to reduce the temperature of the heated area. 2 2 · If the manufacturing apparatus of an electronic device according to item 21 of the patent application 'wherein the lower temperature region has a larger contact area than the solder-coated region coated by the above-mentioned solder coating means, the above-mentioned The temperature decrease means increases the temperature for a plurality of circuit blocks at a time. 2 3. The manufacturing device for an electronic device according to item 21 of the scope of the patent application, wherein the lower temperature region is arranged in front or back of the heating means or between the heating means. 2 4 · A method for manufacturing an electronic device, wherein the temperature of the heat-treated region is raised by controlling the distance between a heat-treated region and a heating means of a continuum provided with an electronic component mounting region in each circuit block. . 25. The method of manufacturing an electronic device according to item 24 of the scope of patent application, wherein the temperature of the heat-treated region is raised by approaching or contacting at least a part of the heat-treated region of the continuous body. 2 6. The method of manufacturing an electronic device according to the scope of application for the patent No. 25 -66- (5) (5) 200402811 method 'wherein a plurality of circuit blocks are brought into contact with the above-mentioned heating means at one time. 2 / · If the method of manufacturing an electronic device in the scope of the patent application No. 25 or 26, in which the same circuit block is contacted with the above-mentioned heating hand multiple times 2 8 · in which of the scope of the patent application No. 2 4 ~ 26 The method for manufacturing an electronic device according to any one of the methods, comprising: a process of transferring the first heat-treated region of the continuous body to the heating means; and transferring the first heat-treated region to the heating means. A process in which the heat-treated region is brought into contact with the heat-generating means to raise the temperature of the first heat-treated region; and a process of transporting the second heat-treated region of the continuum to the heat-generating means; and A process in which the second heat-treated region on the heat-generating means contacts the heat-generating means to raise the temperature of the second heat-treated region. 2 9 · The method for manufacturing an electronic device as described in any one of items 2 4 to 26 in the patent application I, including: transferring the heated region of the continuum to the heating means; A process; and a process of gradually increasing the temperature of the heat-treated region by gradually bringing the heat-generating means close to the heat-treated region transferred to the heat-generating means. 3 〇. The application of any of the items 2-4 to 2 of the patented car β-section No. 2 -67-(6) (6) 200402811, including: The process of removing the heating means from the heated region after or during the heating of the heated region. 3 1 _ If the manufacturing method of electronic device No. 30 of the scope of patent application 5 includes a process of inserting a heat shielding plate between the above-mentioned heating means that is detached and the above-mentioned heat-treated region. 3 2 · The method for manufacturing an electronic device according to item 30 of the scope of patent application, which includes a process of re-contacting the heat-generating means separated from the heat-treated area to the heat-treated area again. 3 3 · The method for manufacturing an electronic device according to item 32 of the scope of patent application, which includes: · blowing the hot air to the heated area before the heating means separated from the heated area is brought into contact with the heated area again; Process of heated area. 3 4 · The method for manufacturing an electronic device as described in any one of items 2 to 4 to 6 of the patent scope, including: transporting the first heat-treated region of the continuum to the first heating means And transferring the second heat-treated region of the continuum to the second heating means having a higher temperature than the first heating means; and transferring the first heating means to the first heating means. The heated area is brought into contact with the first heat-generating means to increase the temperature of the first heated area, and the second heated-area that is transported to the second heat-generating means is brought into contact with the second heat. Means for raising the temperature of the second heat-treated region to a temperature higher than the temperature of the first heat-treated region. -68- (7) (7) 200402811 3 5 · The manufacturing method of the electronic device according to item 34 of the patent application scope, wherein the first heating means and the second heating means can be formed by the above-mentioned 隹 1 heating means. The steps are arranged along the conveyance direction of the continuous body. 3 6 · The method for manufacturing an electronic device according to item 34 of the scope of patent application, which includes: · heating the first area after or during the heating of the heat-treated area of the first and second heating means. The process of contacting the means with the second heat-treated region under the first heat-treated region to separate the second heat-generating means from the second heat-treated region. 37. As described in item 36 of the scope of patent application, a method for manufacturing an electronic device, which includes a process of re-contacting the second heating means separated from the second heat-treated region to the second heat-treated region. 〇 3 8 The method for manufacturing an electronic device according to item 37 of the patent application scope, which includes: the second heating means for bringing the second heat-treated region away from the second heat-treated region to contact the second heat-treated region again. Previously, the process of blowing hot air to the second heated area. 3 9 · The method for manufacturing an electronic device according to item 38 of the scope of the patent application, which further includes: a method in which the position of the heating means can correspond to the stomach distance of the product, along the conveyance direction of the continuum to support the heating Means the process of support desk sliding. 4 0 · The method for manufacturing an electronic device according to any one of the items 2 to 4 to 26 in the scope of the patent application, which includes: making the temperature by thermal means of the above-mentioned -69-(8) (8) 200402811 thermal The process of rising the temperature of the heated area. 4 1 · The manufacturing method of an electronic device according to item 40 of the scope of patent application, in which at least a region lower than the temperature of the heat generating means is brought into contact with at least the heat-treated region whose temperature is increased by the heat generating means. Partly to reduce the temperature of the heated area. 4 2 · The method for manufacturing an electronic device according to item 41 of the scope of patent application ', wherein the lower temperature region is arranged in front of or behind the heating means or between the heating means. 4 3 · The method for manufacturing an electronic device according to item 40 of the patent application scope, wherein the heated region is heated by blowing a gas to one or both sides of the heated region whose temperature is raised by the heating means. The temperature dropped. 4 4 · A manufacturing program for an electronic device, which is characterized in that the following steps are performed in a computer. This step is to control the heated area and heat generation of the continuum provided with the electronic component mounting area in each circuit block. Means to increase the temperature of the heat-treated region.
TW092106361A 2002-03-22 2003-03-21 Manufacturing apparatus of electronic device, manufacturing method of electronic device, and manufacturing program of electronic device TWI258192B (en)

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