JP2528509Y2 - ウエハプロービング装置 - Google Patents
ウエハプロービング装置Info
- Publication number
- JP2528509Y2 JP2528509Y2 JP1990095257U JP9525790U JP2528509Y2 JP 2528509 Y2 JP2528509 Y2 JP 2528509Y2 JP 1990095257 U JP1990095257 U JP 1990095257U JP 9525790 U JP9525790 U JP 9525790U JP 2528509 Y2 JP2528509 Y2 JP 2528509Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- probe
- probe card
- suction
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 claims description 36
- 235000012431 wafers Nutrition 0.000 description 31
- 238000004891 communication Methods 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990095257U JP2528509Y2 (ja) | 1990-09-10 | 1990-09-10 | ウエハプロービング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990095257U JP2528509Y2 (ja) | 1990-09-10 | 1990-09-10 | ウエハプロービング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0452740U JPH0452740U (OSRAM) | 1992-05-06 |
| JP2528509Y2 true JP2528509Y2 (ja) | 1997-03-12 |
Family
ID=31833851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990095257U Expired - Lifetime JP2528509Y2 (ja) | 1990-09-10 | 1990-09-10 | ウエハプロービング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528509Y2 (OSRAM) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6278842A (ja) * | 1985-10-01 | 1987-04-11 | Oki Electric Ind Co Ltd | プロ−ブカ−ドの検査方法 |
| JPS63266847A (ja) * | 1987-04-24 | 1988-11-02 | Hitachi Ltd | ウエハプロ−バ |
-
1990
- 1990-09-10 JP JP1990095257U patent/JP2528509Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0452740U (OSRAM) | 1992-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI381166B (zh) | 檢查用固持構件及檢查用固持構件之製造方法 | |
| JP2016197707A (ja) | 基板保持方法、基板保持装置、処理方法及び処理装置 | |
| KR20190116037A (ko) | 웨이퍼 척킹 장치 및 이를 포함하는 웨이퍼 테스트 장비 | |
| JP2528509Y2 (ja) | ウエハプロービング装置 | |
| JP3586106B2 (ja) | Ic試験装置用プローブカード | |
| JPS61252642A (ja) | 半導体ic試験用チツプ支持台 | |
| CN209927903U (zh) | 一种探针卡槽盒 | |
| JPH02224354A (ja) | 半導体装置のコンタクトホールの目ずれ検査方法 | |
| JP3493081B2 (ja) | 表示パネルの吸着テーブル | |
| KR200170555Y1 (ko) | 웨이퍼 프로버 척 | |
| JP2008309540A (ja) | 半導体チップの検査方法及び検査用治具 | |
| KR102676466B1 (ko) | 검사 장치, 체인지 키트, 체인지 키트의 교환 방법 | |
| JP5343278B2 (ja) | 半導体試験装置 | |
| JPS58137773A (ja) | 回路基板テストシステムに用いるフイクスチア | |
| JPS6381830A (ja) | プロ−ブ装置 | |
| JPH0758168A (ja) | プローブ装置 | |
| JPH09252045A (ja) | ウェハ保持装置 | |
| JP2000174080A (ja) | プローバの触針のクリーニング機構 | |
| KR20250032802A (ko) | 프로버의 웨이퍼 흡착 장치 및 방법 | |
| KR100815138B1 (ko) | 프로브 스테이션용 척 및 이를 이용한 웨이퍼 검사방법 | |
| JPH04206848A (ja) | 半導体評価装置 | |
| JPS59225538A (ja) | 半導体装置の検査方法 | |
| JPH04228B2 (OSRAM) | ||
| JPH10206480A (ja) | 導体回路基板検査装置における導体回路基板の支持方法 | |
| JPH0399450A (ja) | 半導体試験装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |