JP2523856Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2523856Y2
JP2523856Y2 JP1989089491U JP8949189U JP2523856Y2 JP 2523856 Y2 JP2523856 Y2 JP 2523856Y2 JP 1989089491 U JP1989089491 U JP 1989089491U JP 8949189 U JP8949189 U JP 8949189U JP 2523856 Y2 JP2523856 Y2 JP 2523856Y2
Authority
JP
Japan
Prior art keywords
fuse
length
semiconductor device
bent
bent portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989089491U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328737U (enrdf_load_html_response
Inventor
元彦 山本
勝 久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989089491U priority Critical patent/JP2523856Y2/ja
Publication of JPH0328737U publication Critical patent/JPH0328737U/ja
Application granted granted Critical
Publication of JP2523856Y2 publication Critical patent/JP2523856Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP1989089491U 1989-07-28 1989-07-28 半導体装置 Expired - Fee Related JP2523856Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989089491U JP2523856Y2 (ja) 1989-07-28 1989-07-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989089491U JP2523856Y2 (ja) 1989-07-28 1989-07-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH0328737U JPH0328737U (enrdf_load_html_response) 1991-03-22
JP2523856Y2 true JP2523856Y2 (ja) 1997-01-29

Family

ID=31639067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989089491U Expired - Fee Related JP2523856Y2 (ja) 1989-07-28 1989-07-28 半導体装置

Country Status (1)

Country Link
JP (1) JP2523856Y2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6133054A (en) * 1999-08-02 2000-10-17 Motorola, Inc. Method and apparatus for testing an integrated circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60954B2 (ja) * 1980-12-19 1985-01-11 セイコーインスツルメンツ株式会社 多結晶シリコン・フユ−ズ・メモリとその製造方法
JPS61147548A (ja) * 1984-12-21 1986-07-05 Nec Ic Microcomput Syst Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
JPH0328737U (enrdf_load_html_response) 1991-03-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees