JP2522805Y2 - 光通信装置 - Google Patents
光通信装置Info
- Publication number
- JP2522805Y2 JP2522805Y2 JP1989087187U JP8718789U JP2522805Y2 JP 2522805 Y2 JP2522805 Y2 JP 2522805Y2 JP 1989087187 U JP1989087187 U JP 1989087187U JP 8718789 U JP8718789 U JP 8718789U JP 2522805 Y2 JP2522805 Y2 JP 2522805Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- housing
- optical communication
- laser module
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 title claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 238000005476 soldering Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Optical Couplings Of Light Guides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989087187U JP2522805Y2 (ja) | 1989-07-24 | 1989-07-24 | 光通信装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989087187U JP2522805Y2 (ja) | 1989-07-24 | 1989-07-24 | 光通信装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0326105U JPH0326105U (enrdf_load_html_response) | 1991-03-18 |
| JP2522805Y2 true JP2522805Y2 (ja) | 1997-01-16 |
Family
ID=31636838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989087187U Expired - Lifetime JP2522805Y2 (ja) | 1989-07-24 | 1989-07-24 | 光通信装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2522805Y2 (enrdf_load_html_response) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008544700A (ja) * | 2005-06-20 | 2008-12-04 | インテル コーポレイション | 受動熱伝達を備える光学トランスポンダ |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6252726B1 (en) * | 1999-09-02 | 2001-06-26 | Lightlogic, Inc. | Dual-enclosure optoelectronic packages |
| JP2004017626A (ja) * | 2002-06-20 | 2004-01-22 | Ricoh Co Ltd | 画像形成装置 |
| JP4391351B2 (ja) * | 2004-07-29 | 2009-12-24 | 古河電気工業株式会社 | 冷却装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60191212A (ja) * | 1984-03-12 | 1985-09-28 | Matsushita Electric Ind Co Ltd | 光回路デバイス |
-
1989
- 1989-07-24 JP JP1989087187U patent/JP2522805Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008544700A (ja) * | 2005-06-20 | 2008-12-04 | インテル コーポレイション | 受動熱伝達を備える光学トランスポンダ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0326105U (enrdf_load_html_response) | 1991-03-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6490160B2 (en) | Vapor chamber with integrated pin array | |
| US4145708A (en) | Power module with isolated substrates cooled by integral heat-energy-removal means | |
| US5168919A (en) | Air cooled heat exchanger for multi-chip assemblies | |
| US4267559A (en) | Low thermal impedance light-emitting diode package | |
| EP1282206A1 (en) | Method and apparatus for cooling electronic or optoelectronic devices | |
| US6920162B2 (en) | Electronic or opto-electronic packages | |
| WO2022149337A1 (ja) | 光トランシーバー | |
| JP2522805Y2 (ja) | 光通信装置 | |
| US5508885A (en) | IC card having improved heat dissipation | |
| US20110222567A1 (en) | optoelectronic transistor outline (to)-can header assembly having a configuration that improves heat dissipation and reduces thermal resistance | |
| JP4728522B2 (ja) | ヒートシンク | |
| CN212164066U (zh) | 一种便于散热的光模块 | |
| WO1993000689A1 (en) | Thermister device of positive characteristic | |
| JPH1050926A (ja) | ハイブリッドモジュール | |
| JP2002175899A (ja) | Ｘ線発生装置 | |
| JP4411506B2 (ja) | 光通信器 | |
| JPH11329899A (ja) | コンデンサの冷却構造 | |
| JP4019701B2 (ja) | 冷却手段を有する光部品 | |
| JP2002043779A (ja) | 電子部品の組み付け構造 | |
| JP2004079964A (ja) | 光半導体モジュール及びそれを用いた光通信システム | |
| JP2001060735A (ja) | 光半導体素子収納用パッケージ | |
| JP2002111116A (ja) | 発光素子モジュール | |
| JP2004128049A (ja) | 光送受信器 | |
| JP2002118215A (ja) | 半導体装置 | |
| JP2002093964A (ja) | 電子機器の筐体構造 |