JP2519160Y2 - 防湿型筐体 - Google Patents
防湿型筐体Info
- Publication number
- JP2519160Y2 JP2519160Y2 JP1990081468U JP8146890U JP2519160Y2 JP 2519160 Y2 JP2519160 Y2 JP 2519160Y2 JP 1990081468 U JP1990081468 U JP 1990081468U JP 8146890 U JP8146890 U JP 8146890U JP 2519160 Y2 JP2519160 Y2 JP 2519160Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- board
- substrate
- potting material
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 24
- 238000004382 potting Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 description 24
- 230000002265 prevention Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990081468U JP2519160Y2 (ja) | 1990-07-31 | 1990-07-31 | 防湿型筐体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990081468U JP2519160Y2 (ja) | 1990-07-31 | 1990-07-31 | 防湿型筐体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0440573U JPH0440573U (enrdf_load_html_response) | 1992-04-07 |
JP2519160Y2 true JP2519160Y2 (ja) | 1996-12-04 |
Family
ID=31627440
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990081468U Expired - Lifetime JP2519160Y2 (ja) | 1990-07-31 | 1990-07-31 | 防湿型筐体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519160Y2 (enrdf_load_html_response) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8474824B2 (en) * | 2008-11-10 | 2013-07-02 | Eaton Corporation | Pressure sensing module having an integrated seal plate and method of assembling pressure sensing module |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6318069A (ja) * | 1986-07-09 | 1988-01-25 | Matsushita Electric Ind Co Ltd | スパツタ方法 |
-
1990
- 1990-07-31 JP JP1990081468U patent/JP2519160Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0440573U (enrdf_load_html_response) | 1992-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |