JP2513796Y2 - 半導体装置用リ―ドフレ―ム及びプレス金型 - Google Patents
半導体装置用リ―ドフレ―ム及びプレス金型Info
- Publication number
- JP2513796Y2 JP2513796Y2 JP1989080964U JP8096489U JP2513796Y2 JP 2513796 Y2 JP2513796 Y2 JP 2513796Y2 JP 1989080964 U JP1989080964 U JP 1989080964U JP 8096489 U JP8096489 U JP 8096489U JP 2513796 Y2 JP2513796 Y2 JP 2513796Y2
- Authority
- JP
- Japan
- Prior art keywords
- die
- die pad
- tie bar
- bending
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 238000005452 bending Methods 0.000 claims description 23
- 238000003825 pressing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000009924 canning Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Wire Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989080964U JP2513796Y2 (ja) | 1989-07-11 | 1989-07-11 | 半導体装置用リ―ドフレ―ム及びプレス金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989080964U JP2513796Y2 (ja) | 1989-07-11 | 1989-07-11 | 半導体装置用リ―ドフレ―ム及びプレス金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0320446U JPH0320446U (enrdf_load_stackoverflow) | 1991-02-28 |
| JP2513796Y2 true JP2513796Y2 (ja) | 1996-10-09 |
Family
ID=31626478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989080964U Expired - Lifetime JP2513796Y2 (ja) | 1989-07-11 | 1989-07-11 | 半導体装置用リ―ドフレ―ム及びプレス金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2513796Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH061797B2 (ja) * | 1986-02-19 | 1994-01-05 | 住友金属鉱山株式会社 | リードフレームの製造方法 |
| JPS63101124U (enrdf_load_stackoverflow) * | 1986-11-20 | 1988-07-01 |
-
1989
- 1989-07-11 JP JP1989080964U patent/JP2513796Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0320446U (enrdf_load_stackoverflow) | 1991-02-28 |
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