JP2511423Y2 - 余剰半田吸着ランド付き基板 - Google Patents
余剰半田吸着ランド付き基板Info
- Publication number
- JP2511423Y2 JP2511423Y2 JP1990055359U JP5535990U JP2511423Y2 JP 2511423 Y2 JP2511423 Y2 JP 2511423Y2 JP 1990055359 U JP1990055359 U JP 1990055359U JP 5535990 U JP5535990 U JP 5535990U JP 2511423 Y2 JP2511423 Y2 JP 2511423Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- land
- board
- conductor
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 102
- 239000004020 conductor Substances 0.000 claims description 71
- 239000000758 substrate Substances 0.000 claims description 26
- 238000005476 soldering Methods 0.000 description 15
- 238000002474 experimental method Methods 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990055359U JP2511423Y2 (ja) | 1990-05-29 | 1990-05-29 | 余剰半田吸着ランド付き基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990055359U JP2511423Y2 (ja) | 1990-05-29 | 1990-05-29 | 余剰半田吸着ランド付き基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415264U JPH0415264U (enrdf_load_stackoverflow) | 1992-02-06 |
| JP2511423Y2 true JP2511423Y2 (ja) | 1996-09-25 |
Family
ID=31578244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990055359U Expired - Lifetime JP2511423Y2 (ja) | 1990-05-29 | 1990-05-29 | 余剰半田吸着ランド付き基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511423Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2765373B2 (ja) * | 1992-05-29 | 1998-06-11 | 日本精機株式会社 | プリント基板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5978650U (ja) * | 1982-11-19 | 1984-05-28 | シャープ株式会社 | プリント基板 |
| JPS6210469U (enrdf_load_stackoverflow) * | 1985-07-02 | 1987-01-22 | ||
| JPS6466993A (en) * | 1987-09-07 | 1989-03-13 | Sharp Kk | Printed wiring board |
-
1990
- 1990-05-29 JP JP1990055359U patent/JP2511423Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0415264U (enrdf_load_stackoverflow) | 1992-02-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4720324A (en) | Process for manufacturing printed circuit boards | |
| GB2080629A (en) | Printed circuit boards | |
| US3388465A (en) | Electronic assembly soldering process | |
| JP2511423Y2 (ja) | 余剰半田吸着ランド付き基板 | |
| US20040140123A1 (en) | Printed circuit board comprising a contact sleeve that is mounted thereon | |
| US5376026A (en) | Method of mounting a tab type male terminal and an assembly of tab type male terminals | |
| JPH01300588A (ja) | プリント配線板及びそのはんだ付け方法 | |
| JPH0946029A (ja) | 余剰半田吸着パターン付き基板 | |
| JP2004214444A (ja) | 板金実装基板 | |
| JP2553985Y2 (ja) | 電子部品 | |
| JPH0736808Y2 (ja) | 自動車用コントローラのランド構造 | |
| JP2554694Y2 (ja) | プリント基板 | |
| JP3245568B2 (ja) | はんだ付け装置 | |
| JP3070365B2 (ja) | プリント配線板 | |
| JPS61292992A (ja) | 壁部材を備えた印刷配線板の半田付け方法 | |
| JPH0350789A (ja) | 電子部品装置の半田付け方法 | |
| JPH1022699A (ja) | 基板実装方法 | |
| JP2765373B2 (ja) | プリント基板 | |
| JP2554693Y2 (ja) | プリント基板 | |
| JPH06102483B2 (ja) | プリント基板の搬送装置 | |
| JPH0546100A (ja) | 発光ダイオードランプ及び表示板 | |
| JP2543858Y2 (ja) | プリント基板 | |
| JPS62128191A (ja) | 印刷配線板 | |
| JPS5849653Y2 (ja) | プリント配線板 | |
| JPH0650376U (ja) | プリント基板 |