JP2510571Y2 - ガラス封止型半導体素子収納用パッケ―ジ - Google Patents
ガラス封止型半導体素子収納用パッケ―ジInfo
- Publication number
- JP2510571Y2 JP2510571Y2 JP1989112284U JP11228489U JP2510571Y2 JP 2510571 Y2 JP2510571 Y2 JP 2510571Y2 JP 1989112284 U JP1989112284 U JP 1989112284U JP 11228489 U JP11228489 U JP 11228489U JP 2510571 Y2 JP2510571 Y2 JP 2510571Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- lid
- melting
- semiconductor element
- point glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989112284U JP2510571Y2 (ja) | 1989-09-26 | 1989-09-26 | ガラス封止型半導体素子収納用パッケ―ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989112284U JP2510571Y2 (ja) | 1989-09-26 | 1989-09-26 | ガラス封止型半導体素子収納用パッケ―ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0351844U JPH0351844U (bg) | 1991-05-20 |
JP2510571Y2 true JP2510571Y2 (ja) | 1996-09-11 |
Family
ID=31660733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989112284U Expired - Fee Related JP2510571Y2 (ja) | 1989-09-26 | 1989-09-26 | ガラス封止型半導体素子収納用パッケ―ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2510571Y2 (bg) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5491057A (en) * | 1977-12-28 | 1979-07-19 | Nec Corp | Semiconductor device |
JPS61168247A (ja) * | 1985-01-19 | 1986-07-29 | Nec Kansai Ltd | セラミツクパツケ−ジ |
JPH02174144A (ja) * | 1988-12-26 | 1990-07-05 | Sumitomo Electric Ind Ltd | 半導体装置用パッケージ |
-
1989
- 1989-09-26 JP JP1989112284U patent/JP2510571Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0351844U (bg) | 1991-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2510571Y2 (ja) | ガラス封止型半導体素子収納用パッケ―ジ | |
JP2003133452A (ja) | 電子装置の製造方法 | |
JP2962939B2 (ja) | 半導体素子収納用パッケージ | |
JP2685083B2 (ja) | 半導体素子収納用パッケージの製造方法 | |
JP2750237B2 (ja) | 電子部品収納用パッケージ | |
JP2801448B2 (ja) | センサー素子収納用パッケージ | |
JP2555178Y2 (ja) | 半導体素子収納用パッケージ | |
JP2545400Y2 (ja) | 半導体素子収納用パッケージ | |
JPH0629330A (ja) | 半導体装置 | |
JP2545402Y2 (ja) | 半導体素子収納用パッケージ | |
JP2552419Y2 (ja) | 半導体素子収納用パッケージ | |
JP2545401Y2 (ja) | 半導体素子収納用パッケージ | |
JP2552554Y2 (ja) | 半導体素子収納用パッケージ | |
JP2518721Y2 (ja) | 半導体素子収納用パッケージ | |
JP2842716B2 (ja) | 半導体素子収納用パッケージ | |
JPH0723961Y2 (ja) | 半導体素子収納用パッケージ | |
JP3176267B2 (ja) | 半導体素子収納用パッケージ | |
JP2759300B2 (ja) | ガラス封止型半導体素子収納用パッケージ | |
JP2873130B2 (ja) | 半導体素子収納用パッケージ | |
JP2931481B2 (ja) | 半導体素子収納用パッケージ | |
JPH05121581A (ja) | 半導体素子収納用パツケージ | |
JP2948956B2 (ja) | センサー素子収納用パッケージ | |
JP2508067Y2 (ja) | 半導体素子収納用パッケ―ジ | |
JPH05326738A (ja) | 半導体素子収納用パッケージ | |
JPH0613483A (ja) | 半導体素子収納用パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |