JP2506808Y2 - 放熱板用半導体固定装置 - Google Patents

放熱板用半導体固定装置

Info

Publication number
JP2506808Y2
JP2506808Y2 JP2423690U JP2423690U JP2506808Y2 JP 2506808 Y2 JP2506808 Y2 JP 2506808Y2 JP 2423690 U JP2423690 U JP 2423690U JP 2423690 U JP2423690 U JP 2423690U JP 2506808 Y2 JP2506808 Y2 JP 2506808Y2
Authority
JP
Japan
Prior art keywords
semiconductor
fixing
heat sink
bent portion
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2423690U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03113842U (en, 2012
Inventor
昌彦 吉田
務 菊地原
知広 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP2423690U priority Critical patent/JP2506808Y2/ja
Publication of JPH03113842U publication Critical patent/JPH03113842U/ja
Application granted granted Critical
Publication of JP2506808Y2 publication Critical patent/JP2506808Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2423690U 1990-03-09 1990-03-09 放熱板用半導体固定装置 Expired - Lifetime JP2506808Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2423690U JP2506808Y2 (ja) 1990-03-09 1990-03-09 放熱板用半導体固定装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2423690U JP2506808Y2 (ja) 1990-03-09 1990-03-09 放熱板用半導体固定装置

Publications (2)

Publication Number Publication Date
JPH03113842U JPH03113842U (en, 2012) 1991-11-21
JP2506808Y2 true JP2506808Y2 (ja) 1996-08-14

Family

ID=31527205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2423690U Expired - Lifetime JP2506808Y2 (ja) 1990-03-09 1990-03-09 放熱板用半導体固定装置

Country Status (1)

Country Link
JP (1) JP2506808Y2 (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5118086B2 (ja) * 2009-03-02 2013-01-16 富士通テレコムネットワークス株式会社 半導体素子の取付構造

Also Published As

Publication number Publication date
JPH03113842U (en, 2012) 1991-11-21

Similar Documents

Publication Publication Date Title
JP2506808Y2 (ja) 放熱板用半導体固定装置
JPH07297572A (ja) プリント基板組立装置
JPH0638430Y2 (ja) 発熱体取り付け構造
JP2539612Y2 (ja) 電気部品の取付構造
JPH0537507Y2 (en, 2012)
JPH0721035Y2 (ja) スピーカユニットの取付構造
JP2940528B2 (ja) トランジスタ組立取付用放熱板
JP2543252Y2 (ja) 放熱プレート
JPH08760Y2 (ja) 部品取付装置
JPH058711Y2 (en, 2012)
JPH0510393Y2 (en, 2012)
JP3304919B2 (ja) 回路基板の取付構造および方法
JPH0440282Y2 (en, 2012)
JPH0611581Y2 (ja) 発熱部品取付機構
JPH09116284A (ja) 放熱器
JPS6234449Y2 (en, 2012)
JP2537630Y2 (ja) トランジスタ押えバネの弛み止め構造
JPH0617310Y2 (ja) 放熱板の固定構造
JPS6144446Y2 (en, 2012)
JPH0745990Y2 (ja) 放熱器の取付け構造
JPS583349Y2 (ja) プリント配線基板等の支持具
JP2570289Y2 (ja) 電子部品の放熱器
JPH0316314Y2 (en, 2012)
JP3048757U (ja) 放熱板の基板への取付構造
JPH0536844U (ja) 放熱板取付構造