JP2505263Y2 - ウエハの表面処理装置のウエハ移送装置 - Google Patents
ウエハの表面処理装置のウエハ移送装置Info
- Publication number
- JP2505263Y2 JP2505263Y2 JP2760390U JP2760390U JP2505263Y2 JP 2505263 Y2 JP2505263 Y2 JP 2505263Y2 JP 2760390 U JP2760390 U JP 2760390U JP 2760390 U JP2760390 U JP 2760390U JP 2505263 Y2 JP2505263 Y2 JP 2505263Y2
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- transfer
- wafer
- dedicated
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012546 transfer Methods 0.000 title claims description 213
- 238000004381 surface treatment Methods 0.000 title description 34
- 235000012431 wafers Nutrition 0.000 claims description 220
- 230000007246 mechanism Effects 0.000 claims description 101
- 238000012545 processing Methods 0.000 claims description 86
- 238000004140 cleaning Methods 0.000 claims description 37
- 238000007781 pre-processing Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 15
- 230000003028 elevating effect Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2760390U JP2505263Y2 (ja) | 1990-03-16 | 1990-03-16 | ウエハの表面処理装置のウエハ移送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2760390U JP2505263Y2 (ja) | 1990-03-16 | 1990-03-16 | ウエハの表面処理装置のウエハ移送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03117834U JPH03117834U (enrdf_load_stackoverflow) | 1991-12-05 |
| JP2505263Y2 true JP2505263Y2 (ja) | 1996-07-24 |
Family
ID=31530444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2760390U Expired - Fee Related JP2505263Y2 (ja) | 1990-03-16 | 1990-03-16 | ウエハの表面処理装置のウエハ移送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505263Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378290B (zh) * | 2018-11-29 | 2024-02-20 | 无锡江松科技股份有限公司 | 硅片热处理装置及硅片盒流转方法 |
-
1990
- 1990-03-16 JP JP2760390U patent/JP2505263Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03117834U (enrdf_load_stackoverflow) | 1991-12-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH11145249A (ja) | 基板の整列装置 | |
| JP2006179757A (ja) | 基板処理装置 | |
| JP3210154B2 (ja) | 基板の姿勢変換装置 | |
| JP2505263Y2 (ja) | ウエハの表面処理装置のウエハ移送装置 | |
| JP3214503B2 (ja) | 洗浄装置 | |
| JP3248789B2 (ja) | 基板ウェット処理方法および処理システム | |
| JP3346823B2 (ja) | 基板ウェット処理装置 | |
| JP3194592B2 (ja) | 枚葉式ウェハー洗浄装置 | |
| JP3559099B2 (ja) | 基板処理装置 | |
| JP3346834B2 (ja) | 基板ウェット処理装置 | |
| JP2977153B2 (ja) | ウェハ移し替え装置 | |
| JP2743274B2 (ja) | 基板処理装置および基板搬送装置 | |
| JP2544056Y2 (ja) | ウエハの表面処理装置 | |
| JP2541887Y2 (ja) | ウエハの表面処理装置 | |
| JP3197304B2 (ja) | 基板液処理装置及び基板液処理方法 | |
| JP3210133B2 (ja) | 基板ウェット処理装置 | |
| JPH08195368A (ja) | 洗浄方法及びその装置並びに移載装置 | |
| JP3197539B2 (ja) | 基板の洗浄装置及び洗浄方法 | |
| JPH0821566B2 (ja) | 半導体ウエ−ハの洗浄方法 | |
| JP2002329703A (ja) | 基板洗浄装置及び方法 | |
| JP3730803B2 (ja) | 基板姿勢変換装置および方法 | |
| WO2023182113A1 (ja) | 基板処理装置 | |
| JP2004274069A (ja) | 基板処理装置 | |
| JP2001053130A (ja) | 容器の搬入出装置及び搬入出方法 | |
| KR101352570B1 (ko) | 기판 이송 방법 및 기판 처리 설비 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |