JPH03117834U - - Google Patents

Info

Publication number
JPH03117834U
JPH03117834U JP2760390U JP2760390U JPH03117834U JP H03117834 U JPH03117834 U JP H03117834U JP 2760390 U JP2760390 U JP 2760390U JP 2760390 U JP2760390 U JP 2760390U JP H03117834 U JPH03117834 U JP H03117834U
Authority
JP
Japan
Prior art keywords
cassette
transport
wafer transfer
processing
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2760390U
Other languages
English (en)
Japanese (ja)
Other versions
JP2505263Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2760390U priority Critical patent/JP2505263Y2/ja
Publication of JPH03117834U publication Critical patent/JPH03117834U/ja
Application granted granted Critical
Publication of JP2505263Y2 publication Critical patent/JP2505263Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2760390U 1990-03-16 1990-03-16 ウエハの表面処理装置のウエハ移送装置 Expired - Fee Related JP2505263Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2760390U JP2505263Y2 (ja) 1990-03-16 1990-03-16 ウエハの表面処理装置のウエハ移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2760390U JP2505263Y2 (ja) 1990-03-16 1990-03-16 ウエハの表面処理装置のウエハ移送装置

Publications (2)

Publication Number Publication Date
JPH03117834U true JPH03117834U (enrdf_load_stackoverflow) 1991-12-05
JP2505263Y2 JP2505263Y2 (ja) 1996-07-24

Family

ID=31530444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2760390U Expired - Fee Related JP2505263Y2 (ja) 1990-03-16 1990-03-16 ウエハの表面処理装置のウエハ移送装置

Country Status (1)

Country Link
JP (1) JP2505263Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109378290A (zh) * 2018-11-29 2019-02-22 无锡市江松科技有限公司 硅片热处理装置及硅片盒流转方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109378290A (zh) * 2018-11-29 2019-02-22 无锡市江松科技有限公司 硅片热处理装置及硅片盒流转方法
CN109378290B (zh) * 2018-11-29 2024-02-20 无锡江松科技股份有限公司 硅片热处理装置及硅片盒流转方法

Also Published As

Publication number Publication date
JP2505263Y2 (ja) 1996-07-24

Similar Documents

Publication Publication Date Title
EP0960434B1 (en) Device for processing semiconductor wafers
KR960002616A (ko) 기판표면 처리장치 및 기판표면 처리방법
JPH03117834U (enrdf_load_stackoverflow)
WO2004075285A1 (ja) 基板処理装置
JPH02116736U (enrdf_load_stackoverflow)
JPH0180934U (enrdf_load_stackoverflow)
JPH03225847A (ja) ウエハカセツトストツカ
JPH0648846Y2 (ja) 薄膜デバイスの製造設備
JPH0534108Y2 (enrdf_load_stackoverflow)
JP2835869B2 (ja) 運搬装置
JP3628864B2 (ja) 基板処理装置
TW444249B (en) Manufacturing line for semiconductor device
JPS63106128U (enrdf_load_stackoverflow)
JPH0716657B2 (ja) 半導体基板収納箱洗浄装置
JPH0338636U (enrdf_load_stackoverflow)
JPS6230334A (ja) ウエツト処理装置
JPS63250130A (ja) 半導体ウエハ処理装置
JPS6311727Y2 (enrdf_load_stackoverflow)
JPH0184436U (enrdf_load_stackoverflow)
JPS62133546U (enrdf_load_stackoverflow)
JPS62158825U (enrdf_load_stackoverflow)
JPS61179749U (enrdf_load_stackoverflow)
JPH01174920U (enrdf_load_stackoverflow)
JPH0429525U (enrdf_load_stackoverflow)
JPS58213436A (ja) 半導体装置の製造装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees