JP2504995Y2 - 光半導体チップキャリア - Google Patents

光半導体チップキャリア

Info

Publication number
JP2504995Y2
JP2504995Y2 JP1988100683U JP10068388U JP2504995Y2 JP 2504995 Y2 JP2504995 Y2 JP 2504995Y2 JP 1988100683 U JP1988100683 U JP 1988100683U JP 10068388 U JP10068388 U JP 10068388U JP 2504995 Y2 JP2504995 Y2 JP 2504995Y2
Authority
JP
Japan
Prior art keywords
semiconductor laser
chip carrier
layer
semiconductor chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988100683U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221770U (enExample
Inventor
雄一 小田切
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1988100683U priority Critical patent/JP2504995Y2/ja
Publication of JPH0221770U publication Critical patent/JPH0221770U/ja
Application granted granted Critical
Publication of JP2504995Y2 publication Critical patent/JP2504995Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1988100683U 1988-07-29 1988-07-29 光半導体チップキャリア Expired - Lifetime JP2504995Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988100683U JP2504995Y2 (ja) 1988-07-29 1988-07-29 光半導体チップキャリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988100683U JP2504995Y2 (ja) 1988-07-29 1988-07-29 光半導体チップキャリア

Publications (2)

Publication Number Publication Date
JPH0221770U JPH0221770U (enExample) 1990-02-14
JP2504995Y2 true JP2504995Y2 (ja) 1996-07-24

Family

ID=31328979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988100683U Expired - Lifetime JP2504995Y2 (ja) 1988-07-29 1988-07-29 光半導体チップキャリア

Country Status (1)

Country Link
JP (1) JP2504995Y2 (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60166172U (ja) * 1984-04-11 1985-11-05 ソニー株式会社 半導体発光装置

Also Published As

Publication number Publication date
JPH0221770U (enExample) 1990-02-14

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