JPH0221770U - - Google Patents
Info
- Publication number
- JPH0221770U JPH0221770U JP1988100683U JP10068388U JPH0221770U JP H0221770 U JPH0221770 U JP H0221770U JP 1988100683 U JP1988100683 U JP 1988100683U JP 10068388 U JP10068388 U JP 10068388U JP H0221770 U JPH0221770 U JP H0221770U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- semiconductor
- fused
- surface layer
- resistance surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100683U JP2504995Y2 (ja) | 1988-07-29 | 1988-07-29 | 光半導体チップキャリア |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100683U JP2504995Y2 (ja) | 1988-07-29 | 1988-07-29 | 光半導体チップキャリア |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0221770U true JPH0221770U (enExample) | 1990-02-14 |
| JP2504995Y2 JP2504995Y2 (ja) | 1996-07-24 |
Family
ID=31328979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988100683U Expired - Lifetime JP2504995Y2 (ja) | 1988-07-29 | 1988-07-29 | 光半導体チップキャリア |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2504995Y2 (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60166172U (ja) * | 1984-04-11 | 1985-11-05 | ソニー株式会社 | 半導体発光装置 |
-
1988
- 1988-07-29 JP JP1988100683U patent/JP2504995Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60166172U (ja) * | 1984-04-11 | 1985-11-05 | ソニー株式会社 | 半導体発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2504995Y2 (ja) | 1996-07-24 |