JP2025506486A5 - - Google Patents
Info
- Publication number
- JP2025506486A5 JP2025506486A5 JP2024547490A JP2024547490A JP2025506486A5 JP 2025506486 A5 JP2025506486 A5 JP 2025506486A5 JP 2024547490 A JP2024547490 A JP 2024547490A JP 2024547490 A JP2024547490 A JP 2024547490A JP 2025506486 A5 JP2025506486 A5 JP 2025506486A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon
- insulator structure
- ozone
- bath
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/670,167 US11798802B2 (en) | 2022-02-11 | 2022-02-11 | Methods for stripping and cleaning semiconductor structures |
| US17/670,167 | 2022-02-11 | ||
| PCT/US2023/061670 WO2023154644A1 (en) | 2022-02-11 | 2023-01-31 | Methods for stripping and cleaning semiconductor structures |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2025506486A JP2025506486A (ja) | 2025-03-11 |
| JP2025506486A5 true JP2025506486A5 (https=) | 2026-01-16 |
| JP7825725B2 JP7825725B2 (ja) | 2026-03-06 |
Family
ID=85410106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024547490A Active JP7825725B2 (ja) | 2022-02-11 | 2023-01-31 | 半導体構造体の剥離および洗浄方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11798802B2 (https=) |
| EP (1) | EP4476761B1 (https=) |
| JP (1) | JP7825725B2 (https=) |
| KR (1) | KR20240151781A (https=) |
| CN (1) | CN118843923B (https=) |
| TW (1) | TW202349491A (https=) |
| WO (1) | WO2023154644A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026015619A1 (en) * | 2024-07-10 | 2026-01-15 | Globalwafers Co., Ltd. | Methods of processing semiconductor-on-insulator structures using clean-and-etch operation |
| US20260018407A1 (en) | 2024-07-11 | 2026-01-15 | Globalwafers Co., Ltd. | Methods for tunable dielectric thickness of a semiconductor substrate using back surface heating |
| WO2026015773A1 (en) | 2024-07-11 | 2026-01-15 | Globalwafers Co., Ltd. | Methods for semiconductor substrate processing by densifying a dielectric layer |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020157686A1 (en) | 1997-05-09 | 2002-10-31 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
| US7456113B2 (en) * | 2000-06-26 | 2008-11-25 | Applied Materials, Inc. | Cleaning method and solution for cleaning a wafer in a single wafer process |
| US6927176B2 (en) * | 2000-06-26 | 2005-08-09 | Applied Materials, Inc. | Cleaning method and solution for cleaning a wafer in a single wafer process |
| JP2002329691A (ja) | 2001-04-27 | 2002-11-15 | Shin Etsu Handotai Co Ltd | シリコンウェーハの洗浄方法 |
| JP2005217312A (ja) | 2004-01-30 | 2005-08-11 | Sumitomo Mitsubishi Silicon Corp | Ｓｉｍｏｘウェーハの製造方法及びその方法で製造されたｓｉｍｏｘウェーハ |
| US7479460B2 (en) * | 2005-08-23 | 2009-01-20 | Asm America, Inc. | Silicon surface preparation |
| JP5365057B2 (ja) | 2008-04-11 | 2013-12-11 | 株式会社Ｓｕｍｃｏ | 貼り合わせウェーハの製造方法 |
| FR2944645B1 (fr) * | 2009-04-21 | 2011-09-16 | Soitec Silicon On Insulator | Procede d'amincissement d'un substrat silicium sur isolant |
| US8796116B2 (en) * | 2011-01-31 | 2014-08-05 | Sunedison Semiconductor Limited | Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods |
| US20150357180A1 (en) | 2014-06-10 | 2015-12-10 | Sunedison Semiconductor Limited (Uen201334164H) | Methods for cleaning semiconductor substrates |
| FR3085603B1 (fr) | 2018-09-11 | 2020-08-14 | Soitec Silicon On Insulator | Procede pour le traitement d'un susbtrat soi dans un equipement de nettoyage monoplaque |
| US11282739B2 (en) | 2019-12-13 | 2022-03-22 | Globalwafers Co., Ltd. | Methods for removing an oxide film from a SOI structure and methods for preparing a SOI structure |
-
2022
- 2022-02-11 US US17/670,167 patent/US11798802B2/en active Active
-
2023
- 2023-01-31 KR KR1020247029809A patent/KR20240151781A/ko active Pending
- 2023-01-31 CN CN202380025920.6A patent/CN118843923B/zh active Active
- 2023-01-31 WO PCT/US2023/061670 patent/WO2023154644A1/en not_active Ceased
- 2023-01-31 EP EP23708124.5A patent/EP4476761B1/en active Active
- 2023-01-31 JP JP2024547490A patent/JP7825725B2/ja active Active
- 2023-02-09 TW TW112104637A patent/TW202349491A/zh unknown
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