TW202349491A - 剝除及清洗半導體結構之方法 - Google Patents

剝除及清洗半導體結構之方法 Download PDF

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Publication number
TW202349491A
TW202349491A TW112104637A TW112104637A TW202349491A TW 202349491 A TW202349491 A TW 202349491A TW 112104637 A TW112104637 A TW 112104637A TW 112104637 A TW112104637 A TW 112104637A TW 202349491 A TW202349491 A TW 202349491A
Authority
TW
Taiwan
Prior art keywords
silicon
insulator structure
bath
ozone
insulator
Prior art date
Application number
TW112104637A
Other languages
English (en)
Chinese (zh)
Inventor
劉慶旻
海河 梁
楊鈞婷
Original Assignee
環球晶圓股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 環球晶圓股份有限公司 filed Critical 環球晶圓股份有限公司
Publication of TW202349491A publication Critical patent/TW202349491A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/72—Ethers of polyoxyalkylene glycols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02—Inorganic compounds ; Elemental compounds
    • C11D3/04—Water-soluble compounds
    • C11D3/042—Acids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/40—Arrangements for supplying or controlling air or other gases for drying solid materials or objects using gases other than air
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW112104637A 2022-02-11 2023-02-09 剝除及清洗半導體結構之方法 TW202349491A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/670,167 US11798802B2 (en) 2022-02-11 2022-02-11 Methods for stripping and cleaning semiconductor structures
US17/670,167 2022-02-11

Publications (1)

Publication Number Publication Date
TW202349491A true TW202349491A (zh) 2023-12-16

Family

ID=85410106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112104637A TW202349491A (zh) 2022-02-11 2023-02-09 剝除及清洗半導體結構之方法

Country Status (7)

Country Link
US (1) US11798802B2 (https=)
EP (1) EP4476761B1 (https=)
JP (1) JP7825725B2 (https=)
KR (1) KR20240151781A (https=)
CN (1) CN118843923B (https=)
TW (1) TW202349491A (https=)
WO (1) WO2023154644A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026015619A1 (en) * 2024-07-10 2026-01-15 Globalwafers Co., Ltd. Methods of processing semiconductor-on-insulator structures using clean-and-etch operation
US20260018407A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Methods for tunable dielectric thickness of a semiconductor substrate using back surface heating
WO2026015773A1 (en) 2024-07-11 2026-01-15 Globalwafers Co., Ltd. Methods for semiconductor substrate processing by densifying a dielectric layer

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020157686A1 (en) 1997-05-09 2002-10-31 Semitool, Inc. Process and apparatus for treating a workpiece such as a semiconductor wafer
US7456113B2 (en) * 2000-06-26 2008-11-25 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
US6927176B2 (en) * 2000-06-26 2005-08-09 Applied Materials, Inc. Cleaning method and solution for cleaning a wafer in a single wafer process
JP2002329691A (ja) 2001-04-27 2002-11-15 Shin Etsu Handotai Co Ltd シリコンウェーハの洗浄方法
JP2005217312A (ja) 2004-01-30 2005-08-11 Sumitomo Mitsubishi Silicon Corp Ｓｉｍｏｘウェーハの製造方法及びその方法で製造されたｓｉｍｏｘウェーハ
US7479460B2 (en) * 2005-08-23 2009-01-20 Asm America, Inc. Silicon surface preparation
JP5365057B2 (ja) 2008-04-11 2013-12-11 株式会社Ｓｕｍｃｏ 貼り合わせウェーハの製造方法
FR2944645B1 (fr) * 2009-04-21 2011-09-16 Soitec Silicon On Insulator Procede d'amincissement d'un substrat silicium sur isolant
US8796116B2 (en) * 2011-01-31 2014-08-05 Sunedison Semiconductor Limited Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods
US20150357180A1 (en) 2014-06-10 2015-12-10 Sunedison Semiconductor Limited (Uen201334164H) Methods for cleaning semiconductor substrates
FR3085603B1 (fr) 2018-09-11 2020-08-14 Soitec Silicon On Insulator Procede pour le traitement d'un susbtrat soi dans un equipement de nettoyage monoplaque
US11282739B2 (en) 2019-12-13 2022-03-22 Globalwafers Co., Ltd. Methods for removing an oxide film from a SOI structure and methods for preparing a SOI structure

Also Published As

Publication number Publication date
CN118843923B (zh) 2026-04-14
JP2025506486A (ja) 2025-03-11
WO2023154644A1 (en) 2023-08-17
JP7825725B2 (ja) 2026-03-06
US20230260779A1 (en) 2023-08-17
EP4476761A1 (en) 2024-12-18
US11798802B2 (en) 2023-10-24
KR20240151781A (ko) 2024-10-18
CN118843923A (zh) 2024-10-25
EP4476761B1 (en) 2025-12-10

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