JP2024531580A5 - - Google Patents
Info
- Publication number
- JP2024531580A5 JP2024531580A5 JP2024514544A JP2024514544A JP2024531580A5 JP 2024531580 A5 JP2024531580 A5 JP 2024531580A5 JP 2024514544 A JP2024514544 A JP 2024514544A JP 2024514544 A JP2024514544 A JP 2024514544A JP 2024531580 A5 JP2024531580 A5 JP 2024531580A5
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- metal layer
- package
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/482,294 US12100649B2 (en) | 2021-09-22 | 2021-09-22 | Package comprising an integrated device with a back side metal layer |
| US17/482,294 | 2021-09-22 | ||
| PCT/US2022/041235 WO2023048882A1 (en) | 2021-09-22 | 2022-08-23 | Package comprising an integrated device with a back side metal layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024531580A JP2024531580A (ja) | 2024-08-29 |
| JP2024531580A5 true JP2024531580A5 (enExample) | 2025-08-19 |
Family
ID=83283303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024514544A Pending JP2024531580A (ja) | 2021-09-22 | 2022-08-23 | 背面金属層を有する集積デバイスを備えるパッケージ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12100649B2 (enExample) |
| EP (1) | EP4406025A1 (enExample) |
| JP (1) | JP2024531580A (enExample) |
| KR (1) | KR20240058871A (enExample) |
| CN (1) | CN117941065A (enExample) |
| TW (1) | TW202329367A (enExample) |
| WO (1) | WO2023048882A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230245985A1 (en) * | 2022-02-01 | 2023-08-03 | Skyworks Solutions, Inc. | Shielded wafer level chip scale package with shield connected to ground via redistribution layers |
| US20250385153A1 (en) * | 2024-06-12 | 2025-12-18 | Avago Technologies International Sales Pte. Limited | Thermal management systems and methods for semiconductor devices |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8461676B2 (en) * | 2011-09-09 | 2013-06-11 | Qualcomm Incorporated | Soldering relief method and semiconductor device employing same |
| CN104471707B (zh) * | 2012-07-26 | 2017-07-04 | 株式会社村田制作所 | 半导体模块 |
| DE102015101440B4 (de) * | 2015-02-02 | 2021-05-06 | Infineon Technologies Ag | Halbleiterbauelement mit unter dem Package angeordnetem Chip und Verfahren zur Montage desselben auf einer Anwendungsplatine |
| US10453802B2 (en) * | 2017-08-30 | 2019-10-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure, semiconductor device and method for manufacturing the same |
| US10332862B2 (en) | 2017-09-07 | 2019-06-25 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
| US10937741B2 (en) * | 2018-11-16 | 2021-03-02 | STATS ChipPAC Pte. Ltd. | Molded laser package with electromagnetic interference shield and method of making |
| KR102632367B1 (ko) * | 2018-12-04 | 2024-02-02 | 삼성전기주식회사 | 반도체 패키지 |
| US20210175178A1 (en) * | 2019-12-05 | 2021-06-10 | Qualcomm Incorporated | Package comprising a double-sided redistribution portion |
| US20210280507A1 (en) * | 2020-03-05 | 2021-09-09 | Qualcomm Incorporated | Package comprising dummy interconnects |
| US11551939B2 (en) * | 2020-09-02 | 2023-01-10 | Qualcomm Incorporated | Substrate comprising interconnects embedded in a solder resist layer |
-
2021
- 2021-09-22 US US17/482,294 patent/US12100649B2/en active Active
-
2022
- 2022-08-23 WO PCT/US2022/041235 patent/WO2023048882A1/en not_active Ceased
- 2022-08-23 TW TW111131670A patent/TW202329367A/zh unknown
- 2022-08-23 KR KR1020247008618A patent/KR20240058871A/ko active Pending
- 2022-08-23 EP EP22769480.9A patent/EP4406025A1/en active Pending
- 2022-08-23 CN CN202280061746.6A patent/CN117941065A/zh active Pending
- 2022-08-23 JP JP2024514544A patent/JP2024531580A/ja active Pending
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