JP2024521248A5 - - Google Patents
Info
- Publication number
- JP2024521248A5 JP2024521248A5 JP2023562686A JP2023562686A JP2024521248A5 JP 2024521248 A5 JP2024521248 A5 JP 2024521248A5 JP 2023562686 A JP2023562686 A JP 2023562686A JP 2023562686 A JP2023562686 A JP 2023562686A JP 2024521248 A5 JP2024521248 A5 JP 2024521248A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- thick film
- film layer
- multilayer structure
- inorganic particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2103986A FR3122034B1 (fr) | 2021-04-16 | 2021-04-16 | Procédé de fabrication d’une structure multicouche |
| FR2103986 | 2021-04-16 | ||
| PCT/FR2022/050691 WO2022219283A1 (fr) | 2021-04-16 | 2022-04-12 | Procédé de fabrication d'une structure multicouche |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024521248A JP2024521248A (ja) | 2024-05-30 |
| JP2024521248A5 true JP2024521248A5 (https=) | 2025-03-25 |
Family
ID=76375216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023562686A Pending JP2024521248A (ja) | 2021-04-16 | 2022-04-12 | 多層構造の製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20240190120A1 (https=) |
| EP (1) | EP4324020A1 (https=) |
| JP (1) | JP2024521248A (https=) |
| KR (1) | KR20230171960A (https=) |
| CN (1) | CN117280442A (https=) |
| FR (1) | FR3122034B1 (https=) |
| WO (1) | WO2022219283A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115613013B (zh) * | 2022-10-31 | 2024-06-04 | 中国科学院化学研究所 | 一种复合绝缘层及其制备方法 |
| EP4700820A1 (en) * | 2024-08-19 | 2026-02-25 | Umicore | Compound semiconductor layered structure and processes for preparing a compound semiconductor layered structure |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5354900B2 (ja) * | 2007-12-28 | 2013-11-27 | 株式会社半導体エネルギー研究所 | 半導体基板の作製方法 |
| DE102009000888B4 (de) * | 2009-02-16 | 2011-03-24 | Semikron Elektronik Gmbh & Co. Kg | Halbleiteranordnung |
| JP2013506035A (ja) * | 2009-09-25 | 2013-02-21 | フェローテック（ユーエスエー）コーポレイション | 高強度の結合及びコーティング混合物 |
| FR2961515B1 (fr) * | 2010-06-22 | 2012-08-24 | Commissariat Energie Atomique | Procede de realisation d'une couche mince de silicium monocristallin sur une couche de polymere |
| FR2984597B1 (fr) * | 2011-12-20 | 2016-07-29 | Commissariat Energie Atomique | Fabrication d’une structure souple par transfert de couches |
| US9219049B2 (en) * | 2013-12-13 | 2015-12-22 | Infineon Technologies Ag | Compound structure and method for forming a compound structure |
| DE102015112649B4 (de) * | 2015-07-31 | 2021-02-04 | Infineon Technologies Ag | Verfahren zum bilden eines halbleiterbauelements und halbleiterbauelement |
| FR3079662B1 (fr) * | 2018-03-30 | 2020-02-28 | Soitec | Substrat pour applications radiofrequences et procede de fabrication associe |
| FR3102608B1 (fr) * | 2019-10-28 | 2021-09-24 | Commissariat Energie Atomique | Procédé de transfert d’une couche mince à l’aide d’un polymère précéramique chargé |
-
2021
- 2021-04-16 FR FR2103986A patent/FR3122034B1/fr active Active
-
2022
- 2022-04-12 EP EP22722302.1A patent/EP4324020A1/fr active Pending
- 2022-04-12 US US18/287,148 patent/US20240190120A1/en active Granted
- 2022-04-12 WO PCT/FR2022/050691 patent/WO2022219283A1/fr not_active Ceased
- 2022-04-12 JP JP2023562686A patent/JP2024521248A/ja active Pending
- 2022-04-12 CN CN202280028741.3A patent/CN117280442A/zh active Pending
- 2022-04-12 KR KR1020237038723A patent/KR20230171960A/ko active Pending
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