|
US7109092B2
(en)
|
2003-05-19 |
2006-09-19 |
Ziptronix, Inc. |
Method of room temperature covalent bonding
|
|
US8735219B2
(en)
|
2012-08-30 |
2014-05-27 |
Ziptronix, Inc. |
Heterogeneous annealing method and device
|
|
US10886250B2
(en)
|
2015-07-10 |
2021-01-05 |
Invensas Corporation |
Structures and methods for low temperature bonding using nanoparticles
|
|
US9953941B2
(en)
|
2015-08-25 |
2018-04-24 |
Invensas Bonding Technologies, Inc. |
Conductive barrier direct hybrid bonding
|
|
US10204893B2
(en)
|
2016-05-19 |
2019-02-12 |
Invensas Bonding Technologies, Inc. |
Stacked dies and methods for forming bonded structures
|
|
US10672663B2
(en)
|
2016-10-07 |
2020-06-02 |
Xcelsis Corporation |
3D chip sharing power circuit
|
|
US10580735B2
(en)
|
2016-10-07 |
2020-03-03 |
Xcelsis Corporation |
Stacked IC structure with system level wiring on multiple sides of the IC die
|
|
US10607136B2
(en)
|
2017-08-03 |
2020-03-31 |
Xcelsis Corporation |
Time borrowing between layers of a three dimensional chip stack
|
|
TWI822659B
(zh)
|
2016-10-27 |
2023-11-21 |
美商艾德亞半導體科技有限責任公司 |
用於低溫接合的結構和方法
|
|
US10002844B1
(en)
|
2016-12-21 |
2018-06-19 |
Invensas Bonding Technologies, Inc. |
Bonded structures
|
|
WO2018125673A2
(en)
|
2016-12-28 |
2018-07-05 |
Invensas Bonding Technologies, Inc |
Processing stacked substrates
|
|
US20180182665A1
(en)
|
2016-12-28 |
2018-06-28 |
Invensas Bonding Technologies, Inc. |
Processed Substrate
|
|
TWI837879B
(zh)
|
2016-12-29 |
2024-04-01 |
美商艾德亞半導體接合科技有限公司 |
具有整合式被動構件的接合結構
|
|
US10629577B2
(en)
|
2017-03-16 |
2020-04-21 |
Invensas Corporation |
Direct-bonded LED arrays and applications
|
|
US10515913B2
(en)
|
2017-03-17 |
2019-12-24 |
Invensas Bonding Technologies, Inc. |
Multi-metal contact structure
|
|
US10508030B2
(en)
|
2017-03-21 |
2019-12-17 |
Invensas Bonding Technologies, Inc. |
Seal for microelectronic assembly
|
|
US10269756B2
(en)
|
2017-04-21 |
2019-04-23 |
Invensas Bonding Technologies, Inc. |
Die processing
|
|
US10879212B2
(en)
|
2017-05-11 |
2020-12-29 |
Invensas Bonding Technologies, Inc. |
Processed stacked dies
|
|
US10446441B2
(en)
|
2017-06-05 |
2019-10-15 |
Invensas Corporation |
Flat metal features for microelectronics applications
|
|
US10217720B2
(en)
|
2017-06-15 |
2019-02-26 |
Invensas Corporation |
Multi-chip modules formed using wafer-level processing of a reconstitute wafer
|
|
US10840205B2
(en)
|
2017-09-24 |
2020-11-17 |
Invensas Bonding Technologies, Inc. |
Chemical mechanical polishing for hybrid bonding
|
|
US11031285B2
(en)
|
2017-10-06 |
2021-06-08 |
Invensas Bonding Technologies, Inc. |
Diffusion barrier collar for interconnects
|
|
US11011503B2
(en)
|
2017-12-15 |
2021-05-18 |
Invensas Bonding Technologies, Inc. |
Direct-bonded optoelectronic interconnect for high-density integrated photonics
|
|
US11380597B2
(en)
|
2017-12-22 |
2022-07-05 |
Invensas Bonding Technologies, Inc. |
Bonded structures
|
|
US10727219B2
(en)
|
2018-02-15 |
2020-07-28 |
Invensas Bonding Technologies, Inc. |
Techniques for processing devices
|
|
US11169326B2
(en)
|
2018-02-26 |
2021-11-09 |
Invensas Bonding Technologies, Inc. |
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
|
|
US11256004B2
(en)
|
2018-03-20 |
2022-02-22 |
Invensas Bonding Technologies, Inc. |
Direct-bonded lamination for improved image clarity in optical devices
|
|
US10991804B2
(en)
|
2018-03-29 |
2021-04-27 |
Xcelsis Corporation |
Transistor level interconnection methodologies utilizing 3D interconnects
|
|
US11056348B2
(en)
|
2018-04-05 |
2021-07-06 |
Invensas Bonding Technologies, Inc. |
Bonding surfaces for microelectronics
|
|
US10790262B2
(en)
|
2018-04-11 |
2020-09-29 |
Invensas Bonding Technologies, Inc. |
Low temperature bonded structures
|
|
US11244916B2
(en)
|
2018-04-11 |
2022-02-08 |
Invensas Bonding Technologies, Inc. |
Low temperature bonded structures
|
|
US10964664B2
(en)
|
2018-04-20 |
2021-03-30 |
Invensas Bonding Technologies, Inc. |
DBI to Si bonding for simplified handle wafer
|
|
US11004757B2
(en)
|
2018-05-14 |
2021-05-11 |
Invensas Bonding Technologies, Inc. |
Bonded structures
|
|
US11276676B2
(en)
|
2018-05-15 |
2022-03-15 |
Invensas Bonding Technologies, Inc. |
Stacked devices and methods of fabrication
|
|
US10923413B2
(en)
|
2018-05-30 |
2021-02-16 |
Xcelsis Corporation |
Hard IP blocks with physically bidirectional passageways
|
|
WO2019241417A1
(en)
|
2018-06-13 |
2019-12-19 |
Invensas Bonding Technologies, Inc. |
Tsv as pad
|
|
US11393779B2
(en)
|
2018-06-13 |
2022-07-19 |
Invensas Bonding Technologies, Inc. |
Large metal pads over TSV
|
|
US10910344B2
(en)
|
2018-06-22 |
2021-02-02 |
Xcelsis Corporation |
Systems and methods for releveled bump planes for chiplets
|
|
US11664357B2
(en)
|
2018-07-03 |
2023-05-30 |
Adeia Semiconductor Bonding Technologies Inc. |
Techniques for joining dissimilar materials in microelectronics
|
|
WO2020010136A1
(en)
|
2018-07-06 |
2020-01-09 |
Invensas Bonding Technologies, Inc. |
Molded direct bonded and interconnected stack
|
|
WO2020010265A1
(en)
|
2018-07-06 |
2020-01-09 |
Invensas Bonding Technologies, Inc. |
Microelectronic assemblies
|
|
US12406959B2
(en)
|
2018-07-26 |
2025-09-02 |
Adeia Semiconductor Bonding Technologies Inc. |
Post CMP processing for hybrid bonding
|
|
US11515291B2
(en)
|
2018-08-28 |
2022-11-29 |
Adeia Semiconductor Inc. |
Integrated voltage regulator and passive components
|
|
US11296044B2
(en)
|
2018-08-29 |
2022-04-05 |
Invensas Bonding Technologies, Inc. |
Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
|
|
US11011494B2
(en)
|
2018-08-31 |
2021-05-18 |
Invensas Bonding Technologies, Inc. |
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
|
|
US11158573B2
(en)
|
2018-10-22 |
2021-10-26 |
Invensas Bonding Technologies, Inc. |
Interconnect structures
|
|
US11244920B2
(en)
|
2018-12-18 |
2022-02-08 |
Invensas Bonding Technologies, Inc. |
Method and structures for low temperature device bonding
|
|
KR20210104742A
(ko)
|
2019-01-14 |
2021-08-25 |
인벤사스 본딩 테크놀로지스 인코포레이티드 |
접합 구조체
|
|
US11387202B2
(en)
|
2019-03-01 |
2022-07-12 |
Invensas Llc |
Nanowire bonding interconnect for fine-pitch microelectronics
|
|
US11901281B2
(en)
|
2019-03-11 |
2024-02-13 |
Adeia Semiconductor Bonding Technologies Inc. |
Bonded structures with integrated passive component
|
|
US10854578B2
(en)
|
2019-03-29 |
2020-12-01 |
Invensas Corporation |
Diffused bitline replacement in stacked wafer memory
|
|
US11205625B2
(en)
|
2019-04-12 |
2021-12-21 |
Invensas Bonding Technologies, Inc. |
Wafer-level bonding of obstructive elements
|
|
US11373963B2
(en)
|
2019-04-12 |
2022-06-28 |
Invensas Bonding Technologies, Inc. |
Protective elements for bonded structures
|
|
US11610846B2
(en)
|
2019-04-12 |
2023-03-21 |
Adeia Semiconductor Bonding Technologies Inc. |
Protective elements for bonded structures including an obstructive element
|
|
US11355404B2
(en)
|
2019-04-22 |
2022-06-07 |
Invensas Bonding Technologies, Inc. |
Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
|
|
US11385278B2
(en)
|
2019-05-23 |
2022-07-12 |
Invensas Bonding Technologies, Inc. |
Security circuitry for bonded structures
|
|
US12374641B2
(en)
|
2019-06-12 |
2025-07-29 |
Adeia Semiconductor Bonding Technologies Inc. |
Sealed bonded structures and methods for forming the same
|
|
US11296053B2
(en)
|
2019-06-26 |
2022-04-05 |
Invensas Bonding Technologies, Inc. |
Direct bonded stack structures for increased reliability and improved yield in microelectronics
|
|
US12080672B2
(en)
|
2019-09-26 |
2024-09-03 |
Adeia Semiconductor Bonding Technologies Inc. |
Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
|
|
US12113054B2
(en)
|
2019-10-21 |
2024-10-08 |
Adeia Semiconductor Technologies Llc |
Non-volatile dynamic random access memory
|
|
US11862602B2
(en)
|
2019-11-07 |
2024-01-02 |
Adeia Semiconductor Technologies Llc |
Scalable architecture for reduced cycles across SOC
|
|
US11762200B2
(en)
|
2019-12-17 |
2023-09-19 |
Adeia Semiconductor Bonding Technologies Inc. |
Bonded optical devices
|
|
US11876076B2
(en)
|
2019-12-20 |
2024-01-16 |
Adeia Semiconductor Technologies Llc |
Apparatus for non-volatile random access memory stacks
|
|
US11721653B2
(en)
|
2019-12-23 |
2023-08-08 |
Adeia Semiconductor Bonding Technologies Inc. |
Circuitry for electrical redundancy in bonded structures
|
|
CN121793755A
(zh)
|
2019-12-23 |
2026-04-03 |
隔热半导体粘合技术公司 |
用于接合结构的电冗余
|
|
CN115943489A
(zh)
|
2020-03-19 |
2023-04-07 |
隔热半导体粘合技术公司 |
用于直接键合结构的尺寸补偿控制
|
|
US11742314B2
(en)
|
2020-03-31 |
2023-08-29 |
Adeia Semiconductor Bonding Technologies Inc. |
Reliable hybrid bonded apparatus
|
|
US11735523B2
(en)
*
|
2020-05-19 |
2023-08-22 |
Adeia Semiconductor Bonding Technologies Inc. |
Laterally unconfined structure
|
|
US11631647B2
(en)
|
2020-06-30 |
2023-04-18 |
Adeia Semiconductor Bonding Technologies Inc. |
Integrated device packages with integrated device die and dummy element
|
|
US11728273B2
(en)
|
2020-09-04 |
2023-08-15 |
Adeia Semiconductor Bonding Technologies Inc. |
Bonded structure with interconnect structure
|
|
US11764177B2
(en)
|
2020-09-04 |
2023-09-19 |
Adeia Semiconductor Bonding Technologies Inc. |
Bonded structure with interconnect structure
|
|
US11264357B1
(en)
|
2020-10-20 |
2022-03-01 |
Invensas Corporation |
Mixed exposure for large die
|
|
KR20230097121A
(ko)
|
2020-10-29 |
2023-06-30 |
아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 |
직접 접합 방법 및 구조체
|
|
US12456662B2
(en)
|
2020-12-28 |
2025-10-28 |
Adeia Semiconductor Bonding Technologies Inc. |
Structures with through-substrate vias and methods for forming the same
|
|
WO2022147430A1
(en)
|
2020-12-28 |
2022-07-07 |
Invensas Bonding Technologies, Inc. |
Structures with through-substrate vias and methods for forming the same
|
|
CN116848631A
(zh)
|
2020-12-30 |
2023-10-03 |
美商艾德亚半导体接合科技有限公司 |
具有导电特征的结构及其形成方法
|
|
WO2022189283A1
(en)
*
|
2021-03-06 |
2022-09-15 |
Atotech Deutschland GmbH & Co. KG |
Method for copper-to-copper direct bonding and assembly
|
|
US12525572B2
(en)
|
2021-03-31 |
2026-01-13 |
Adeia Semiconductor Bonding Technologies Inc. |
Direct bonding and debonding of carrier
|
|
EP4315411A4
(en)
|
2021-03-31 |
2025-04-30 |
Adeia Semiconductor Bonding Technologies Inc. |
DIRECT BINDING METHODS AND STRUCTURES
|
|
US12176321B2
(en)
*
|
2021-03-31 |
2024-12-24 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor packages and method of forming the same
|
|
JP2024528964A
(ja)
|
2021-08-02 |
2024-08-01 |
アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド |
ボンデッド構造体用の保護半導体素子
|
|
KR20240059637A
(ko)
|
2021-09-24 |
2024-05-07 |
아데이아 세미컨덕터 본딩 테크놀로지스 인코포레이티드 |
능동 인터포저를 가진 결합 구조체
|
|
US12563749B2
(en)
|
2021-10-28 |
2026-02-24 |
Adeia Semiconductor Bonding Technologies Inc |
Stacked electronic devices
|
|
US12604771B2
(en)
|
2021-10-28 |
2026-04-14 |
Adeia Semiconductor Bonding Technologies Inc. |
Direct bonding methods and structures
|
|
US12557615B2
(en)
|
2021-12-13 |
2026-02-17 |
Adeia Semiconductor Technologies Llc |
Methods for bonding semiconductor elements
|
|
JP2025500315A
(ja)
|
2021-12-20 |
2025-01-09 |
アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド |
ダイパッケージの熱電冷却
|
|
JP7720589B2
(ja)
*
|
2022-02-28 |
2025-08-08 |
新光電気工業株式会社 |
接続構造体、半導体装置及び接続構造体の製造方法
|
|
KR102878102B1
(ko)
*
|
2022-03-02 |
2025-10-28 |
삼성전자주식회사 |
반도체 패키지
|
|
US20230299029A1
(en)
*
|
2022-03-16 |
2023-09-21 |
Adeia Semiconductor Bonding Technologies Inc. |
Expansion control for bonding
|
|
US12512425B2
(en)
|
2022-04-25 |
2025-12-30 |
Adeia Semiconductor Bonding Technologies Inc. |
Expansion controlled structure for direct bonding and method of forming same
|
|
JP2025517291A
(ja)
|
2022-05-23 |
2025-06-05 |
アデイア セミコンダクター ボンディング テクノロジーズ インコーポレイテッド |
ボンデッド構造体のための試験用素子
|
|
US12293982B2
(en)
*
|
2022-06-14 |
2025-05-06 |
Nanya Technology Corporation |
Semiconductor structure having hybrid bonding pad
|
|
US12266622B2
(en)
*
|
2022-06-14 |
2025-04-01 |
Nanya Technology Corporation |
Method of manufacturing semiconductor structure having hybrid bonding pad
|
|
US12532780B2
(en)
*
|
2022-08-22 |
2026-01-20 |
Micron Technology, Inc. |
Hybrid bonding for semiconductor device assemblies
|
|
US20240128217A1
(en)
*
|
2022-10-14 |
2024-04-18 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Semiconductor device and manufacturing method thereof
|
|
TWI859609B
(zh)
*
|
2022-10-21 |
2024-10-21 |
國立陽明交通大學 |
電性連接體與其形成方法
|
|
TWI854373B
(zh)
*
|
2022-11-22 |
2024-09-01 |
樂鑫材料科技股份有限公司 |
背晶金屬化薄膜結構及其形成方法
|
|
US12506114B2
(en)
|
2022-12-29 |
2025-12-23 |
Adeia Semiconductor Bonding Technologies Inc. |
Directly bonded metal structures having aluminum features and methods of preparing same
|
|
US12545010B2
(en)
*
|
2022-12-29 |
2026-02-10 |
Adeia Semiconductor Bonding Technologies Inc. |
Directly bonded metal structures having oxide layers therein
|
|
US20240254645A1
(en)
*
|
2023-01-27 |
2024-08-01 |
Applied Materials, Inc. |
Low temperature hybrid bonding metallization
|
|
US12341083B2
(en)
|
2023-02-08 |
2025-06-24 |
Adeia Semiconductor Bonding Technologies Inc. |
Electronic device cooling structures bonded to semiconductor elements
|
|
US12598962B2
(en)
|
2023-03-14 |
2026-04-07 |
Adeia Semiconductor Bonding Technologies Inc. |
System and method for bonding transparent conductor substrates
|
|
TWI853498B
(zh)
*
|
2023-03-20 |
2024-08-21 |
旺宏電子股份有限公司 |
接合結構、半導體晶片及其製造方法
|
|
US12500143B2
(en)
|
2023-03-20 |
2025-12-16 |
Macronix International Co., Ltd. |
Bonding structure, semiconductor chip and fabricating method thereof
|