JP2024512805A5 - - Google Patents
Info
- Publication number
- JP2024512805A5 JP2024512805A5 JP2023561117A JP2023561117A JP2024512805A5 JP 2024512805 A5 JP2024512805 A5 JP 2024512805A5 JP 2023561117 A JP2023561117 A JP 2023561117A JP 2023561117 A JP2023561117 A JP 2023561117A JP 2024512805 A5 JP2024512805 A5 JP 2024512805A5
- Authority
- JP
- Japan
- Prior art keywords
- assembly according
- laminate
- amalgam
- components
- release layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163169658P | 2021-04-01 | 2021-04-01 | |
| US63/169,658 | 2021-04-01 | ||
| PCT/US2022/022532 WO2022212492A2 (en) | 2021-04-01 | 2022-03-30 | Assemblies used for embedding integrated circuit assemblies, and their uses and method of fabrication thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024512805A JP2024512805A (ja) | 2024-03-19 |
| JP2024512805A5 true JP2024512805A5 (cg-RX-API-DMAC7.html) | 2025-04-07 |
Family
ID=81585417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023561117A Pending JP2024512805A (ja) | 2021-04-01 | 2022-03-30 | 集積回路アセンブリ埋め込み用に使用されるアセンブリ並びにその用途及び製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20220319829A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4315414A2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2024512805A (cg-RX-API-DMAC7.html) |
| KR (1) | KR20230164117A (cg-RX-API-DMAC7.html) |
| CN (1) | CN117242568A (cg-RX-API-DMAC7.html) |
| TW (1) | TW202249543A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2022212492A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12596306B2 (en) * | 2021-11-11 | 2026-04-07 | Terecircuits Corporation | Photochemical and thermal release layer processes and uses in device manufacturing |
| US12611840B1 (en) * | 2022-09-14 | 2026-04-28 | Apple Inc. | Electronic devices with modified covers |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5053195A (en) | 1989-07-19 | 1991-10-01 | Microelectronics And Computer Technology Corp. | Bonding amalgam and method of making |
| US6132676A (en) | 1997-06-30 | 2000-10-17 | Massachusetts Institute Of Technology | Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite |
| US6358567B2 (en) | 1998-12-23 | 2002-03-19 | The Regents Of The University Of California | Colloidal spray method for low cost thin coating deposition |
| US7141348B2 (en) | 2003-05-23 | 2006-11-28 | Intelleflex Corporation | Lamination and delamination technique for thin film processing |
| US6946178B2 (en) | 2003-05-23 | 2005-09-20 | James Sheats | Lamination and delamination technique for thin film processing |
| US7300824B2 (en) | 2005-08-18 | 2007-11-27 | James Sheats | Method of packaging and interconnection of integrated circuits |
| US7759167B2 (en) * | 2005-11-23 | 2010-07-20 | Imec | Method for embedding dies |
| US20100078496A1 (en) | 2008-09-29 | 2010-04-01 | Sono-Tek Corporation | Methods and systems for ultrasonic spray shaping |
| US8922021B2 (en) | 2011-12-30 | 2014-12-30 | Deca Technologies Inc. | Die up fully molded fan-out wafer level packaging |
| US9455160B2 (en) * | 2013-01-14 | 2016-09-27 | Infineon Technologies Ag | Method for fabricating a semiconductor chip panel |
| TWI622142B (zh) * | 2016-11-07 | 2018-04-21 | Industrial Technology Research Institute | 晶片封裝體以及晶片封裝方法 |
| US11024608B2 (en) * | 2017-03-28 | 2021-06-01 | X Display Company Technology Limited | Structures and methods for electrical connection of micro-devices and substrates |
| TWI734175B (zh) * | 2019-08-21 | 2021-07-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法與電子封裝模組 |
-
2022
- 2022-03-30 KR KR1020237036968A patent/KR20230164117A/ko active Pending
- 2022-03-30 EP EP22721930.0A patent/EP4315414A2/en active Pending
- 2022-03-30 US US17/657,247 patent/US20220319829A1/en active Pending
- 2022-03-30 WO PCT/US2022/022532 patent/WO2022212492A2/en not_active Ceased
- 2022-03-30 CN CN202280031069.3A patent/CN117242568A/zh active Pending
- 2022-03-30 JP JP2023561117A patent/JP2024512805A/ja active Pending
- 2022-04-01 TW TW111112787A patent/TW202249543A/zh unknown
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