JP2024507541A5 - - Google Patents

Info

Publication number
JP2024507541A5
JP2024507541A5 JP2023550606A JP2023550606A JP2024507541A5 JP 2024507541 A5 JP2024507541 A5 JP 2024507541A5 JP 2023550606 A JP2023550606 A JP 2023550606A JP 2023550606 A JP2023550606 A JP 2023550606A JP 2024507541 A5 JP2024507541 A5 JP 2024507541A5
Authority
JP
Japan
Prior art keywords
packaged
contact pad
die
sealing material
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023550606A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024507541A (ja
Filing date
Publication date
Priority claimed from US17/363,200 external-priority patent/US20220270960A1/en
Application filed filed Critical
Publication of JP2024507541A publication Critical patent/JP2024507541A/ja
Publication of JP2024507541A5 publication Critical patent/JP2024507541A5/ja
Pending legal-status Critical Current

Links

JP2023550606A 2021-02-23 2022-02-18 チップセンサのためのオープンパッケージ Pending JP2024507541A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163152375P 2021-02-23 2021-02-23
US63/152,375 2021-02-23
US17/363,200 2021-06-30
US17/363,200 US20220270960A1 (en) 2021-02-23 2021-06-30 Open-Cavity Package for Chip Sensor
PCT/US2022/016891 WO2022182575A1 (en) 2021-02-23 2022-02-18 Open-cavity package for chip sensor

Publications (2)

Publication Number Publication Date
JP2024507541A JP2024507541A (ja) 2024-02-20
JP2024507541A5 true JP2024507541A5 (https=) 2025-01-31

Family

ID=82899862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023550606A Pending JP2024507541A (ja) 2021-02-23 2022-02-18 チップセンサのためのオープンパッケージ

Country Status (5)

Country Link
US (1) US20220270960A1 (https=)
EP (1) EP4298404A4 (https=)
JP (1) JP2024507541A (https=)
CN (1) CN116940807A (https=)
WO (1) WO2022182575A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230183880A1 (en) * 2021-12-15 2023-06-15 Texas Instruments Incorporated Fluid sensor package

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
DE10205127A1 (de) * 2002-02-07 2003-08-28 Infineon Technologies Ag Halbleiterbauteil mit Sensor- bzw. Aktoroberfläche und Verfahren zu seiner Herstellung
US6982491B1 (en) * 2004-01-20 2006-01-03 Asat Ltd. Sensor semiconductor package and method of manufacturing the same
US7495325B2 (en) * 2005-05-05 2009-02-24 Stats Chippac, Ltd. Optical die-down quad flat non-leaded package
US20080191333A1 (en) * 2007-02-08 2008-08-14 Advanced Chip Engineering Technology Inc. Image sensor package with die receiving opening and method of the same
US7582954B1 (en) * 2008-02-25 2009-09-01 National Semiconductor Corporation Optical leadless leadframe package
US8530981B2 (en) * 2009-12-31 2013-09-10 Texas Instruments Incorporated Leadframe-based premolded package having acoustic air channel for micro-electro-mechanical system
US8907457B2 (en) * 2010-02-08 2014-12-09 Micron Technology, Inc. Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
US8866237B2 (en) * 2012-02-27 2014-10-21 Texas Instruments Incorporated Methods for embedding controlled-cavity MEMS package in integration board
US10121043B2 (en) * 2014-11-18 2018-11-06 Sunasic Technologies, Inc. Printed circuit board assembly with image sensor mounted thereon
JP2016151427A (ja) * 2015-02-16 2016-08-22 ローム株式会社 電子装置
US9663357B2 (en) * 2015-07-15 2017-05-30 Texas Instruments Incorporated Open cavity package using chip-embedding technology
DE102015116081A1 (de) * 2015-09-23 2017-03-23 Infineon Technologies Ag Elektronisches Sensorbauelement mit einem Flip-Chip-montierten Halbleiterchip und einem Substrat mit einer Öffnung
TWI698968B (zh) * 2016-07-04 2020-07-11 大陸商蘇州晶方半導體科技股份有限公司 封裝結構以及封裝方法
EP3396329A1 (en) * 2017-04-28 2018-10-31 Sensirion AG Sensor package
TWI691040B (zh) * 2018-08-29 2020-04-11 英屬開曼群島商鳳凰先驅股份有限公司 半導體裝置之封裝結構及其製造方法
JP7110888B2 (ja) * 2018-10-03 2022-08-02 Tdk株式会社 センサー用パッケージ基板及びこれを備えるセンサーモジュール
EP3640978A1 (en) * 2018-10-15 2020-04-22 IMEC vzw A method for packaging semiconductor dies
DE102019202716B4 (de) * 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flex-folien-package mit coplanarer topologie für hochfrequenzsignale und verfahren zum herstellen eines derartigen flex-folien-packages
CN113207244B (zh) * 2020-02-03 2024-12-10 奥特斯奥地利科技与系统技术有限公司 制造部件承载件的方法及部件承载件

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