JP2024501876A5 - - Google Patents

Info

Publication number
JP2024501876A5
JP2024501876A5 JP2023540529A JP2023540529A JP2024501876A5 JP 2024501876 A5 JP2024501876 A5 JP 2024501876A5 JP 2023540529 A JP2023540529 A JP 2023540529A JP 2023540529 A JP2023540529 A JP 2023540529A JP 2024501876 A5 JP2024501876 A5 JP 2024501876A5
Authority
JP
Japan
Prior art keywords
integrated circuit
layer
circuit according
metal
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540529A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024501876A (ja
Filing date
Publication date
Priority claimed from US17/138,541 external-priority patent/US11854933B2/en
Application filed filed Critical
Publication of JP2024501876A publication Critical patent/JP2024501876A/ja
Publication of JP2024501876A5 publication Critical patent/JP2024501876A5/ja
Pending legal-status Critical Current

Links

JP2023540529A 2020-12-30 2021-12-28 熱伝導性ウェハ層 Pending JP2024501876A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/138,541 US11854933B2 (en) 2020-12-30 2020-12-30 Thermally conductive wafer layer
US17/138,541 2020-12-30
PCT/US2021/065266 WO2022146953A1 (en) 2020-12-30 2021-12-28 Thermally conductive wafer layer

Publications (2)

Publication Number Publication Date
JP2024501876A JP2024501876A (ja) 2024-01-16
JP2024501876A5 true JP2024501876A5 (enExample) 2024-12-16

Family

ID=82118338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540529A Pending JP2024501876A (ja) 2020-12-30 2021-12-28 熱伝導性ウェハ層

Country Status (4)

Country Link
US (2) US11854933B2 (enExample)
EP (1) EP4272247B1 (enExample)
JP (1) JP2024501876A (enExample)
WO (1) WO2022146953A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11854933B2 (en) * 2020-12-30 2023-12-26 Texas Instruments Incorporated Thermally conductive wafer layer

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US11854933B2 (en) * 2020-12-30 2023-12-26 Texas Instruments Incorporated Thermally conductive wafer layer

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