JP2024114775A5 - - Google Patents
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- JP2024114775A5 JP2024114775A5 JP2024101334A JP2024101334A JP2024114775A5 JP 2024114775 A5 JP2024114775 A5 JP 2024114775A5 JP 2024101334 A JP2024101334 A JP 2024101334A JP 2024101334 A JP2024101334 A JP 2024101334A JP 2024114775 A5 JP2024114775 A5 JP 2024114775A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- curing agent
- component
- integer
- solid curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 claims 37
- 239000003795 chemical substances by application Substances 0.000 claims 32
- 239000007787 solid Substances 0.000 claims 32
- 125000001424 substituent group Chemical group 0.000 claims 13
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 12
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 12
- -1 maleimide compound Chemical class 0.000 claims 12
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 10
- 125000003118 aryl group Chemical group 0.000 claims 10
- 125000004432 carbon atom Chemical group C* 0.000 claims 10
- 150000001875 compounds Chemical class 0.000 claims 7
- 125000000217 alkyl group Chemical group 0.000 claims 6
- 235000010290 biphenyl Nutrition 0.000 claims 6
- 239000004305 biphenyl Substances 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 6
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 5
- 125000002947 alkylene group Chemical group 0.000 claims 5
- 239000004643 cyanate ester Substances 0.000 claims 5
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical group C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 4
- 125000004122 cyclic group Chemical group 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 3
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 claims 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims 2
- 229920001955 polyphenylene ether Polymers 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- 229920006287 phenoxy resin Polymers 0.000 claims 1
- 239000013034 phenoxy resin Substances 0.000 claims 1
- 229920005668 polycarbonate resin Polymers 0.000 claims 1
- 239000004431 polycarbonate resin Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000008096 xylene Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024101334A JP2024114775A (ja) | 2019-02-08 | 2024-06-24 | 樹脂組成物 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019022003A JP7555694B2 (ja) | 2019-02-08 | 2019-02-08 | 樹脂組成物 |
| JP2024101334A JP2024114775A (ja) | 2019-02-08 | 2024-06-24 | 樹脂組成物 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019022003A Division JP7555694B2 (ja) | 2019-02-08 | 2019-02-08 | 樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024114775A JP2024114775A (ja) | 2024-08-23 |
| JP2024114775A5 true JP2024114775A5 (enExample) | 2025-05-14 |
Family
ID=71999818
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019022003A Active JP7555694B2 (ja) | 2019-02-08 | 2019-02-08 | 樹脂組成物 |
| JP2022164319A Active JP7501583B2 (ja) | 2019-02-08 | 2022-10-12 | 樹脂組成物 |
| JP2024101334A Pending JP2024114775A (ja) | 2019-02-08 | 2024-06-24 | 樹脂組成物 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019022003A Active JP7555694B2 (ja) | 2019-02-08 | 2019-02-08 | 樹脂組成物 |
| JP2022164319A Active JP7501583B2 (ja) | 2019-02-08 | 2022-10-12 | 樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (3) | JP7555694B2 (enExample) |
| KR (1) | KR102888654B1 (enExample) |
| CN (1) | CN111548625B (enExample) |
| TW (1) | TWI843792B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114621559B (zh) * | 2020-12-09 | 2023-07-11 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及包含其的预浸料、层压板和高频电路基板 |
| JP7636123B2 (ja) * | 2020-12-18 | 2025-02-26 | 信越化学工業株式会社 | 熱硬化性マレイミド樹脂組成物 |
| CN114672166B (zh) * | 2020-12-24 | 2023-08-15 | 广东生益科技股份有限公司 | 一种无卤阻燃型树脂组合物及其制成的预浸料和印制电路用层压板 |
| JP7770771B2 (ja) * | 2021-01-14 | 2025-11-17 | 味の素株式会社 | 樹脂組成物 |
| JP7774963B2 (ja) * | 2021-01-14 | 2025-11-25 | 味の素株式会社 | 樹脂組成物 |
| JP2022133794A (ja) * | 2021-03-02 | 2022-09-14 | 味の素株式会社 | 樹脂組成物 |
| JP7666047B2 (ja) * | 2021-03-22 | 2025-04-22 | 味の素株式会社 | 樹脂シート |
| JP7655752B2 (ja) * | 2021-03-26 | 2025-04-02 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板 |
| JPWO2022255137A1 (enExample) * | 2021-06-02 | 2022-12-08 | ||
| JP7719658B2 (ja) * | 2021-07-30 | 2025-08-06 | 帝人株式会社 | アリル基含有ポリカーボネート樹脂及び硬化性樹脂組成物 |
| JP7707999B2 (ja) * | 2022-04-25 | 2025-07-15 | 味の素株式会社 | 樹脂組成物 |
| TWI805377B (zh) * | 2022-05-20 | 2023-06-11 | 聯茂電子股份有限公司 | 熱固性樹脂組合物、使用其的預浸料、層壓板及印刷電路板 |
| JP2023179860A (ja) * | 2022-06-08 | 2023-12-20 | 日本化薬株式会社 | ポリイミド樹脂組成物及びその硬化物 |
| WO2024143273A1 (ja) * | 2022-12-28 | 2024-07-04 | 株式会社レゾナック | 樹脂フィルム、プリント配線板及び半導体パッケージ |
| JPWO2024143274A1 (enExample) * | 2022-12-28 | 2024-07-04 | ||
| WO2024143280A1 (ja) * | 2022-12-28 | 2024-07-04 | 株式会社レゾナック | 樹脂付き金属箔、並びにプリント配線板の製造方法及び半導体パッケージの製造方法 |
| KR20250053459A (ko) * | 2023-10-13 | 2025-04-22 | 주식회사 두산 | 열경화성 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판 |
| WO2025225621A1 (ja) * | 2024-04-26 | 2025-10-30 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、および、多層体 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009155354A (ja) * | 2006-03-30 | 2009-07-16 | Ajinomoto Co Inc | 絶縁層用樹脂組成物 |
| JP6369134B2 (ja) | 2014-05-28 | 2018-08-08 | 日立化成株式会社 | 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ |
| EP3216834B1 (en) | 2014-11-06 | 2019-06-12 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal-foil-clad laminated board, resin composite sheet, and printed circuit board |
| JP6940926B2 (ja) | 2015-04-30 | 2021-09-29 | 味の素株式会社 | 樹脂組成物 |
| JP6708947B2 (ja) | 2016-01-14 | 2020-06-10 | 日立化成株式会社 | ミリ波レーダー用印刷配線板製造用樹脂フィルムの製造方法 |
| JP7102093B2 (ja) * | 2016-09-28 | 2022-07-19 | 味の素株式会社 | 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ |
| JP6948623B2 (ja) * | 2016-12-09 | 2021-10-13 | パナソニックＩｐマネジメント株式会社 | プリプレグ、金属張積層板及びプリント配線板 |
| CN110402269B (zh) * | 2017-03-13 | 2022-05-03 | 琳得科株式会社 | 树脂组合物及树脂片 |
| TWI758489B (zh) * | 2017-06-30 | 2022-03-21 | 日商琳得科股份有限公司 | 樹脂組成物及樹脂薄片 |
| JP7217441B2 (ja) * | 2017-12-28 | 2023-02-03 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
| CN108559209B (zh) | 2017-12-29 | 2019-07-26 | 广东生益科技股份有限公司 | 树脂组合物、预浸料、层压板以及覆金属箔层压板 |
| CN108219371B (zh) | 2017-12-29 | 2020-08-18 | 广东生益科技股份有限公司 | 环氧树脂组合物、预浸料、层压板和印刷电路板 |
| WO2019188189A1 (ja) * | 2018-03-28 | 2019-10-03 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板 |
-
2019
- 2019-02-08 JP JP2019022003A patent/JP7555694B2/ja active Active
-
2020
- 2020-01-13 TW TW109101026A patent/TWI843792B/zh active
- 2020-01-31 KR KR1020200012057A patent/KR102888654B1/ko active Active
- 2020-02-03 CN CN202010078572.7A patent/CN111548625B/zh active Active
-
2022
- 2022-10-12 JP JP2022164319A patent/JP7501583B2/ja active Active
-
2024
- 2024-06-24 JP JP2024101334A patent/JP2024114775A/ja active Pending
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