JP2008007555A5 - - Google Patents

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Publication number
JP2008007555A5
JP2008007555A5 JP2006176796A JP2006176796A JP2008007555A5 JP 2008007555 A5 JP2008007555 A5 JP 2008007555A5 JP 2006176796 A JP2006176796 A JP 2006176796A JP 2006176796 A JP2006176796 A JP 2006176796A JP 2008007555 A5 JP2008007555 A5 JP 2008007555A5
Authority
JP
Japan
Prior art keywords
substrate
conductor
group
adhesive composition
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2006176796A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008007555A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006176796A priority Critical patent/JP2008007555A/ja
Priority claimed from JP2006176796A external-priority patent/JP2008007555A/ja
Priority to US12/304,577 priority patent/US20090321015A1/en
Priority to KR1020087031594A priority patent/KR20090021292A/ko
Priority to PCT/US2007/071448 priority patent/WO2008002788A1/en
Priority to CNA2007800230088A priority patent/CN101473008A/zh
Priority to EP07798694A priority patent/EP2032668A1/en
Priority to TW096123088A priority patent/TW200806772A/zh
Publication of JP2008007555A publication Critical patent/JP2008007555A/ja
Publication of JP2008007555A5 publication Critical patent/JP2008007555A5/ja
Withdrawn legal-status Critical Current

Links

JP2006176796A 2006-06-27 2006-06-27 ポリヒドロキシエーテル及び有機粒子を含む接着剤組成物及びそれを用いた回路基板の接続方法 Withdrawn JP2008007555A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006176796A JP2008007555A (ja) 2006-06-27 2006-06-27 ポリヒドロキシエーテル及び有機粒子を含む接着剤組成物及びそれを用いた回路基板の接続方法
US12/304,577 US20090321015A1 (en) 2006-06-27 2007-06-18 Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the same
KR1020087031594A KR20090021292A (ko) 2006-06-27 2007-06-18 폴리하이드록시에테르 및 유기 입자를 포함하는 접착제 조성물, 및 이를 사용한 회로 기판의 접속 방법
PCT/US2007/071448 WO2008002788A1 (en) 2006-06-27 2007-06-18 Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the same
CNA2007800230088A CN101473008A (zh) 2006-06-27 2007-06-18 包含多羟基醚和有机粒子的粘合剂组合物以及用其连接电路板的方法
EP07798694A EP2032668A1 (en) 2006-06-27 2007-06-18 Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the same
TW096123088A TW200806772A (en) 2006-06-27 2007-06-26 Adhesive composition comprising polyhydroxyether and organic particles, and method for connecting circuit board using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006176796A JP2008007555A (ja) 2006-06-27 2006-06-27 ポリヒドロキシエーテル及び有機粒子を含む接着剤組成物及びそれを用いた回路基板の接続方法

Publications (2)

Publication Number Publication Date
JP2008007555A JP2008007555A (ja) 2008-01-17
JP2008007555A5 true JP2008007555A5 (enExample) 2009-08-06

Family

ID=38845962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006176796A Withdrawn JP2008007555A (ja) 2006-06-27 2006-06-27 ポリヒドロキシエーテル及び有機粒子を含む接着剤組成物及びそれを用いた回路基板の接続方法

Country Status (7)

Country Link
US (1) US20090321015A1 (enExample)
EP (1) EP2032668A1 (enExample)
JP (1) JP2008007555A (enExample)
KR (1) KR20090021292A (enExample)
CN (1) CN101473008A (enExample)
TW (1) TW200806772A (enExample)
WO (1) WO2008002788A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101838506A (zh) * 2009-03-21 2010-09-22 潘永椿 粗糙面复合法
JP4980439B2 (ja) * 2010-03-02 2012-07-18 株式会社トクヤマ メタライズドセラミック基板の製造方法
JP5610168B2 (ja) * 2010-11-17 2014-10-22 日産化学工業株式会社 レジスト下層膜形成組成物及びそれを用いたレジストパターンの形成方法
JP6560976B2 (ja) * 2014-12-19 2019-08-14 四国化成工業株式会社 無機材料または樹脂材料の表面処理液、表面処理方法およびその利用
KR101788379B1 (ko) * 2015-06-09 2017-10-19 삼성에스디아이 주식회사 화학식 1 또는 2의 고분자 수지, 이를 포함하는 접착 필름 및 상기 접착 필름에 의해 접속된 반도체 장치
KR101788382B1 (ko) * 2015-06-24 2017-10-19 삼성에스디아이 주식회사 화학식 1의 고분자 수지, 이를 포함하는 접착 필름 및 상기 접착 필름에 의해 접속된 반도체 장치
CN111334198B (zh) * 2020-03-27 2021-10-15 顺德职业技术学院 Uv双组份双固化型结构胶

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4980234A (en) * 1987-12-23 1990-12-25 Minnesota Mining And Manufacturing Co. Epoxide resin compositions and method
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JPH0768256B2 (ja) * 1991-08-01 1995-07-26 株式会社ジャパンエナジー 新規イミダゾールシラン化合物及びその製造方法並びにそれを用いる金属表面処理剤
JPH10330616A (ja) * 1997-05-30 1998-12-15 Hitachi Chem Co Ltd 耐熱樹脂ペースト
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
JP2002128872A (ja) * 2000-10-25 2002-05-09 Matsushita Electric Works Ltd エポキシ樹脂組成物およびその用途
JP3875859B2 (ja) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
JP4445274B2 (ja) * 2004-01-09 2010-04-07 三井化学株式会社 樹脂組成物、フィルム状接着剤及び半導体パッケージ
US20090104429A1 (en) * 2005-09-15 2009-04-23 Sekisui Chemical Co., Ltd. Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate

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