JP2024031857A - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP2024031857A
JP2024031857A JP2023129552A JP2023129552A JP2024031857A JP 2024031857 A JP2024031857 A JP 2024031857A JP 2023129552 A JP2023129552 A JP 2023129552A JP 2023129552 A JP2023129552 A JP 2023129552A JP 2024031857 A JP2024031857 A JP 2024031857A
Authority
JP
Japan
Prior art keywords
temperature sensor
pipe
sensor module
module
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023129552A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024031857A5 (cg-RX-API-DMAC10.html
Inventor
和昭 藤澤
Kazuaki Fujisawa
一平 中久木
Ippei Nakakugi
健太郎 山内
Kentaro Yamauchi
俊朗 鈴木
Toshiaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2023129552A priority Critical patent/JP2024031857A/ja
Priority to JP2023135642A priority patent/JP7889407B2/ja
Priority to CN202380061577.0A priority patent/CN119790587A/zh
Priority to PCT/JP2023/030741 priority patent/WO2024043336A1/ja
Priority to PCT/JP2023/030740 priority patent/WO2024043335A1/ja
Priority to EP23857444.6A priority patent/EP4580029A4/en
Publication of JP2024031857A publication Critical patent/JP2024031857A/ja
Publication of JP2024031857A5 publication Critical patent/JP2024031857A5/ja
Priority to US19/039,278 priority patent/US20250172434A1/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H10D80/211—Resistors, capacitors or inductors covered by H10D1/00
    • H10D80/213—Resistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H10D80/251—FETs covered by H10D30/00, e.g. power FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/401—Resistive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/465—Bumps or wires

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Inverter Devices (AREA)
JP2023129552A 2022-08-26 2023-08-08 電子装置 Pending JP2024031857A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2023129552A JP2024031857A (ja) 2022-08-26 2023-08-08 電子装置
JP2023135642A JP7889407B2 (ja) 2022-08-26 2023-08-23 電子装置
CN202380061577.0A CN119790587A (zh) 2022-08-26 2023-08-25 温度传感器模块以及使用了该温度传感器模块的电子装置
PCT/JP2023/030741 WO2024043336A1 (ja) 2022-08-26 2023-08-25 温度センサモジュールおよびそれを用いた電子装置
PCT/JP2023/030740 WO2024043335A1 (ja) 2022-08-26 2023-08-25 電子装置
EP23857444.6A EP4580029A4 (en) 2022-08-26 2023-08-25 TEMPERATURE SENSOR MODULE, AND ELECTRONIC DEVICE IMPLEMENTING IT
US19/039,278 US20250172434A1 (en) 2022-08-26 2025-01-28 Temperature sensor module and electronic device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022135105 2022-08-26
JP2022135105 2022-08-26
JP2023129552A JP2024031857A (ja) 2022-08-26 2023-08-08 電子装置
JP2023135642A JP7889407B2 (ja) 2022-08-26 2023-08-23 電子装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023135642A Division JP7889407B2 (ja) 2022-08-26 2023-08-23 電子装置

Publications (2)

Publication Number Publication Date
JP2024031857A true JP2024031857A (ja) 2024-03-07
JP2024031857A5 JP2024031857A5 (cg-RX-API-DMAC10.html) 2024-12-05

Family

ID=90013522

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023129552A Pending JP2024031857A (ja) 2022-08-26 2023-08-08 電子装置
JP2023135642A Active JP7889407B2 (ja) 2022-08-26 2023-08-23 電子装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023135642A Active JP7889407B2 (ja) 2022-08-26 2023-08-23 電子装置

Country Status (5)

Country Link
US (1) US20250172434A1 (cg-RX-API-DMAC10.html)
EP (1) EP4580029A4 (cg-RX-API-DMAC10.html)
JP (2) JP2024031857A (cg-RX-API-DMAC10.html)
CN (1) CN119790587A (cg-RX-API-DMAC10.html)
WO (2) WO2024043335A1 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026164091A1 (ja) * 2025-01-28 2026-08-06 株式会社デンソー 温度センサモジュールおよびその製造方法、電子装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008220042A (ja) * 2007-03-05 2008-09-18 Denso Corp 電力変換装置
JP2011200090A (ja) * 2010-03-24 2011-10-06 Denso Corp 電力変換装置
JP2017147910A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電力変換装置
JP2019176693A (ja) * 2018-03-29 2019-10-10 株式会社デンソー 電力変換装置
JP2020136550A (ja) * 2019-02-22 2020-08-31 トヨタ自動車株式会社 冷却器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2504977Y2 (ja) * 1990-08-20 1996-07-24 株式会社村田製作所 温度検知用サ―ミスタ部品
JP2008139112A (ja) * 2006-11-30 2008-06-19 Seiko Npc Corp 半導体温度センサ装置
JP2008153525A (ja) * 2006-12-19 2008-07-03 Mitsubishi Materials Corp 温度センサ
JP5413294B2 (ja) * 2010-04-27 2014-02-12 株式会社デンソー 電力変換装置
JP6356498B2 (ja) * 2014-06-16 2018-07-11 住友電気工業株式会社 測温モジュール、プリント回路板及び測温モジュールの製造方法
JP6341136B2 (ja) * 2015-04-08 2018-06-13 Tdk株式会社 温度センサ
CH713267A1 (de) * 2016-12-21 2018-06-29 Greenteg Ag Sensoreinheit für ein tragbares Computersystem und Integration der Sensoreinheit in das Gehäuse des Computersystems.
MY207088A (en) 2017-08-04 2025-01-29 Becton Dickinson Co Method and apparatus for introducing a needle for catheter placement
JP6955951B2 (ja) 2017-10-02 2021-10-27 日産自動車株式会社 放電装置
CN213632455U (zh) * 2020-09-26 2021-07-06 杭州三花研究院有限公司 传感器组件和换热装置
JP2022135105A (ja) 2021-03-04 2022-09-15 キオクシア株式会社 半導体製造装置及び半導体製造方法
CN114362968B (zh) 2022-03-15 2022-06-17 北京百度网讯科技有限公司 区块链获取随机数的方法、装置、设备和介质

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008220042A (ja) * 2007-03-05 2008-09-18 Denso Corp 電力変換装置
JP2011200090A (ja) * 2010-03-24 2011-10-06 Denso Corp 電力変換装置
JP2017147910A (ja) * 2016-02-19 2017-08-24 株式会社デンソー 電力変換装置
JP2019176693A (ja) * 2018-03-29 2019-10-10 株式会社デンソー 電力変換装置
JP2020136550A (ja) * 2019-02-22 2020-08-31 トヨタ自動車株式会社 冷却器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026164091A1 (ja) * 2025-01-28 2026-08-06 株式会社デンソー 温度センサモジュールおよびその製造方法、電子装置

Also Published As

Publication number Publication date
EP4580029A1 (en) 2025-07-02
CN119790587A (zh) 2025-04-08
JP7889407B2 (ja) 2026-07-14
US20250172434A1 (en) 2025-05-29
EP4580029A4 (en) 2025-12-10
WO2024043336A1 (ja) 2024-02-29
WO2024043335A1 (ja) 2024-02-29
JP2024031929A (ja) 2024-03-07

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