JP2024011954A5 - - Google Patents
Info
- Publication number
- JP2024011954A5 JP2024011954A5 JP2022114323A JP2022114323A JP2024011954A5 JP 2024011954 A5 JP2024011954 A5 JP 2024011954A5 JP 2022114323 A JP2022114323 A JP 2022114323A JP 2022114323 A JP2022114323 A JP 2022114323A JP 2024011954 A5 JP2024011954 A5 JP 2024011954A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- disposed
- semiconductor device
- semiconductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022114323A JP2024011954A (ja) | 2022-07-15 | 2022-07-15 | 半導体装置および半導体装置の製造方法 |
| EP23180893.2A EP4307379A1 (en) | 2022-07-15 | 2023-06-22 | Semiconductor device |
| KR1020230081587A KR20240010401A (ko) | 2022-07-15 | 2023-06-26 | 반도체 장치 |
| US18/345,012 US20240021648A1 (en) | 2022-07-15 | 2023-06-30 | Semiconductor device |
| TW112124698A TWI922815B (zh) | 2022-07-15 | 2023-07-03 | 半導體裝置 |
| CN202310847703.7A CN117410296A (zh) | 2022-07-15 | 2023-07-11 | 半导体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022114323A JP2024011954A (ja) | 2022-07-15 | 2022-07-15 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024011954A JP2024011954A (ja) | 2024-01-25 |
| JP2024011954A5 true JP2024011954A5 (https=) | 2025-07-16 |
Family
ID=86942147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022114323A Pending JP2024011954A (ja) | 2022-07-15 | 2022-07-15 | 半導体装置および半導体装置の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240021648A1 (https=) |
| EP (1) | EP4307379A1 (https=) |
| JP (1) | JP2024011954A (https=) |
| KR (1) | KR20240010401A (https=) |
| CN (1) | CN117410296A (https=) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
| US20120193785A1 (en) * | 2011-02-01 | 2012-08-02 | Megica Corporation | Multichip Packages |
| US9674470B2 (en) * | 2014-04-11 | 2017-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, method for driving semiconductor device, and method for driving electronic device |
| JP2016035961A (ja) * | 2014-08-01 | 2016-03-17 | 株式会社東芝 | 半導体装置とその製造方法 |
| JP6861471B2 (ja) | 2015-06-12 | 2021-04-21 | キヤノン株式会社 | 撮像装置およびその製造方法ならびにカメラ |
| KR102473664B1 (ko) * | 2016-01-19 | 2022-12-02 | 삼성전자주식회사 | Tsv 구조체를 가진 다중 적층 소자 |
| JP6779825B2 (ja) * | 2017-03-30 | 2020-11-04 | キヤノン株式会社 | 半導体装置および機器 |
| CN114628425A (zh) * | 2017-05-26 | 2022-06-14 | 株式会社半导体能源研究所 | 摄像装置及电子设备 |
| US11244978B2 (en) * | 2018-10-17 | 2022-02-08 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus and equipment including the same |
| KR102742350B1 (ko) | 2018-11-21 | 2024-12-16 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 고체 촬상 소자 |
| TWI904094B (zh) * | 2019-06-26 | 2025-11-11 | 日商索尼半導體解決方案公司 | 攝像裝置 |
| US11605665B2 (en) * | 2019-10-25 | 2023-03-14 | Canon Kabushiki Kaisha | Semiconductor apparatus and method for producing semiconductor apparatus |
| KR20230091873A (ko) * | 2020-10-23 | 2023-06-23 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | 촬상 장치 및 수광 소자 |
| US12396272B2 (en) * | 2021-01-18 | 2025-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stilted pad structure |
| KR20230039137A (ko) * | 2021-09-13 | 2023-03-21 | 삼성전자주식회사 | 이미지 센서 |
-
2022
- 2022-07-15 JP JP2022114323A patent/JP2024011954A/ja active Pending
-
2023
- 2023-06-22 EP EP23180893.2A patent/EP4307379A1/en active Pending
- 2023-06-26 KR KR1020230081587A patent/KR20240010401A/ko active Pending
- 2023-06-30 US US18/345,012 patent/US20240021648A1/en active Pending
- 2023-07-11 CN CN202310847703.7A patent/CN117410296A/zh active Pending
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