JP2023546355A - 基板の制御された局所加熱 - Google Patents

基板の制御された局所加熱 Download PDF

Info

Publication number
JP2023546355A
JP2023546355A JP2023521099A JP2023521099A JP2023546355A JP 2023546355 A JP2023546355 A JP 2023546355A JP 2023521099 A JP2023521099 A JP 2023521099A JP 2023521099 A JP2023521099 A JP 2023521099A JP 2023546355 A JP2023546355 A JP 2023546355A
Authority
JP
Japan
Prior art keywords
carrier
substrate
heating
manufacturing
heating zones
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023521099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023546355A5 (enExample
Inventor
ヤコブ ヘンドリックス、ロブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of JP2023546355A publication Critical patent/JP2023546355A/ja
Publication of JP2023546355A5 publication Critical patent/JP2023546355A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control Of Resistance Heating (AREA)
  • Wire Bonding (AREA)
JP2023521099A 2020-10-06 2021-10-05 基板の制御された局所加熱 Pending JP2023546355A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20200373.7 2020-10-06
EP20200373.7A EP3982398A1 (en) 2020-10-06 2020-10-06 Controlled local heating of substrates
PCT/NL2021/050604 WO2022075843A1 (en) 2020-10-06 2021-10-05 Controlled local heating of substrates

Publications (2)

Publication Number Publication Date
JP2023546355A true JP2023546355A (ja) 2023-11-02
JP2023546355A5 JP2023546355A5 (enExample) 2024-10-11

Family

ID=72801299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521099A Pending JP2023546355A (ja) 2020-10-06 2021-10-05 基板の制御された局所加熱

Country Status (6)

Country Link
US (1) US20230373023A1 (enExample)
EP (2) EP3982398A1 (enExample)
JP (1) JP2023546355A (enExample)
CN (1) CN116490965A (enExample)
TW (1) TWI908896B (enExample)
WO (1) WO2022075843A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4344364A1 (en) * 2022-09-23 2024-03-27 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Thermal processing device and method

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001339152A (ja) * 2000-05-29 2001-12-07 Nec Corp リフロー半田付け装置
US20040065656A1 (en) * 2002-10-04 2004-04-08 Makoto Inagawa Heated substrate support
JP2004533098A (ja) * 2001-06-06 2004-10-28 エフエスアイ インターナショナル インコーポレイテッド 複合型加熱／冷却装置のための加熱部材及び加熱方法
JP2004327542A (ja) * 2003-04-22 2004-11-18 Seiko Epson Corp リフロー装置
JP2007012840A (ja) * 2005-06-30 2007-01-18 Honda Motor Co Ltd はんだ付け装置
JP2010522970A (ja) * 2006-10-09 2010-07-08 ソレクセル、インコーポレイテッド 三次元薄膜太陽電池製造のためのテンプレート及び使用方法
US20140197151A1 (en) * 2013-01-16 2014-07-17 Applied Materials, Inc. Substrate support with switchable multizone heater
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
WO2017073230A1 (ja) * 2015-10-26 2017-05-04 日本発條株式会社 ヒータユニット
JP2017143290A (ja) * 2014-07-23 2017-08-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 可変型温度制御式基板支持アセンブリ
JP2018098497A (ja) * 2016-11-29 2018-06-21 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ メサ間の領域の深さが異なる基板支持体および対応する温度依存の加工方法
JP2019212670A (ja) * 2018-05-31 2019-12-12 東京エレクトロン株式会社 基板処理方法および基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278078B1 (en) 1999-06-02 2001-08-21 Lockheed Martin Corporation Laser soldering method
CN101019208B (zh) * 2004-06-28 2010-12-08 京瓷株式会社 晶片加热装置及半导体制造装置
US8193076B2 (en) * 2006-10-09 2012-06-05 Solexel, Inc. Method for releasing a thin semiconductor substrate from a reusable template
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
US8901518B2 (en) * 2012-07-26 2014-12-02 Applied Materials, Inc. Chambers with improved cooling devices
TW201448108A (zh) * 2013-03-12 2014-12-16 應用材料股份有限公司 用於電漿處理腔室的多重區域加熱及冷卻靜電夾盤
JP6608444B2 (ja) * 2015-12-28 2019-11-20 日本碍子株式会社 円板状ヒータ及びヒータ冷却板アセンブリ
US10249526B2 (en) * 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001339152A (ja) * 2000-05-29 2001-12-07 Nec Corp リフロー半田付け装置
JP2004533098A (ja) * 2001-06-06 2004-10-28 エフエスアイ インターナショナル インコーポレイテッド 複合型加熱／冷却装置のための加熱部材及び加熱方法
US20040065656A1 (en) * 2002-10-04 2004-04-08 Makoto Inagawa Heated substrate support
JP2004327542A (ja) * 2003-04-22 2004-11-18 Seiko Epson Corp リフロー装置
JP2007012840A (ja) * 2005-06-30 2007-01-18 Honda Motor Co Ltd はんだ付け装置
JP2010522970A (ja) * 2006-10-09 2010-07-08 ソレクセル、インコーポレイテッド 三次元薄膜太陽電池製造のためのテンプレート及び使用方法
US20140197151A1 (en) * 2013-01-16 2014-07-17 Applied Materials, Inc. Substrate support with switchable multizone heater
JP2017143290A (ja) * 2014-07-23 2017-08-17 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 可変型温度制御式基板支持アセンブリ
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
WO2017073230A1 (ja) * 2015-10-26 2017-05-04 日本発條株式会社 ヒータユニット
JP2018098497A (ja) * 2016-11-29 2018-06-21 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ メサ間の領域の深さが異なる基板支持体および対応する温度依存の加工方法
JP2019212670A (ja) * 2018-05-31 2019-12-12 東京エレクトロン株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
EP3982398A1 (en) 2022-04-13
EP4226413B1 (en) 2024-12-04
TWI908896B (zh) 2025-12-21
WO2022075843A1 (en) 2022-04-14
US20230373023A1 (en) 2023-11-23
EP4226413A1 (en) 2023-08-16
TW202215573A (zh) 2022-04-16
EP4226413C0 (en) 2024-12-04
CN116490965A (zh) 2023-07-25

Similar Documents

Publication Publication Date Title
JP5561356B2 (ja) 半導体モジュールの製造方法，半導体モジュールおよび製造装置
JP6915843B2 (ja) 半田接合装置
US10799977B2 (en) Heater chip, joining apparatus and joining method
US20180007780A1 (en) Flexible board and production method for metal wiring bonding structure
JP4988607B2 (ja) ヒータチップ及び接合装置及び接合方法
JP2023546355A (ja) 基板の制御された局所加熱
JP6773331B2 (ja) 半田接合装置
KR102548627B1 (ko) 절연 피복선의 접합 방법, 접속 구조, 절연 피복선의 박리 방법 및 본딩 장치
JP2009160617A (ja) ヒータチップ及び接合装置
JP5178756B2 (ja) ピン端子の接合方法及び装置、並びにピン端子付きパワー基板
JP5487142B2 (ja) ヒートツールおよび熱圧着装置
JP2017062945A (ja) ヒータチップ及び接合装置及び接合方法
JP7108489B2 (ja) はんだ付け装置
CN101465327B (zh) 半导体元件衬底、喷墨头及其相关连接方法
JP5207557B2 (ja) 接合装置
JP2023546355A5 (enExample)
JP7820181B2 (ja) 加熱式接合装置および加熱式接合方法
JP2025136722A (ja) ヒータチップ、電極と導線の発熱接合方法
JP3754185B2 (ja) 熱圧着装置およびこれに用いるヒータツール
JP5748207B2 (ja) 接合装置
JP2009200170A (ja) 端子用加熱装置
JP2004208347A (ja) 被覆線ワイヤーの被覆除去装置
JPH08236924A (ja) 半導体除去装置及び半導体除去方法
JP2001053434A (ja) リフロー方法及び装置
JP2000235971A (ja) 温度制御プレート及びこれを用いた半導体製造装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241003

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241003

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20250107

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20250110

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20250709

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250902

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251201

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260324