JP2023546355A5 - - Google Patents

Info

Publication number
JP2023546355A5
JP2023546355A5 JP2023521099A JP2023521099A JP2023546355A5 JP 2023546355 A5 JP2023546355 A5 JP 2023546355A5 JP 2023521099 A JP2023521099 A JP 2023521099A JP 2023521099 A JP2023521099 A JP 2023521099A JP 2023546355 A5 JP2023546355 A5 JP 2023546355A5
Authority
JP
Japan
Prior art keywords
carrier
manufacturing
substrate
heating zones
control unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023521099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023546355A (ja
Filing date
Publication date
Priority claimed from EP20200373.7A external-priority patent/EP3982398A1/en
Application filed filed Critical
Publication of JP2023546355A publication Critical patent/JP2023546355A/ja
Publication of JP2023546355A5 publication Critical patent/JP2023546355A5/ja
Pending legal-status Critical Current

Links

JP2023521099A 2020-10-06 2021-10-05 基板の制御された局所加熱 Pending JP2023546355A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20200373.7 2020-10-06
EP20200373.7A EP3982398A1 (en) 2020-10-06 2020-10-06 Controlled local heating of substrates
PCT/NL2021/050604 WO2022075843A1 (en) 2020-10-06 2021-10-05 Controlled local heating of substrates

Publications (2)

Publication Number Publication Date
JP2023546355A JP2023546355A (ja) 2023-11-02
JP2023546355A5 true JP2023546355A5 (enExample) 2024-10-11

Family

ID=72801299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521099A Pending JP2023546355A (ja) 2020-10-06 2021-10-05 基板の制御された局所加熱

Country Status (6)

Country Link
US (1) US20230373023A1 (enExample)
EP (2) EP3982398A1 (enExample)
JP (1) JP2023546355A (enExample)
CN (1) CN116490965A (enExample)
TW (1) TWI908896B (enExample)
WO (1) WO2022075843A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4344364A1 (en) * 2022-09-23 2024-03-27 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Thermal processing device and method

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278078B1 (en) 1999-06-02 2001-08-21 Lockheed Martin Corporation Laser soldering method
JP2001339152A (ja) * 2000-05-29 2001-12-07 Nec Corp リフロー半田付け装置
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US20040065656A1 (en) * 2002-10-04 2004-04-08 Makoto Inagawa Heated substrate support
JP4066872B2 (ja) * 2003-04-22 2008-03-26 セイコーエプソン株式会社 リフロ−装置及びリフロ−装置の制御方法
CN101019208B (zh) * 2004-06-28 2010-12-08 京瓷株式会社 晶片加热装置及半导体制造装置
US8129822B2 (en) * 2006-10-09 2012-03-06 Solexel, Inc. Template for three-dimensional thin-film solar cell manufacturing and methods of use
JP2007012840A (ja) * 2005-06-30 2007-01-18 Honda Motor Co Ltd はんだ付け装置
US8193076B2 (en) * 2006-10-09 2012-06-05 Solexel, Inc. Method for releasing a thin semiconductor substrate from a reusable template
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
US8901518B2 (en) * 2012-07-26 2014-12-02 Applied Materials, Inc. Chambers with improved cooling devices
US9538583B2 (en) * 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
TW201448108A (zh) * 2013-03-12 2014-12-16 應用材料股份有限公司 用於電漿處理腔室的多重區域加熱及冷卻靜電夾盤
KR101758087B1 (ko) * 2014-07-23 2017-07-14 어플라이드 머티어리얼스, 인코포레이티드 튜닝가능한 온도 제어되는 기판 지지 어셈블리
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
JP6584286B2 (ja) * 2015-10-26 2019-10-02 日本発條株式会社 ヒータユニット
JP6608444B2 (ja) * 2015-12-28 2019-11-20 日本碍子株式会社 円板状ヒータ及びヒータ冷却板アセンブリ
US10249526B2 (en) * 2016-03-04 2019-04-02 Applied Materials, Inc. Substrate support assembly for high temperature processes
US20180148835A1 (en) * 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
JP6971199B2 (ja) * 2018-05-31 2021-11-24 東京エレクトロン株式会社 基板処理方法および基板処理装置

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