TWI908896B - 用於基板的受控制局部加熱的設備及製造方法、製造配置及電腦程式產品 - Google Patents

用於基板的受控制局部加熱的設備及製造方法、製造配置及電腦程式產品

Info

Publication number
TWI908896B
TWI908896B TW110136058A TW110136058A TWI908896B TW I908896 B TWI908896 B TW I908896B TW 110136058 A TW110136058 A TW 110136058A TW 110136058 A TW110136058 A TW 110136058A TW I908896 B TWI908896 B TW I908896B
Authority
TW
Taiwan
Prior art keywords
carrier
substrate
heating zones
heating
controller
Prior art date
Application number
TW110136058A
Other languages
English (en)
Chinese (zh)
Other versions
TW202215573A (zh
Inventor
羅伯 Ｊ 亨德瑞克
Original Assignee
荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荷蘭商荷蘭Ｔｎｏ自然科學組織公司 filed Critical 荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Publication of TW202215573A publication Critical patent/TW202215573A/zh
Application granted granted Critical
Publication of TWI908896B publication Critical patent/TWI908896B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Control Of Resistance Heating (AREA)
  • Wire Bonding (AREA)
TW110136058A 2020-10-06 2021-09-28 用於基板的受控制局部加熱的設備及製造方法、製造配置及電腦程式產品 TWI908896B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20200373.7 2020-10-06
EP20200373.7A EP3982398A1 (en) 2020-10-06 2020-10-06 Controlled local heating of substrates

Publications (2)

Publication Number Publication Date
TW202215573A TW202215573A (zh) 2022-04-16
TWI908896B true TWI908896B (zh) 2025-12-21

Family

ID=72801299

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110136058A TWI908896B (zh) 2020-10-06 2021-09-28 用於基板的受控制局部加熱的設備及製造方法、製造配置及電腦程式產品

Country Status (6)

Country Link
US (1) US20230373023A1 (enExample)
EP (2) EP3982398A1 (enExample)
JP (1) JP2023546355A (enExample)
CN (1) CN116490965A (enExample)
TW (1) TWI908896B (enExample)
WO (1) WO2022075843A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4344364A1 (en) * 2022-09-23 2024-03-27 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Thermal processing device and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201448108A (zh) * 2013-03-12 2014-12-16 應用材料股份有限公司 用於電漿處理腔室的多重區域加熱及冷卻靜電夾盤
TW201737388A (zh) * 2015-12-28 2017-10-16 日本碍子股份有限公司 圓板狀加熱器及加熱器冷卻板總成
TW201803005A (zh) * 2016-03-04 2018-01-16 應用材料股份有限公司 用於高溫製程之基板支撐組件

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US6278078B1 (en) 1999-06-02 2001-08-21 Lockheed Martin Corporation Laser soldering method
JP2001339152A (ja) * 2000-05-29 2001-12-07 Nec Corp リフロー半田付け装置
US6529686B2 (en) * 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
US20040065656A1 (en) * 2002-10-04 2004-04-08 Makoto Inagawa Heated substrate support
JP4066872B2 (ja) * 2003-04-22 2008-03-26 セイコーエプソン株式会社 リフロ−装置及びリフロ−装置の制御方法
CN101019208B (zh) * 2004-06-28 2010-12-08 京瓷株式会社 晶片加热装置及半导体制造装置
US8129822B2 (en) * 2006-10-09 2012-03-06 Solexel, Inc. Template for three-dimensional thin-film solar cell manufacturing and methods of use
JP2007012840A (ja) * 2005-06-30 2007-01-18 Honda Motor Co Ltd はんだ付け装置
US8193076B2 (en) * 2006-10-09 2012-06-05 Solexel, Inc. Method for releasing a thin semiconductor substrate from a reusable template
US20120196242A1 (en) * 2011-01-27 2012-08-02 Applied Materials, Inc. Substrate support with heater and rapid temperature change
US8901518B2 (en) * 2012-07-26 2014-12-02 Applied Materials, Inc. Chambers with improved cooling devices
US9538583B2 (en) * 2013-01-16 2017-01-03 Applied Materials, Inc. Substrate support with switchable multizone heater
KR101758087B1 (ko) * 2014-07-23 2017-07-14 어플라이드 머티어리얼스, 인코포레이티드 튜닝가능한 온도 제어되는 기판 지지 어셈블리
JP2016082162A (ja) * 2014-10-21 2016-05-16 株式会社ディスコ ウエーハの加工方法
JP6584286B2 (ja) * 2015-10-26 2019-10-02 日本発條株式会社 ヒータユニット
US20180148835A1 (en) * 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
JP6971199B2 (ja) * 2018-05-31 2021-11-24 東京エレクトロン株式会社 基板処理方法および基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201448108A (zh) * 2013-03-12 2014-12-16 應用材料股份有限公司 用於電漿處理腔室的多重區域加熱及冷卻靜電夾盤
TW201737388A (zh) * 2015-12-28 2017-10-16 日本碍子股份有限公司 圓板狀加熱器及加熱器冷卻板總成
TW201803005A (zh) * 2016-03-04 2018-01-16 應用材料股份有限公司 用於高溫製程之基板支撐組件

Also Published As

Publication number Publication date
EP3982398A1 (en) 2022-04-13
EP4226413B1 (en) 2024-12-04
WO2022075843A1 (en) 2022-04-14
US20230373023A1 (en) 2023-11-23
JP2023546355A (ja) 2023-11-02
EP4226413A1 (en) 2023-08-16
TW202215573A (zh) 2022-04-16
EP4226413C0 (en) 2024-12-04
CN116490965A (zh) 2023-07-25

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