JP2023545454A - 真空チャンバを封止するための装置、真空処理システム、及びロードロックシールを監視する方法 - Google Patents

真空チャンバを封止するための装置、真空処理システム、及びロードロックシールを監視する方法 Download PDF

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Publication number
JP2023545454A
JP2023545454A JP2023522754A JP2023522754A JP2023545454A JP 2023545454 A JP2023545454 A JP 2023545454A JP 2023522754 A JP2023522754 A JP 2023522754A JP 2023522754 A JP2023522754 A JP 2023522754A JP 2023545454 A JP2023545454 A JP 2023545454A
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JP
Japan
Prior art keywords
volume
sealing
pressure
seal
conduit
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Pending
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JP2023522754A
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English (en)
Japanese (ja)
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JP2023545454A5 (https=
Inventor
マシュー ディーン アリソン，
アンドレアス ザウアー，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2023545454A publication Critical patent/JP2023545454A/ja
Publication of JP2023545454A5 publication Critical patent/JP2023545454A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/18—Vacuum control means
    • H01J2237/184—Vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Physical Vapour Deposition (AREA)
  • Furnace Details (AREA)
  • Sealing Devices (AREA)
  • Vacuum Packaging (AREA)
  • Die Bonding (AREA)
  • Examining Or Testing Airtightness (AREA)
JP2023522754A 2020-10-14 2021-09-22 真空チャンバを封止するための装置、真空処理システム、及びロードロックシールを監視する方法 Pending JP2023545454A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/070,776 US20220112594A1 (en) 2020-10-14 2020-10-14 Device for sealing a vacuum chamber, vacuum processing system, and method of monitoring a load lock seal
US17/070,776 2020-10-14
PCT/US2021/051549 WO2022081318A1 (en) 2020-10-14 2021-09-22 Device for sealing a vacuum chamber, vacuum processing system, and method of monitoring a load lock seal

Publications (2)

Publication Number Publication Date
JP2023545454A true JP2023545454A (ja) 2023-10-30
JP2023545454A5 JP2023545454A5 (https=) 2024-10-01

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JP2023522754A Pending JP2023545454A (ja) 2020-10-14 2021-09-22 真空チャンバを封止するための装置、真空処理システム、及びロードロックシールを監視する方法

Country Status (7)

Country Link
US (1) US20220112594A1 (https=)
EP (1) EP4229228A4 (https=)
JP (1) JP2023545454A (https=)
KR (1) KR20230085188A (https=)
CN (1) CN116324017A (https=)
TW (1) TWI774570B (https=)
WO (1) WO2022081318A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
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US20230407469A1 (en) * 2022-06-17 2023-12-21 Raytheon Technologies Corporation Continuous atmospheric pressure cvd tow coater process with in-situ air leak monitoring
CN116853873A (zh) * 2023-08-01 2023-10-10 天齐卫蓝固锂新材料(湖州)有限公司 一种真空腔走带隔断机构及真空开卷设备
CN119419141B (zh) * 2024-11-07 2025-11-14 拓荆创益(沈阳)半导体设备有限公司 一种真空传输阀门、控制方法及半导体薄膜设备

Citations (4)

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JPH06116722A (ja) * 1992-10-07 1994-04-26 Canon Inc スパッタリング方法，スパッタリング装置，真空処理装置および熱電対
JP2002530858A (ja) * 1998-11-12 2002-09-17 東京エレクトロン株式会社 物理蒸着室および化学蒸着室を共に処理システムに統合するためのバッファ室および統合方法
US9096934B1 (en) * 2012-10-31 2015-08-04 WD Media, LLC Load lock with variable conductance valve
WO2019207295A1 (en) * 2018-04-23 2019-10-31 Emerson & Renwick Ltd Sealing device

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JPH06116722A (ja) * 1992-10-07 1994-04-26 Canon Inc スパッタリング方法，スパッタリング装置，真空処理装置および熱電対
JP2002530858A (ja) * 1998-11-12 2002-09-17 東京エレクトロン株式会社 物理蒸着室および化学蒸着室を共に処理システムに統合するためのバッファ室および統合方法
US9096934B1 (en) * 2012-10-31 2015-08-04 WD Media, LLC Load lock with variable conductance valve
WO2019207295A1 (en) * 2018-04-23 2019-10-31 Emerson & Renwick Ltd Sealing device

Also Published As

Publication number Publication date
KR20230085188A (ko) 2023-06-13
TW202229588A (zh) 2022-08-01
EP4229228A1 (en) 2023-08-23
TWI774570B (zh) 2022-08-11
EP4229228A4 (en) 2025-01-22
CN116324017A (zh) 2023-06-23
US20220112594A1 (en) 2022-04-14
WO2022081318A1 (en) 2022-04-21

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