|
JPH0319215A
(ja)
*
|
1989-06-16 |
1991-01-28 |
Shioya Seisakusho:Kk |
貼付装置
|
|
US5738574A
(en)
|
1995-10-27 |
1998-04-14 |
Applied Materials, Inc. |
Continuous processing system for chemical mechanical polishing
|
|
US7097544B1
(en)
*
|
1995-10-27 |
2006-08-29 |
Applied Materials Inc. |
Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
|
|
JP3894514B2
(ja)
|
1997-04-04 |
2007-03-22 |
株式会社ディスコ |
研磨装置
|
|
JP3271658B2
(ja)
*
|
1998-03-23 |
2002-04-02 |
信越半導体株式会社 |
半導体シリコン単結晶ウェーハのラップ又は研磨方法
|
|
US6406359B1
(en)
|
1999-06-01 |
2002-06-18 |
Applied Materials, Inc. |
Apparatus for transferring semiconductor substrates using an input module
|
|
US6361422B1
(en)
|
1999-06-15 |
2002-03-26 |
Applied Materials, Inc. |
Method and apparatus for transferring semiconductor substrates using an input module
|
|
US6481951B1
(en)
*
|
1999-09-16 |
2002-11-19 |
Applied Materials, Inc. |
Multiple sided robot blade for semiconductor processing equipment
|
|
US6679755B1
(en)
|
1999-12-09 |
2004-01-20 |
Applied Materials Inc. |
Chemical mechanical planarization system
|
|
WO2001064391A2
(en)
|
2000-02-29 |
2001-09-07 |
Applied Materials, Inc. |
Planarization system with a wafer transfer corridor and multiple polishing modules
|
|
US6572730B1
(en)
|
2000-03-31 |
2003-06-03 |
Applied Materials, Inc. |
System and method for chemical mechanical planarization
|
|
US6413145B1
(en)
|
2000-04-05 |
2002-07-02 |
Applied Materials, Inc. |
System for polishing and cleaning substrates
|
|
US6413356B1
(en)
|
2000-05-02 |
2002-07-02 |
Applied Materials, Inc. |
Substrate loader for a semiconductor processing system
|
|
US6435941B1
(en)
|
2000-05-12 |
2002-08-20 |
Appllied Materials, Inc. |
Apparatus and method for chemical mechanical planarization
|
|
US7048607B1
(en)
|
2000-05-31 |
2006-05-23 |
Applied Materials |
System and method for chemical mechanical planarization
|
|
US6645550B1
(en)
|
2000-06-22 |
2003-11-11 |
Applied Materials, Inc. |
Method of treating a substrate
|
|
US7097534B1
(en)
|
2000-07-10 |
2006-08-29 |
Applied Materials, Inc. |
Closed-loop control of a chemical mechanical polisher
|
|
US6561884B1
(en)
|
2000-08-29 |
2003-05-13 |
Applied Materials, Inc. |
Web lift system for chemical mechanical planarization
|
|
US6613200B2
(en)
|
2001-01-26 |
2003-09-02 |
Applied Materials, Inc. |
Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
|
|
US6811680B2
(en)
*
|
2001-03-14 |
2004-11-02 |
Applied Materials Inc. |
Planarization of substrates using electrochemical mechanical polishing
|
|
US6817923B2
(en)
|
2001-05-24 |
2004-11-16 |
Applied Materials, Inc. |
Chemical mechanical processing system with mobile load cup
|
|
US6677239B2
(en)
|
2001-08-24 |
2004-01-13 |
Applied Materials Inc. |
Methods and compositions for chemical mechanical polishing
|
|
US6811466B1
(en)
|
2001-12-28 |
2004-11-02 |
Applied Materials, Inc. |
System and method for in-line metal profile measurement
|
|
US6939198B1
(en)
|
2001-12-28 |
2005-09-06 |
Applied Materials, Inc. |
Polishing system with in-line and in-situ metrology
|
|
US20030224678A1
(en)
|
2002-05-31 |
2003-12-04 |
Applied Materials, Inc. |
Web pad design for chemical mechanical polishing
|
|
US7265382B2
(en)
|
2002-11-12 |
2007-09-04 |
Applied Materials, Inc. |
Method and apparatus employing integrated metrology for improved dielectric etch efficiency
|
|
US20050092620A1
(en)
|
2003-10-01 |
2005-05-05 |
Applied Materials, Inc. |
Methods and apparatus for polishing a substrate
|
|
US7390744B2
(en)
|
2004-01-29 |
2008-06-24 |
Applied Materials, Inc. |
Method and composition for polishing a substrate
|
|
US7433759B2
(en)
|
2004-07-22 |
2008-10-07 |
Applied Materials, Inc. |
Apparatus and methods for positioning wafers
|
|
US7314808B2
(en)
*
|
2004-12-23 |
2008-01-01 |
Applied Materials, Inc. |
Method for sequencing substrates
|
|
CN101147233A
(zh)
|
2005-05-12 |
2008-03-19 |
应用材料股份有限公司 |
用于在清洁模块中垂直转移半导体基材的方法及设备
|
|
US7198548B1
(en)
|
2005-09-30 |
2007-04-03 |
Applied Materials, Inc. |
Polishing apparatus and method with direct load platen
|
|
JP2007158170A
(ja)
*
|
2005-12-07 |
2007-06-21 |
Ishikawajima Harima Heavy Ind Co Ltd |
搬送ロボット
|
|
US20070151866A1
(en)
|
2006-01-05 |
2007-07-05 |
Applied Materials, Inc. |
Substrate polishing with surface pretreatment
|
|
US7175505B1
(en)
*
|
2006-01-09 |
2007-02-13 |
Applied Materials, Inc. |
Method for adjusting substrate processing times in a substrate polishing system
|
|
US20080157455A1
(en)
*
|
2006-12-29 |
2008-07-03 |
Applied Materials, Inc. |
Compliant substrate holding assembly
|
|
US7840375B2
(en)
|
2007-04-02 |
2010-11-23 |
Applied Materials, Inc. |
Methods and apparatus for generating a library of spectra
|
|
KR101413762B1
(ko)
*
|
2007-08-22 |
2014-07-01 |
위순임 |
기판 처리 시스템
|
|
US20090061743A1
(en)
*
|
2007-08-29 |
2009-03-05 |
Stephen Jew |
Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
|
|
US20090061739A1
(en)
*
|
2007-09-05 |
2009-03-05 |
Jeong In-Kwon |
Polishing apparatus and method for polishing semiconductor wafers using load-unload stations
|
|
JP5307381B2
(ja)
*
|
2007-11-12 |
2013-10-02 |
Ｈｏｙａ株式会社 |
半導体素子ならびに半導体素子製造法
|
|
JP4732423B2
(ja)
*
|
2007-11-13 |
2011-07-27 |
株式会社デンソー |
炭化珪素半導体装置の製造方法
|
|
US8322963B2
(en)
|
2008-04-18 |
2012-12-04 |
Applied Materials, Inc. |
End effector for a cluster tool
|
|
WO2009131945A2
(en)
|
2008-04-25 |
2009-10-29 |
Applied Materials, Inc. |
High throughput chemical mechanical polishing system
|
|
US20100041316A1
(en)
|
2008-08-14 |
2010-02-18 |
Yulin Wang |
Method for an improved chemical mechanical polishing system
|
|
WO2011133386A2
(en)
|
2010-04-20 |
2011-10-27 |
Applied Materials, Inc. |
Closed-loop control for improved polishing pad profiles
|
|
US8851816B2
(en)
|
2011-04-07 |
2014-10-07 |
Microtronic, Inc. |
Apparatus, system, and methods for weighing and positioning wafers
|
|
US20120322345A1
(en)
|
2011-06-17 |
2012-12-20 |
Applied Materials, Inc. |
Apparatus for chemical mechanical polishing
|
|
US20130115862A1
(en)
|
2011-11-09 |
2013-05-09 |
Applied Materials, Inc. |
Chemical mechanical polishing platform architecture
|
|
DE102012013022A1
(de)
*
|
2012-06-29 |
2014-04-24 |
Liebherr-Verzahntechnik Gmbh |
Vorrichtung zur automatisierten Handhabung von Werkstücken
|
|
US9711381B2
(en)
|
2013-01-31 |
2017-07-18 |
Applied Materials, Inc. |
Methods and apparatus for post-chemical mechanical planarization substrate cleaning
|
|
WO2014149340A1
(en)
|
2013-03-15 |
2014-09-25 |
Applied Materials, Inc. |
Substrate position aligner
|
|
US10755960B2
(en)
*
|
2014-11-04 |
2020-08-25 |
Brooks Automation, Inc. |
Wafer aligner
|
|
US9536764B2
(en)
*
|
2015-01-27 |
2017-01-03 |
Lam Research Corporation |
End effector for wafer transfer system and method of transferring wafers
|
|
JP6276317B2
(ja)
*
|
2016-03-31 |
2018-02-07 |
平田機工株式会社 |
ハンドユニットおよび移載方法
|
|
TW201812893A
(zh)
|
2016-08-26 |
2018-04-01 |
美商應用材料股份有限公司 |
具有以機器人存取卡匣的化學機械研磨工具
|
|
US10651067B2
(en)
*
|
2017-01-26 |
2020-05-12 |
Brooks Automation, Inc. |
Method and apparatus for substrate transport apparatus position compensation
|
|
CN211332378U
(zh)
*
|
2020-06-16 |
2020-08-25 |
苏州市意可机电有限公司 |
具有机械手臂的自动上下料设备
|