KR102759345B1 - Cmp 프로세싱을 위한 방법들 및 기판 핸들링 시스템들 - Google Patents

Cmp 프로세싱을 위한 방법들 및 기판 핸들링 시스템들 Download PDF

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Publication number
KR102759345B1
KR102759345B1 KR1020237011710A KR20237011710A KR102759345B1 KR 102759345 B1 KR102759345 B1 KR 102759345B1 KR 1020237011710 A KR1020237011710 A KR 1020237011710A KR 20237011710 A KR20237011710 A KR 20237011710A KR 102759345 B1 KR102759345 B1 KR 102759345B1
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South Korea
Prior art keywords
substrate
end effector
polishing
face
station
Prior art date
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KR1020237011710A
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English (en)
Korean (ko)
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KR20230061535A (ko
Inventor
정훈 오
마노즈 에이. 가젠드라
존 앤서니 가르시아
체탄 쿠마르 마일랍파나할리 나라싱가이아
산제이 바누라오 차반
가간 도발
마노즈 발라쿠마르
제이미 스튜어트 레이튼
반 에이치. 응우옌
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20230061535A publication Critical patent/KR20230061535A/ko
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H01L21/02013—
    • H01L21/02016—
    • H01L21/02019—
    • H01L21/02024—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/123—Preparing bulk and homogeneous wafers by grinding or lapping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/124—Preparing bulk and homogeneous wafers by processing the backside of the wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/126—Preparing bulk and homogeneous wafers by chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020237011710A 2020-09-08 2021-08-19 Cmp 프로세싱을 위한 방법들 및 기판 핸들링 시스템들 Active KR102759345B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063075607P 2020-09-08 2020-09-08
US63/075,607 2020-09-08
PCT/US2021/046605 WO2022072079A2 (en) 2020-09-08 2021-08-19 Substrate handling systems and methods for cmp processing

Publications (2)

Publication Number Publication Date
KR20230061535A KR20230061535A (ko) 2023-05-08
KR102759345B1 true KR102759345B1 (ko) 2025-01-22

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KR1020237011710A Active KR102759345B1 (ko) 2020-09-08 2021-08-19 Cmp 프로세싱을 위한 방법들 및 기판 핸들링 시스템들

Country Status (7)

Country Link
US (1) US12454036B2 (enExample)
EP (1) EP4210903A4 (enExample)
JP (1) JP7763244B2 (enExample)
KR (1) KR102759345B1 (enExample)
CN (1) CN116234661A (enExample)
TW (2) TWI875625B (enExample)
WO (1) WO2022072079A2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114649245B (zh) * 2022-05-19 2022-09-09 西安奕斯伟材料科技有限公司 一种用于承载和清洁硅片的装置
US12539577B2 (en) * 2022-10-03 2026-02-03 Applied Materials, Inc. System and method for detecting a membrane failure in a chemical mechanical polishing system
WO2024091617A1 (en) * 2022-10-27 2024-05-02 Berkshire Grey Operating Company, Inc. Systems and methods for automated packaging and processing with object placement pose control

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070238399A1 (en) 1995-10-27 2007-10-11 Applied Materials, Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US20080157455A1 (en) 2006-12-29 2008-07-03 Applied Materials, Inc. Compliant substrate holding assembly
US20090061739A1 (en) 2007-09-05 2009-03-05 Jeong In-Kwon Polishing apparatus and method for polishing semiconductor wafers using load-unload stations
US20140154036A1 (en) 2012-06-29 2014-06-05 Liebherr-Verzahntechnik Gmbh Apparatus for the automated handling of workpieces
US20170287759A1 (en) 2016-03-31 2017-10-05 Hirata Corporation Hand unit and transfer method

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319215A (ja) * 1989-06-16 1991-01-28 Shioya Seisakusho:Kk 貼付装置
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP3894514B2 (ja) 1997-04-04 2007-03-22 株式会社ディスコ 研磨装置
JP3271658B2 (ja) * 1998-03-23 2002-04-02 信越半導体株式会社 半導体シリコン単結晶ウェーハのラップ又は研磨方法
US6406359B1 (en) 1999-06-01 2002-06-18 Applied Materials, Inc. Apparatus for transferring semiconductor substrates using an input module
US6361422B1 (en) 1999-06-15 2002-03-26 Applied Materials, Inc. Method and apparatus for transferring semiconductor substrates using an input module
US6481951B1 (en) * 1999-09-16 2002-11-19 Applied Materials, Inc. Multiple sided robot blade for semiconductor processing equipment
US6679755B1 (en) 1999-12-09 2004-01-20 Applied Materials Inc. Chemical mechanical planarization system
WO2001064391A2 (en) 2000-02-29 2001-09-07 Applied Materials, Inc. Planarization system with a wafer transfer corridor and multiple polishing modules
US6572730B1 (en) 2000-03-31 2003-06-03 Applied Materials, Inc. System and method for chemical mechanical planarization
US6413145B1 (en) 2000-04-05 2002-07-02 Applied Materials, Inc. System for polishing and cleaning substrates
US6413356B1 (en) 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
US6435941B1 (en) 2000-05-12 2002-08-20 Appllied Materials, Inc. Apparatus and method for chemical mechanical planarization
US7048607B1 (en) 2000-05-31 2006-05-23 Applied Materials System and method for chemical mechanical planarization
US6645550B1 (en) 2000-06-22 2003-11-11 Applied Materials, Inc. Method of treating a substrate
US7097534B1 (en) 2000-07-10 2006-08-29 Applied Materials, Inc. Closed-loop control of a chemical mechanical polisher
US6561884B1 (en) 2000-08-29 2003-05-13 Applied Materials, Inc. Web lift system for chemical mechanical planarization
US6613200B2 (en) 2001-01-26 2003-09-02 Applied Materials, Inc. Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
US6811680B2 (en) * 2001-03-14 2004-11-02 Applied Materials Inc. Planarization of substrates using electrochemical mechanical polishing
US6817923B2 (en) 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
US6677239B2 (en) 2001-08-24 2004-01-13 Applied Materials Inc. Methods and compositions for chemical mechanical polishing
US6811466B1 (en) 2001-12-28 2004-11-02 Applied Materials, Inc. System and method for in-line metal profile measurement
US6939198B1 (en) 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
US20030224678A1 (en) 2002-05-31 2003-12-04 Applied Materials, Inc. Web pad design for chemical mechanical polishing
US7265382B2 (en) 2002-11-12 2007-09-04 Applied Materials, Inc. Method and apparatus employing integrated metrology for improved dielectric etch efficiency
US20050092620A1 (en) 2003-10-01 2005-05-05 Applied Materials, Inc. Methods and apparatus for polishing a substrate
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US7433759B2 (en) 2004-07-22 2008-10-07 Applied Materials, Inc. Apparatus and methods for positioning wafers
US7314808B2 (en) * 2004-12-23 2008-01-01 Applied Materials, Inc. Method for sequencing substrates
CN101147233A (zh) 2005-05-12 2008-03-19 应用材料股份有限公司 用于在清洁模块中垂直转移半导体基材的方法及设备
US7198548B1 (en) 2005-09-30 2007-04-03 Applied Materials, Inc. Polishing apparatus and method with direct load platen
JP2007158170A (ja) * 2005-12-07 2007-06-21 Ishikawajima Harima Heavy Ind Co Ltd 搬送ロボット
US20070151866A1 (en) 2006-01-05 2007-07-05 Applied Materials, Inc. Substrate polishing with surface pretreatment
US7175505B1 (en) * 2006-01-09 2007-02-13 Applied Materials, Inc. Method for adjusting substrate processing times in a substrate polishing system
US7840375B2 (en) 2007-04-02 2010-11-23 Applied Materials, Inc. Methods and apparatus for generating a library of spectra
KR101413762B1 (ko) * 2007-08-22 2014-07-01 위순임 기판 처리 시스템
US20090061743A1 (en) * 2007-08-29 2009-03-05 Stephen Jew Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rate
JP5307381B2 (ja) * 2007-11-12 2013-10-02 Ｈｏｙａ株式会社 半導体素子ならびに半導体素子製造法
JP4732423B2 (ja) * 2007-11-13 2011-07-27 株式会社デンソー 炭化珪素半導体装置の製造方法
US8322963B2 (en) 2008-04-18 2012-12-04 Applied Materials, Inc. End effector for a cluster tool
WO2009131945A2 (en) 2008-04-25 2009-10-29 Applied Materials, Inc. High throughput chemical mechanical polishing system
US20100041316A1 (en) 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system
WO2011133386A2 (en) 2010-04-20 2011-10-27 Applied Materials, Inc. Closed-loop control for improved polishing pad profiles
US8851816B2 (en) 2011-04-07 2014-10-07 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
US20120322345A1 (en) 2011-06-17 2012-12-20 Applied Materials, Inc. Apparatus for chemical mechanical polishing
US20130115862A1 (en) 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
US9711381B2 (en) 2013-01-31 2017-07-18 Applied Materials, Inc. Methods and apparatus for post-chemical mechanical planarization substrate cleaning
WO2014149340A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc. Substrate position aligner
US10755960B2 (en) * 2014-11-04 2020-08-25 Brooks Automation, Inc. Wafer aligner
US9536764B2 (en) * 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
TW201812893A (zh) 2016-08-26 2018-04-01 美商應用材料股份有限公司 具有以機器人存取卡匣的化學機械研磨工具
US10651067B2 (en) * 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
CN211332378U (zh) * 2020-06-16 2020-08-25 苏州市意可机电有限公司 具有机械手臂的自动上下料设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070238399A1 (en) 1995-10-27 2007-10-11 Applied Materials, Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
US20080157455A1 (en) 2006-12-29 2008-07-03 Applied Materials, Inc. Compliant substrate holding assembly
US20090061739A1 (en) 2007-09-05 2009-03-05 Jeong In-Kwon Polishing apparatus and method for polishing semiconductor wafers using load-unload stations
US20140154036A1 (en) 2012-06-29 2014-06-05 Liebherr-Verzahntechnik Gmbh Apparatus for the automated handling of workpieces
US20170287759A1 (en) 2016-03-31 2017-10-05 Hirata Corporation Hand unit and transfer method

Also Published As

Publication number Publication date
TWI875625B (zh) 2025-03-01
US12454036B2 (en) 2025-10-28
JP7763244B2 (ja) 2025-10-31
JP2023540884A (ja) 2023-09-27
CN116234661A (zh) 2023-06-06
EP4210903A2 (en) 2023-07-19
TWI849331B (zh) 2024-07-21
TW202224849A (zh) 2022-07-01
WO2022072079A2 (en) 2022-04-07
TW202442373A (zh) 2024-11-01
US20220072682A1 (en) 2022-03-10
KR20230061535A (ko) 2023-05-08
EP4210903A4 (en) 2024-10-16
WO2022072079A3 (en) 2022-07-14

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