JP2023521608A - ポリウレタン系粘着剤組成物、これを含む表面保護フィルム、表面保護フィルムの製造方法、および有機発光電子装置の製造方法 - Google Patents
ポリウレタン系粘着剤組成物、これを含む表面保護フィルム、表面保護フィルムの製造方法、および有機発光電子装置の製造方法 Download PDFInfo
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- JP2023521608A JP2023521608A JP2022559710A JP2022559710A JP2023521608A JP 2023521608 A JP2023521608 A JP 2023521608A JP 2022559710 A JP2022559710 A JP 2022559710A JP 2022559710 A JP2022559710 A JP 2022559710A JP 2023521608 A JP2023521608 A JP 2023521608A
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- polyurethane
- adhesive composition
- film
- sensitive adhesive
- pressure
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- 239000000203 mixture Substances 0.000 title claims abstract description 119
- 239000004814 polyurethane Substances 0.000 title claims abstract description 92
- 229920002635 polyurethane Polymers 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 86
- 230000001681 protective effect Effects 0.000 title claims abstract description 35
- 239000000853 adhesive Substances 0.000 title claims description 36
- 230000001070 adhesive effect Effects 0.000 title claims description 36
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 93
- 239000010408 film Substances 0.000 claims description 111
- 229920005862 polyol Polymers 0.000 claims description 67
- 229920000642 polymer Polymers 0.000 claims description 48
- -1 tackifiers Substances 0.000 claims description 46
- 150000003077 polyols Chemical class 0.000 claims description 43
- 239000002313 adhesive film Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 32
- 239000012948 isocyanate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 27
- 230000001588 bifunctional effect Effects 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 14
- 150000002513 isocyanates Chemical class 0.000 claims description 14
- 239000003431 cross linking reagent Substances 0.000 claims description 11
- 230000009477 glass transition Effects 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000001723 curing Methods 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 6
- 229920001230 polyarylate Polymers 0.000 claims description 6
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000013007 heat curing Methods 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 2
- 239000002270 dispersing agent Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 229920000636 poly(norbornene) polymer Polymers 0.000 claims description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 63
- 239000010410 layer Substances 0.000 description 49
- 230000000052 comparative effect Effects 0.000 description 25
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 25
- 238000002360 preparation method Methods 0.000 description 17
- 239000000178 monomer Substances 0.000 description 15
- 125000000524 functional group Chemical group 0.000 description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 238000007789 sealing Methods 0.000 description 11
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 238000011109 contamination Methods 0.000 description 8
- 238000001879 gelation Methods 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000002041 carbon nanotube Substances 0.000 description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 3
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 2
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- QXRRAZIZHCWBQY-UHFFFAOYSA-N 1,1-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1(CN=C=O)CCCCC1 QXRRAZIZHCWBQY-UHFFFAOYSA-N 0.000 description 1
- GFNDFCFPJQPVQL-UHFFFAOYSA-N 1,12-diisocyanatododecane Chemical compound O=C=NCCCCCCCCCCCCN=C=O GFNDFCFPJQPVQL-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- UFXYYTWJETZVHG-UHFFFAOYSA-N 1,3-diisocyanatobutane Chemical compound O=C=NC(C)CCN=C=O UFXYYTWJETZVHG-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- 239000005059 1,4-Cyclohexyldiisocyanate Substances 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- DFPJRUKWEPYFJT-UHFFFAOYSA-N 1,5-diisocyanatopentane Chemical compound O=C=NCCCCCN=C=O DFPJRUKWEPYFJT-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- JRQLZCFSWYQHPI-UHFFFAOYSA-N 4,5-dichloro-2-cyclohexyl-1,2-thiazol-3-one Chemical compound O=C1C(Cl)=C(Cl)SN1C1CCCCC1 JRQLZCFSWYQHPI-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical class CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000008194 pharmaceutical composition Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4804—Two or more polyethers of different physical or chemical nature
- C08G18/4812—Mixtures of polyetherdiols with polyetherpolyols having at least three hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4804—Two or more polyethers of different physical or chemical nature
- C08G18/4816—Two or more polyethers of different physical or chemical nature mixtures of two or more polyetherpolyols having at least three hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4829—Polyethers containing at least three hydroxy groups
-
- C—CHEMISTRY; METALLURGY
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Abstract
Description
本発明を説明するに先立ち、先ず、幾つかの用語を定義する。
本明細書において、「p~q」は、「p以上q以下」の範囲を意味する。
本明細書において、「単量体単位」とは、当該化合物が重合され、重合体中に結合された状態を意味する。
前記重量平均分子量は、GPC(Gel Permeation Chromatography)分析により測定することができる。
本出願の一実施態様において、前記ポリウレタン重合体100重量部に対して2官能ポリオール5~40重量部、および前記ポリウレタン重合体100重量部に対して3官能ポリオール60~95重量部を含んでもよい。
本出願の一実施態様において、前記ポリウレタン重合体100重量部に対して3官能ポリオール60~95重量部、好ましくは60~90重量部、より好ましくは70~90重量部を含んでもよい。
他の一実施態様において、前記ポリウレタン重合体の不揮発分は、65%以上95%以下、70%以上95%以下、75%以上90%以下であってもよい。
他の一実施態様において、前記ポリウレタン重合体の分子量は、50,000g/mol以上200,000g/mol以下、好ましくは60,000g/mol以上180,000g/mol以下、より好ましくは80,000g/mol以上150,000g/mol以下の範囲を満たしてもよい。
[一般式1]
1/Tg=W1/Tg1+W2/Tg2+…+Wn/Tgn
前記一般式1は、重合体Aが単量体1、単量体2、…、単量体nのn種類の単量体成分を含む場合の計算式を意味する。
前記一般式1は、アクリルモノマーをベースとしたアクリル樹脂の場合であるが、本願発明のようにウレタン樹脂で公知のポリオールのガラス転移温度などに同様に測定されてもよい。
また、前記熱開始剤としては、当業界で周知のものを用いてもよい。
本出願において、前記ポリウレタン系粘着剤組成物を含む粘着フィルムの意味は、前記粘着剤組成物を乾燥して含むことを含んでもよい。
本出願において、前記ポリウレタン系粘着剤組成物を含む粘着フィルムの意味は、前記粘着剤組成物を光硬化して含むことを含んでもよい。
前記PET(polyethylene terephthalate)、PEN(polyethylene naphthalate)、およびPAR(polyarylate)は、ポリエステル(polyester)の一種類であってもよい。
他の一実施態様において、前記基材フィルムは、PET(polyethylene terephthalate)であってもよい。
本出願の一実施態様において、前記粘着フィルムの前記基材フィルムと接する面の反対面に離型シートをさらに含む、表面保護フィルムを提供する。
前記離型シートは、工程用表面保護用途として適用時に全て除去されてもよい。
本明細書の一実施態様において、前記有機発光電子装置の製造方法は、前述の表面保護フィルムの粘着フィルムを有機発光素子の封止層上に付着するステップを含む。
<表面保護フィルムの製造>
製造例1-粘着剤組成物の製造
2Lの五口反応器に、ポリオール100重量部に対して、2官能エーテルポリオール(PPGにEO 20%付加されたもの、商品名:KPX社のSC2204)10部、3官能エーテルポリオール(商品名:KPX社のSC3314)90部を投入した後、OH/NCO(官能基のモル比率)が1.5となる量だけのイソシアネートであるH12MDI(Evonik社)を投入した後、トルエン40重量部を投入した(不揮発分71%)。
常温(25℃)から80℃に昇温維持しつつ、IRスペクトルで残存イソシアネート基の消滅を確認し、反応を終了して樹脂を排出した。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG)20部、3官能エーテルポリオール(PPG)80部を投入したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG+EO)20部、3官能エーテルポリオール(PPG)80部を投入したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例3と同様の方法により、イソシアネートであるH12MDIをOH/NCOが1.45となる量に変更したことを除いては、前記製造例3と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG)20部、3官能エーテルポリオール(PPG+EO)80部を投入したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG)30部、3官能エーテルポリオール(PPG+EO)70部を投入したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG+EO)20部、3官能エーテルポリオール(PPG)80部を投入し、イソシアネートであるH12MDIをOH/NCOが1.6となる量に変更したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例7と同様の方法により、イソシアネートであるH12MDIをOH/NCOが1.65となる量に変更したことを除いては、前記製造例7と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG)70部、3官能エーテルポリオール(PPG)30部を投入し、OH/NCOを1.2に調整したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記比較製造例1と同様の方法により、2官能エーテルポリオール(PPG)80部、3官能エーテルポリオール(PPG)20部を投入したことを除いては、前記比較製造例1と同様に製造した(不揮発分71%)。
前記比較製造例1と同様の方法により、2官能エーテルポリオール(PPG)90部、3官能エーテルポリオール(PPG)10部を投入したことを除いては、前記比較製造例1と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エステル(Ester)ポリオール20部、3官能エーテルポリオール(PPG)80部を投入したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG+EO)100部を投入し、OH/NCOを1.1に調整したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記製造例1と同様の方法により、2官能エーテルポリオール(PPG+EO)100部を投入したことを除いては、前記製造例1と同様に製造した(不揮発分71%)。
前記比較製造例5と同様の方法により、OH/NCOを1.3に調整したことを除いては、前記比較製造例5と同様に製造した(不揮発分71%)。
前記製造例3と同様の方法により、OH/NCOを1.2に調整したことを除いては、前記製造例3と同様に製造した(不揮発分71%)。
前記製造例1において、トルエンを100重量部投入したことを除いては、前記製造例1と同様に製造した(不揮発分50%)。
前記製造例1~8および比較製造例1~9を固形分基準に100重量部に対して多官能イソシアネート硬化剤15重量部を入れて十分に撹拌した後、ポリエステル(PET)フィルムにコーティングして140℃のオーブンで3分間乾燥させ、75μm厚さのポリウレタン粘着層を製造した。その後、50℃のオーブンで120時間エージングを行った。
製造例1~8および比較製造例1~9に対するOH/NCO官能基比、分子量、粘度、ポリオールの組成および含量は下記表1のとおりである。
20 ・・・粘着フィルム
40 ・・・表面保護フィルム
510 ・・・有機発光素子
511 ・・・ガラス
512 ・・・プラスチック基板
513 ・・・薄膜トランジスタ
514 ・・・有機発光ダイオード
515 ・・・封止層
Claims (17)
- 2官能ポリオールおよび3官能ポリオールを含むポリウレタン重合体;および
イソシアネート系架橋剤を含むポリウレタン系粘着剤組成物であって、
前記粘着剤組成物の粘度は、25℃、相対湿度60%の条件で、1,000cPs以上10,000cPs以下であり、
前記ポリウレタン重合体100重量部に対して2官能ポリオール5~40重量部、および
前記ポリウレタン重合体100重量部に対して3官能ポリオール60~95重量部を含む、ポリウレタン系粘着剤組成物。 - 前記ポリウレタン重合体は、溶媒を含み、前記溶媒は、
前記2官能ポリオールおよび前記3官能ポリオールの合計100重量部に対して5重量部以上35重量部以下で含まれる、請求項1に記載のポリウレタン系粘着剤組成物。 - 前記ポリウレタン重合体の水酸基とイソシアネート官能基のモル比率(-OH/NCO)が1.3以上1.7以下である、請求項1に記載のポリウレタン系粘着剤組成物。
- 前記ポリウレタン重合体の分子量は、50,000g/mol以上200,000g/mol以下である、請求項1に記載のポリウレタン系粘着剤組成物。
- 前記ポリウレタン系粘着剤組成物のガラス転移温度(Tg、Glass Transition Temperature)値が0℃以下である、請求項1に記載のポリウレタン系粘着剤組成物。
- 前記ポリウレタン系粘着剤組成物は、溶媒、硬化剤、分散剤、光開始剤、熱開始剤、シランカップリング剤、可塑剤、粘着付与剤、および帯電防止剤からなる群より選択された一つ以上をさらに含む、請求項1に記載のポリウレタン系粘着剤組成物。
- 基材フィルム;および
前記基材フィルムの一面に備えられた請求項1~6のいずれか1項に記載のポリウレタン系粘着剤組成物またはその硬化物を含む粘着フィルム;
を含む、表面保護フィルム。 - 前記粘着フィルムの一面をガラス基板に対して接合した後、剥離角度180°、1.8m/minの速度で剥離する際、低速剥離力が5gf/inch以上であり、前記粘着フィルムの一面をガラス基板に対して接合した後、剥離角度180°、20m/minの速度で剥離する際、高速剥離力が50gf/inch以下である、請求項7に記載の表面保護フィルム。
- 前記基材フィルムの厚さは、25μm以上150μm以下である、請求項7に記載の表面保護フィルム。
- 前記粘着フィルムの厚さは、10μm以上100μm以下である、請求項7に記載の表面保護フィルム。
- 前記粘着フィルムの前記基材フィルムと接する面の反対面に離型シートをさらに含む、請求項7に記載の表面保護フィルム。
- 前記基材フィルムは、PET(polyethylene terephthalate)、PC(Polycarbonate)、PI(polyimide)、PEN(polyethylene naphthalate)、PEEK(polyether ether ketone)、PAR(polyarylate)、PCO(polycylicolefin)、ポリノルボルネン(polynorbornene)、PES(polyethersulphone)、およびCOP(cycloolefin polymer)からなる群より選択される、請求項7に記載の表面保護フィルム。
- 請求項1~6のいずれか1項に記載のポリウレタン系粘着剤組成物を準備するステップ;
前記ポリウレタン系粘着剤組成物に硬化剤を添加するステップ;および
前記ポリウレタン系粘着剤組成物を基材フィルムにコーティングするステップ;
を含む、表面保護フィルムの製造方法。 - 前記ポリウレタン系粘着剤組成物を基材フィルムにコーティングするステップの後に、
前記ポリウレタン系粘着剤組成物を乾燥するステップ;および
前記ポリウレタン系粘着剤組成物を熱硬化するステップ;
を含む、請求項13に記載の表面保護フィルムの製造方法。 - 基材フィルム;および前記基材フィルムの一面に備えられた請求項1~6のいずれか1項に記載のポリウレタン系粘着剤組成物またはその硬化物を含む粘着フィルムを含む表面保護フィルムの前記粘着フィルムを有機発光素子の封止層上に付着するステップを含む、有機発光電子装置の製造方法。
- 前記有機発光素子は、ガラス、プラスチック基板、薄膜トランジスタ、有機発光ダイオード、および封止層を順に含む、請求項15に記載の有機発光電子装置の製造方法。
- 前記表面保護フィルムを前記封止層から剥離するステップ;および前記封止層上にタッチスクリーンパネルおよびカバーウィンドウを積層するステップをさらに含む、請求項15に記載の有機発光電子装置の製造方法。
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