JP2023520034A5 - - Google Patents

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Publication number
JP2023520034A5
JP2023520034A5 JP2022559852A JP2022559852A JP2023520034A5 JP 2023520034 A5 JP2023520034 A5 JP 2023520034A5 JP 2022559852 A JP2022559852 A JP 2022559852A JP 2022559852 A JP2022559852 A JP 2022559852A JP 2023520034 A5 JP2023520034 A5 JP 2023520034A5
Authority
JP
Japan
Prior art keywords
support stand
edge ring
circuit board
substrate support
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022559852A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023520034A (ja
JP7754833B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/023406 external-priority patent/WO2021202136A1/en
Publication of JP2023520034A publication Critical patent/JP2023520034A/ja
Publication of JP2023520034A5 publication Critical patent/JP2023520034A5/ja
Priority to JP2025166072A priority Critical patent/JP2026004461A/ja
Application granted granted Critical
Publication of JP7754833B2 publication Critical patent/JP7754833B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022559852A 2020-04-02 2021-03-22 一体型シールを備える冷却エッジリング Active JP7754833B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025166072A JP2026004461A (ja) 2020-04-02 2025-10-02 一体型シールを備える冷却エッジリング

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063004055P 2020-04-02 2020-04-02
US63/004,055 2020-04-02
PCT/US2021/023406 WO2021202136A1 (en) 2020-04-02 2021-03-22 Cooled edge ring with integrated seals

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025166072A Division JP2026004461A (ja) 2020-04-02 2025-10-02 一体型シールを備える冷却エッジリング

Publications (3)

Publication Number Publication Date
JP2023520034A JP2023520034A (ja) 2023-05-15
JP2023520034A5 true JP2023520034A5 (enExample) 2024-03-28
JP7754833B2 JP7754833B2 (ja) 2025-10-15

Family

ID=77929351

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022559852A Active JP7754833B2 (ja) 2020-04-02 2021-03-22 一体型シールを備える冷却エッジリング
JP2025166072A Pending JP2026004461A (ja) 2020-04-02 2025-10-02 一体型シールを備える冷却エッジリング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025166072A Pending JP2026004461A (ja) 2020-04-02 2025-10-02 一体型シールを備える冷却エッジリング

Country Status (6)

Country Link
US (1) US20230133798A1 (enExample)
JP (2) JP7754833B2 (enExample)
KR (2) KR102902338B1 (enExample)
CN (1) CN115362543A (enExample)
TW (1) TW202209395A (enExample)
WO (1) WO2021202136A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12334383B2 (en) 2021-12-16 2025-06-17 Applied Materials, Inc. Substrate support gap pumping to prevent glow discharge and light-up
JP7554220B2 (ja) * 2022-03-08 2024-09-19 日本碍子株式会社 半導体製造装置用部材
WO2025128412A1 (en) * 2023-12-11 2025-06-19 Lam Research Corporation Cooled edge ring with securing mechanism

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4592916B2 (ja) * 2000-04-25 2010-12-08 東京エレクトロン株式会社 被処理体の載置装置
US6475336B1 (en) * 2000-10-06 2002-11-05 Lam Research Corporation Electrostatically clamped edge ring for plasma processing
US20040261946A1 (en) * 2003-04-24 2004-12-30 Tokyo Electron Limited Plasma processing apparatus, focus ring, and susceptor
JP2009290087A (ja) * 2008-05-30 2009-12-10 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置
JP5482282B2 (ja) * 2009-03-03 2014-05-07 東京エレクトロン株式会社 載置台構造及び成膜装置
JP5642531B2 (ja) 2010-12-22 2014-12-17 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6689020B2 (ja) * 2013-08-21 2020-04-28 東京エレクトロン株式会社 プラズマ処理装置
JP5798677B2 (ja) * 2014-10-29 2015-10-21 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US10658222B2 (en) * 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
JP6435247B2 (ja) * 2015-09-03 2018-12-05 新光電気工業株式会社 静電チャック装置及び静電チャック装置の製造方法
JP6806051B2 (ja) * 2015-10-21 2021-01-06 住友大阪セメント株式会社 静電チャック装置
US9922857B1 (en) * 2016-11-03 2018-03-20 Lam Research Corporation Electrostatically clamped edge ring
WO2019088204A1 (ja) * 2017-11-06 2019-05-09 日本碍子株式会社 静電チャックアセンブリ、静電チャック及びフォーカスリング
JP2021077752A (ja) * 2019-11-07 2021-05-20 東京エレクトロン株式会社 プラズマ処理装置

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