JP2017525163A - マイクロ電気機械部品を特に熱接合するための装置 - Google Patents
マイクロ電気機械部品を特に熱接合するための装置 Download PDFInfo
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Abstract
Description
Claims (11)
- 接合されるマイクロ電気機械部材(2,3)のうちの少なくとも1つの第1部材(2)を受け取るための下部支持板(11)を有し、かつ、前記接合される部材(2,3)のうちの少なくとも1つの第2部材(3)上に前記少なくとも1つの第1部材(2)の方向に加圧するための加圧装置(15)を有するプロセスチャンバ(B)において、前記部材(2,3)を特に熱接合するための装置であって、
前記加圧装置(15)が、前記少なくとも1つの第2部材(3)と接触するように設けられる膨張膜(19)を用いて形成され、
流体圧力、特に気体圧力が、前記膜(19)上に、前記接合される部材(2,3)から離間する側で付与され得ることを特徴とする装置。 - 前記膜(19)が、気密性のあるシート材料、特にゴム状材料で製造されることを特徴とする請求項1に記載の装置。
- 前記膜(19)の厚さおよびその膨張性が、好ましくは、前記膜(19)が、その接触動作条件において、前記部材(2,3)間に存在する高さの違いにかかわらず、前記部材(2,3)上に少なくとも略同一の接触圧力を付与するように、前記接合される部材(2,3)のトポグラフィーに従って選択されることを特徴とする請求項1または請求項2に記載の装置。
- 前記膜(19)が、少なくとも実質的に前記支持板(11)に平行な平面となるように、かつ、少なくともそれに垂直になるように移動可能に配置されるところの圧力板(16)に広がっており、圧力媒体が、前記膜(19)が接合される前記部材(2,3)の方へ膨張するように、前記膜(19)と前記圧力板(16)との間に設けられることができることを特徴とする請求項1から請求項3のいずれか1項に記載の装置。
- 前記膜(19)が、安定した密封態様で、その周辺領域において前記圧力板(16)へ保持固定装置(20)を用いて取り付けられることを特徴とする請求項1から請求項4のいずれか1項に記載の装置。
- 前記保持固定装置(20)が、特に前記膜(19)の周囲に拡張する締付リング(21)を備えており、前記膜(19)が前記圧力板(16)および/または介在する密封装置(22)に固定されるのを可能とすることを特徴とする請求項1から請求項5のいずれか1項に記載の装置。
- 負圧が、特に前記膜(19)の非接触動作条件において、接合される前記部材(2,3)から離間する側の前記膜(19)上に付与され得ることを特徴とする請求項1から請求項6のいずれか1項に記載の装置。
- 加熱装置(12,14)が、前記圧力板(16)の上におよび/または前記支持板(11)の下に設けられることを特徴とする請求項1から請求項7のいずれか1項に記載の装置。
- 前記支持板(11)が、加熱板として設けられることを特徴とする請求項1から請求項8のいずれか1項に記載の装置。
- 前記プロセスチャンバ(B)が、密閉筐体(4)を有し、かつ、真空チャンバ(8)の脱気または排気のためおよび気体の曝気または導入のために設けられるところの前記筐体(4)の少なくとも1つの開口(9)を有する前記真空チャンバ(8)として設けられることを特徴とする請求項1から請求項9のいずれか1項に記載の装置。
- 制御装置(24)を用いて、前記加圧装置(15)の少なくとも前記流体圧力を、前記選択されたプロセス、特にTLPS(transient liquid phase soldering)プロセス、TLPB(transient liquid phase bonding)プロセスまたは焼結プロセスに従って、および、接合される前記部材(2,3)のトポグラフィーに従って調整することができることを特徴とする請求項1から請求項10のいずれか1項に記載の装置。
Applications Claiming Priority (3)
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DE102014111634.8 | 2014-08-14 | ||
DE102014111634.8A DE102014111634A1 (de) | 2014-08-14 | 2014-08-14 | Vorrichtung zum insbesondere thermischen Verbinden mikro-elektromechanischer Bauteile |
PCT/DE2015/000401 WO2016023535A1 (de) | 2014-08-14 | 2015-08-14 | Vorrichtung zum insbesondere thermischen verbinden mikro-elektromechanischer bauteile |
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JP2017525163A true JP2017525163A (ja) | 2017-08-31 |
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US (1) | US20170243851A1 (ja) |
EP (1) | EP3180801A1 (ja) |
JP (1) | JP2017525163A (ja) |
KR (1) | KR20170041267A (ja) |
CN (1) | CN106716614A (ja) |
DE (1) | DE102014111634A1 (ja) |
WO (1) | WO2016023535A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015106298B4 (de) * | 2015-04-24 | 2017-01-26 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung, Verfahren und Anlage zur inhomogenen Abkühlung eines flächigen Gegenstandes |
US11397143B2 (en) * | 2016-10-20 | 2022-07-26 | Coldblock Technologies Inc. | Digester system for processing a plurality of samples for chemical analysis |
JP2020520410A (ja) * | 2017-05-12 | 2020-07-09 | ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー | 金属ペーストの手段によりコンポーネントを接続する方法 |
FR3073206B1 (fr) * | 2017-11-08 | 2021-03-19 | Safran Nacelles | Procede de fabrication de panneau structural et/ou acoustique pour nacelle d'ensemble propulsif d'aeronef, et dispositif s'y rapportant |
CN110282598B (zh) * | 2019-07-10 | 2021-12-28 | 苏州美图半导体技术有限公司 | 真空环境下晶圆低温键合方法 |
US11804467B2 (en) * | 2020-06-25 | 2023-10-31 | Micron Technology, Inc. | Radiative heat collective bonder and gangbonder |
CN113284813B (zh) * | 2021-05-19 | 2022-11-04 | 芯创(天门)电子科技有限公司 | 一种芯片加工用键合设备及键合工艺 |
TW202330132A (zh) * | 2021-10-14 | 2023-08-01 | 德商平克塞莫系統有限公司 | 多功能燒結或擴散焊接設備和沖壓工具 |
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DE102004010399A1 (de) * | 2004-03-03 | 2005-09-22 | Atv Technologie Gmbh | Vorrichtung zum thermischen Verbinden von Elementen mit einem Substrat |
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2014
- 2014-08-14 DE DE102014111634.8A patent/DE102014111634A1/de not_active Ceased
-
2015
- 2015-08-14 EP EP15797245.6A patent/EP3180801A1/de not_active Withdrawn
- 2015-08-14 WO PCT/DE2015/000401 patent/WO2016023535A1/de active Application Filing
- 2015-08-14 KR KR1020177006887A patent/KR20170041267A/ko unknown
- 2015-08-14 JP JP2017527968A patent/JP2017525163A/ja active Pending
- 2015-08-14 CN CN201580053334.8A patent/CN106716614A/zh active Pending
- 2015-08-14 US US15/503,929 patent/US20170243851A1/en not_active Abandoned
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DE102004010399A1 (de) * | 2004-03-03 | 2005-09-22 | Atv Technologie Gmbh | Vorrichtung zum thermischen Verbinden von Elementen mit einem Substrat |
JP2010516478A (ja) * | 2007-01-22 | 2010-05-20 | ユニヴァーシティー オブ メリーランド | 高温はんだ材料 |
JP2013052424A (ja) * | 2011-09-05 | 2013-03-21 | Mikado Technos Kk | 真空加熱接合装置及び真空加熱接合方法 |
Also Published As
Publication number | Publication date |
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US20170243851A1 (en) | 2017-08-24 |
CN106716614A (zh) | 2017-05-24 |
KR20170041267A (ko) | 2017-04-14 |
EP3180801A1 (de) | 2017-06-21 |
WO2016023535A1 (de) | 2016-02-18 |
DE102014111634A1 (de) | 2016-02-18 |
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