JP2023514839A - 基板処理台座のための内部フィンを備えた冷却剤チャネル - Google Patents

基板処理台座のための内部フィンを備えた冷却剤チャネル Download PDF

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Publication number
JP2023514839A
JP2023514839A JP2022549846A JP2022549846A JP2023514839A JP 2023514839 A JP2023514839 A JP 2023514839A JP 2022549846 A JP2022549846 A JP 2022549846A JP 2022549846 A JP2022549846 A JP 2022549846A JP 2023514839 A JP2023514839 A JP 2023514839A
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JP
Japan
Prior art keywords
coolant channel
baseplate
fin
coolant
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022549846A
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English (en)
Japanese (ja)
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JP2023514839A5 (https=
Inventor
ワン・フェン
マチュシュキン・アレクサンダー
アーリック・ダレル
サミュロン・エリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2023514839A publication Critical patent/JP2023514839A/ja
Publication of JP2023514839A5 publication Critical patent/JP2023514839A5/ja
Priority to JP2025279710A priority Critical patent/JP2026053556A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022549846A 2020-02-20 2021-02-18 基板処理台座のための内部フィンを備えた冷却剤チャネル Pending JP2023514839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025279710A JP2026053556A (ja) 2020-02-20 2025-12-24 基板処理台座のための内部フィンを備えた冷却剤チャネル

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062978899P 2020-02-20 2020-02-20
US62/978,899 2020-02-20
PCT/US2021/018445 WO2021168027A1 (en) 2020-02-20 2021-02-18 Coolant channel with internal fins for substrate processing pedestals

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025279710A Division JP2026053556A (ja) 2020-02-20 2025-12-24 基板処理台座のための内部フィンを備えた冷却剤チャネル

Publications (2)

Publication Number Publication Date
JP2023514839A true JP2023514839A (ja) 2023-04-11
JP2023514839A5 JP2023514839A5 (https=) 2024-04-01

Family

ID=77391637

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022549846A Pending JP2023514839A (ja) 2020-02-20 2021-02-18 基板処理台座のための内部フィンを備えた冷却剤チャネル
JP2025279710A Pending JP2026053556A (ja) 2020-02-20 2025-12-24 基板処理台座のための内部フィンを備えた冷却剤チャネル

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025279710A Pending JP2026053556A (ja) 2020-02-20 2025-12-24 基板処理台座のための内部フィンを備えた冷却剤チャネル

Country Status (5)

Country Link
US (2) US12381105B2 (https=)
JP (2) JP2023514839A (https=)
KR (2) KR20260009393A (https=)
CN (1) CN115136279A (https=)
WO (1) WO2021168027A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263317A1 (ja) * 2024-06-18 2025-12-26 Toto株式会社 静電チャック
JP2026000821A (ja) * 2024-06-18 2026-01-06 Toto株式会社 静電チャック
WO2026023419A1 (ja) * 2024-07-22 2026-01-29 東京エレクトロン株式会社 ステージ、および基板処理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7765621B2 (ja) * 2023-09-12 2025-11-06 日本碍子株式会社 ウエハ載置台
KR102892423B1 (ko) * 2025-04-28 2025-11-27 성균관대학교 산학협력단 냉각 유체 및 기포 배출 촉진 구조를 구비한 히트 싱크

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257943A (ja) * 2002-02-28 2003-09-12 Anelva Corp 表面処理装置
US20070165356A1 (en) * 2003-04-22 2007-07-19 Applied Materials, Inc. Substrate support having heat transfer system
JP2011165939A (ja) * 2010-02-10 2011-08-25 Denso Corp 積層型冷却器
JP2014195047A (ja) * 2013-02-28 2014-10-09 Tokyo Electron Ltd 載置台及びプラズマ処理装置
JP2016528743A (ja) * 2013-08-21 2016-09-15 クールチップ テクノロジーズ， インコーポレイテッド 一体化された熱伝達フィンを伴う運動熱シンク
JP2018006768A (ja) * 2017-09-13 2018-01-11 日本特殊陶業株式会社 静電チャック
JP2019041024A (ja) * 2017-08-25 2019-03-14 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置
JP2019075399A (ja) * 2017-10-12 2019-05-16 日本特殊陶業株式会社 保持装置および保持装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
JP4564973B2 (ja) * 2007-01-26 2010-10-20 株式会社日立ハイテクノロジーズ プラズマ処理装置
US7649729B2 (en) * 2007-10-12 2010-01-19 Applied Materials, Inc. Electrostatic chuck assembly
JP2011040528A (ja) * 2009-08-10 2011-02-24 Hitachi High-Technologies Corp プラズマ処理装置
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
KR101574740B1 (ko) 2013-08-28 2015-12-04 (주)젠 기상식각 및 세정을 위한 플라즈마 장치
US9741593B2 (en) * 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
JP6183567B1 (ja) * 2016-05-13 2017-08-23 Toto株式会社 静電チャック
US10900124B2 (en) 2018-06-12 2021-01-26 Lam Research Corporation Substrate processing chamber with showerhead having cooled faceplate
CN111211059B (zh) * 2018-11-22 2023-07-04 矽品精密工业股份有限公司 电子封装件及其制法与散热件

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257943A (ja) * 2002-02-28 2003-09-12 Anelva Corp 表面処理装置
US20070165356A1 (en) * 2003-04-22 2007-07-19 Applied Materials, Inc. Substrate support having heat transfer system
JP2011165939A (ja) * 2010-02-10 2011-08-25 Denso Corp 積層型冷却器
JP2014195047A (ja) * 2013-02-28 2014-10-09 Tokyo Electron Ltd 載置台及びプラズマ処理装置
JP2016528743A (ja) * 2013-08-21 2016-09-15 クールチップ テクノロジーズ， インコーポレイテッド 一体化された熱伝達フィンを伴う運動熱シンク
JP2019041024A (ja) * 2017-08-25 2019-03-14 東京エレクトロン株式会社 冷媒用の流路を有する部材、冷媒用の流路を有する部材の制御方法及び基板処理装置
JP2018006768A (ja) * 2017-09-13 2018-01-11 日本特殊陶業株式会社 静電チャック
JP2019075399A (ja) * 2017-10-12 2019-05-16 日本特殊陶業株式会社 保持装置および保持装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263317A1 (ja) * 2024-06-18 2025-12-26 Toto株式会社 静電チャック
JP2026000821A (ja) * 2024-06-18 2026-01-06 Toto株式会社 静電チャック
WO2026023419A1 (ja) * 2024-07-22 2026-01-29 東京エレクトロン株式会社 ステージ、および基板処理装置

Also Published As

Publication number Publication date
US20250364298A1 (en) 2025-11-27
US12381105B2 (en) 2025-08-05
KR102906600B1 (ko) 2025-12-30
KR20260009393A (ko) 2026-01-19
KR20220141878A (ko) 2022-10-20
WO2021168027A1 (en) 2021-08-26
CN115136279A (zh) 2022-09-30
JP2026053556A (ja) 2026-03-25
US20230087913A1 (en) 2023-03-23

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