JP2023506029A - ウエハー研磨装置用研磨パッド並びにその製造装置及び製造方法 - Google Patents

ウエハー研磨装置用研磨パッド並びにその製造装置及び製造方法 Download PDF

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Publication number
JP2023506029A
JP2023506029A JP2022535856A JP2022535856A JP2023506029A JP 2023506029 A JP2023506029 A JP 2023506029A JP 2022535856 A JP2022535856 A JP 2022535856A JP 2022535856 A JP2022535856 A JP 2022535856A JP 2023506029 A JP2023506029 A JP 2023506029A
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JP
Japan
Prior art keywords
pad
polyurethane
polishing
manufacturing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2022535856A
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English (en)
Japanese (ja)
Inventor
アン，ジン・ウ
チャン，ス・チョン
Original Assignee
エスケイ・シルトロン・カンパニー・リミテッド
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Application filed by エスケイ・シルトロン・カンパニー・リミテッド filed Critical エスケイ・シルトロン・カンパニー・リミテッド
Publication of JP2023506029A publication Critical patent/JP2023506029A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2022535856A 2020-02-05 2020-05-08 ウエハー研磨装置用研磨パッド並びにその製造装置及び製造方法 Pending JP2023506029A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020200013622A KR102305796B1 (ko) 2020-02-05 2020-02-05 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법
KR10-2020-0013622 2020-02-05
PCT/KR2020/006076 WO2021157781A1 (ko) 2020-02-05 2020-05-08 웨이퍼 연마 장치용 연마 패드, 그의 제조 장치 및 제조 방법

Publications (1)

Publication Number Publication Date
JP2023506029A true JP2023506029A (ja) 2023-02-14

Family

ID=77200097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022535856A Pending JP2023506029A (ja) 2020-02-05 2020-05-08 ウエハー研磨装置用研磨パッド並びにその製造装置及び製造方法

Country Status (5)

Country Link
US (1) US20230040654A1 (ko)
JP (1) JP2023506029A (ko)
KR (1) KR102305796B1 (ko)
CN (1) CN115087519A (ko)
WO (1) WO2021157781A1 (ko)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058178A (ja) * 1991-10-11 1993-01-19 Rodeele Nitta Kk 半導体ウエハー研磨用クロス
JP2007092252A (ja) * 2005-09-30 2007-04-12 Fujibo Holdings Inc 研磨布
JP2008155359A (ja) * 2006-11-30 2008-07-10 Toray Ind Inc ガラス基板鏡面加工用研磨布及びその製造方法
JP2012056032A (ja) * 2010-09-09 2012-03-22 Fujibo Holdings Inc 発泡シート材
JP2012223875A (ja) * 2011-04-22 2012-11-15 Toray Coatex Co Ltd 研磨パッド
JP2014193518A (ja) * 2013-02-26 2014-10-09 Crystal Kogaku:Kk 研磨パッドの製造方法
KR20190011035A (ko) * 2017-07-24 2019-02-01 주식회사 덕성 곡면 글라스 연마용 연마패드 및 그 제조방법
JP2019025549A (ja) * 2017-07-25 2019-02-21 ニッタ・ハース株式会社 研磨布

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
JPH10249737A (ja) * 1997-03-14 1998-09-22 Nikon Corp 磁気記録媒体用基板の研磨用パッド及び研磨方法
JP2001001270A (ja) * 1999-06-17 2001-01-09 Sumitomo Osaka Cement Co Ltd 研摩用パッド
JP5061694B2 (ja) * 2007-04-05 2012-10-31 信越半導体株式会社 研磨パッドの製造方法及び研磨パッド並びにウエーハの研磨方法
CN103402706B (zh) * 2011-02-28 2017-02-15 东丽高帝斯株式会社 研磨垫
JP2015096286A (ja) * 2013-11-15 2015-05-21 株式会社ツールバンク 研磨パッド
JP6654357B2 (ja) * 2015-04-02 2020-02-26 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法及び研磨方法
JP2017136662A (ja) * 2016-02-03 2017-08-10 株式会社クリスタル光学 研磨パッド
JP2018122427A (ja) * 2017-02-03 2018-08-09 学校法人立命館 研磨パッドの製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058178A (ja) * 1991-10-11 1993-01-19 Rodeele Nitta Kk 半導体ウエハー研磨用クロス
JP2007092252A (ja) * 2005-09-30 2007-04-12 Fujibo Holdings Inc 研磨布
JP2008155359A (ja) * 2006-11-30 2008-07-10 Toray Ind Inc ガラス基板鏡面加工用研磨布及びその製造方法
JP2012056032A (ja) * 2010-09-09 2012-03-22 Fujibo Holdings Inc 発泡シート材
JP2012223875A (ja) * 2011-04-22 2012-11-15 Toray Coatex Co Ltd 研磨パッド
JP2014193518A (ja) * 2013-02-26 2014-10-09 Crystal Kogaku:Kk 研磨パッドの製造方法
KR20190011035A (ko) * 2017-07-24 2019-02-01 주식회사 덕성 곡면 글라스 연마용 연마패드 및 그 제조방법
JP2019025549A (ja) * 2017-07-25 2019-02-21 ニッタ・ハース株式会社 研磨布

Also Published As

Publication number Publication date
KR102305796B9 (ko) 2022-01-17
US20230040654A1 (en) 2023-02-09
KR20210099808A (ko) 2021-08-13
CN115087519A (zh) 2022-09-20
WO2021157781A1 (ko) 2021-08-12
KR102305796B1 (ko) 2021-09-28

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