JP2023170415A5 - - Google Patents

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Publication number
JP2023170415A5
JP2023170415A5 JP2022082154A JP2022082154A JP2023170415A5 JP 2023170415 A5 JP2023170415 A5 JP 2023170415A5 JP 2022082154 A JP2022082154 A JP 2022082154A JP 2022082154 A JP2022082154 A JP 2022082154A JP 2023170415 A5 JP2023170415 A5 JP 2023170415A5
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JP
Japan
Prior art keywords
wiring
via plug
semiconductor device
length
electrode
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Application number
JP2022082154A
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English (en)
Japanese (ja)
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JP7724746B2 (ja
JP2023170415A (ja
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Priority to JP2022082154A priority Critical patent/JP7724746B2/ja
Priority claimed from JP2022082154A external-priority patent/JP7724746B2/ja
Priority to US18/188,089 priority patent/US20230378050A1/en
Publication of JP2023170415A publication Critical patent/JP2023170415A/ja
Publication of JP2023170415A5 publication Critical patent/JP2023170415A5/ja
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Publication of JP7724746B2 publication Critical patent/JP7724746B2/ja
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JP2022082154A 2022-05-19 2022-05-19 半導体装置及びその製造方法 Active JP7724746B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022082154A JP7724746B2 (ja) 2022-05-19 2022-05-19 半導体装置及びその製造方法
US18/188,089 US20230378050A1 (en) 2022-05-19 2023-03-22 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022082154A JP7724746B2 (ja) 2022-05-19 2022-05-19 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2023170415A JP2023170415A (ja) 2023-12-01
JP2023170415A5 true JP2023170415A5 (enExample) 2024-09-12
JP7724746B2 JP7724746B2 (ja) 2025-08-18

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ID=88790937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022082154A Active JP7724746B2 (ja) 2022-05-19 2022-05-19 半導体装置及びその製造方法

Country Status (2)

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US (1) US20230378050A1 (enExample)
JP (1) JP7724746B2 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4446525B2 (ja) 1999-10-27 2010-04-07 株式会社ルネサステクノロジ 半導体装置
JP2010135515A (ja) 2008-12-03 2010-06-17 Renesas Electronics Corp 半導体装置およびその製造方法
JP2011029249A (ja) 2009-07-22 2011-02-10 Renesas Electronics Corp 半導体装置

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