JP2023099437A5 - - Google Patents

Info

Publication number
JP2023099437A5
JP2023099437A5 JP2022161169A JP2022161169A JP2023099437A5 JP 2023099437 A5 JP2023099437 A5 JP 2023099437A5 JP 2022161169 A JP2022161169 A JP 2022161169A JP 2022161169 A JP2022161169 A JP 2022161169A JP 2023099437 A5 JP2023099437 A5 JP 2023099437A5
Authority
JP
Japan
Prior art keywords
electronic component
component according
item
multilayer electronic
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022161169A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023099437A (ja
Filing date
Publication date
Priority claimed from KR1020210193640A external-priority patent/KR20230103058A/ko
Application filed filed Critical
Publication of JP2023099437A publication Critical patent/JP2023099437A/ja
Publication of JP2023099437A5 publication Critical patent/JP2023099437A5/ja
Pending legal-status Critical Current

Links

JP2022161169A 2021-12-31 2022-10-05 積層型電子部品 Pending JP2023099437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210193640A KR20230103058A (ko) 2021-12-31 2021-12-31 적층형 전자 부품
KR10-2021-0193640 2021-12-31

Publications (2)

Publication Number Publication Date
JP2023099437A JP2023099437A (ja) 2023-07-13
JP2023099437A5 true JP2023099437A5 (enExample) 2025-10-06

Family

ID=86979322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022161169A Pending JP2023099437A (ja) 2021-12-31 2022-10-05 積層型電子部品

Country Status (4)

Country Link
US (1) US12176149B2 (enExample)
JP (1) JP2023099437A (enExample)
KR (2) KR20230103058A (enExample)
CN (1) CN116387037A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12051545B2 (en) * 2021-08-02 2024-07-30 Taiyo Yuden Co., Ltd. Ceramic electronic device including dielectric layer containing perovskite compound with yttria-stabilized zirconia, and manufacturing method of same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4093188B2 (ja) * 2003-05-27 2008-06-04 株式会社村田製作所 積層セラミック電子部品とその実装構造および実装方法
JP4683052B2 (ja) * 2008-01-28 2011-05-11 Ｔｄｋ株式会社 セラミック素子
CN102652342B (zh) * 2009-12-11 2016-08-03 株式会社村田制作所 层叠型陶瓷电容器
CN104205266B (zh) * 2012-03-30 2017-05-24 太阳诱电株式会社 层叠陶瓷电容器及其制造方法
KR101641574B1 (ko) * 2014-02-03 2016-07-22 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판
US20150364253A1 (en) * 2014-06-12 2015-12-17 Apple Inc. Heel fillet capacitor with noise reduction
KR101703195B1 (ko) 2014-11-27 2017-02-17 홍익대학교 산학협력단 나노 박막층을 구비하는 적층 세라믹 칩 부품 및 이의 제조 방법
JP6592923B2 (ja) 2015-03-20 2019-10-23 株式会社村田製作所 電子部品およびその製造方法
JP6724321B2 (ja) 2015-09-15 2020-07-15 Tdk株式会社 積層電子部品
JP6429027B2 (ja) * 2015-09-15 2018-11-28 Tdk株式会社 積層電子部品
JP7051283B2 (ja) * 2016-10-17 2022-04-11 太陽誘電株式会社 積層セラミックコンデンサ
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
JP6806035B2 (ja) * 2017-10-31 2021-01-06 株式会社村田製作所 積層セラミックコンデンサ
KR102620541B1 (ko) * 2018-08-22 2024-01-03 삼성전기주식회사 커패시터 부품
KR102068805B1 (ko) * 2018-09-06 2020-01-22 삼성전기주식회사 세라믹 전자 부품
JP7247740B2 (ja) * 2019-05-15 2023-03-29 株式会社村田製作所 電子部品の実装構造体及びその製造方法

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