JP2023099424A5 - - Google Patents

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Publication number
JP2023099424A5
JP2023099424A5 JP2022122919A JP2022122919A JP2023099424A5 JP 2023099424 A5 JP2023099424 A5 JP 2023099424A5 JP 2022122919 A JP2022122919 A JP 2022122919A JP 2022122919 A JP2022122919 A JP 2022122919A JP 2023099424 A5 JP2023099424 A5 JP 2023099424A5
Authority
JP
Japan
Prior art keywords
electronic component
item
component according
multilayer electronic
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022122919A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023099424A (ja
Filing date
Publication date
Priority claimed from KR1020210194497A external-priority patent/KR20230103546A/ko
Application filed filed Critical
Publication of JP2023099424A publication Critical patent/JP2023099424A/ja
Publication of JP2023099424A5 publication Critical patent/JP2023099424A5/ja
Pending legal-status Critical Current

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JP2022122919A 2021-12-31 2022-08-01 積層型電子部品 Pending JP2023099424A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0194497 2021-12-31
KR1020210194497A KR20230103546A (ko) 2021-12-31 2021-12-31 적층형 전자 부품

Publications (2)

Publication Number Publication Date
JP2023099424A JP2023099424A (ja) 2023-07-13
JP2023099424A5 true JP2023099424A5 (enExample) 2025-07-14

Family

ID=86992159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022122919A Pending JP2023099424A (ja) 2021-12-31 2022-08-01 積層型電子部品

Country Status (4)

Country Link
US (1) US20230215652A1 (enExample)
JP (1) JP2023099424A (enExample)
KR (2) KR20230103546A (enExample)
CN (1) CN116417249A (enExample)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5920304B2 (ja) * 2013-09-25 2016-05-18 株式会社村田製作所 電子部品およびその製造方法
KR101641574B1 (ko) * 2014-02-03 2016-07-22 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판
JP6405329B2 (ja) * 2016-02-26 2018-10-17 太陽誘電株式会社 積層セラミックコンデンサ
JP6512139B2 (ja) * 2016-03-04 2019-05-15 株式会社村田製作所 電子部品の実装構造及びその電子部品の製造方法
JP7017893B2 (ja) * 2017-09-25 2022-02-09 太陽誘電株式会社 積層セラミックコンデンサ
US10770232B2 (en) * 2017-09-29 2020-09-08 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component and method of manufacturing the same
KR102620541B1 (ko) * 2018-08-22 2024-01-03 삼성전기주식회사 커패시터 부품
JP2022142212A (ja) * 2021-03-16 2022-09-30 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法

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