JP2023098704A5 - - Google Patents

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Publication number
JP2023098704A5
JP2023098704A5 JP2022210624A JP2022210624A JP2023098704A5 JP 2023098704 A5 JP2023098704 A5 JP 2023098704A5 JP 2022210624 A JP2022210624 A JP 2022210624A JP 2022210624 A JP2022210624 A JP 2022210624A JP 2023098704 A5 JP2023098704 A5 JP 2023098704A5
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Japan
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component
composition according
polishing composition
group
metal ion
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JP2022210624A
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Japanese (ja)
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JP2023098704A (ja
JP7685983B2 (ja
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Publication of JP2023098704A5 publication Critical patent/JP2023098704A5/ja
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JP2022210624A 2021-12-28 2022-12-27 酸化珪素膜用研磨液組成物 Active JP7685983B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021214529 2021-12-28
JP2021214529 2021-12-28

Publications (3)

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JP2023098704A JP2023098704A (ja) 2023-07-10
JP2023098704A5 true JP2023098704A5 (enExample) 2024-04-23
JP7685983B2 JP7685983B2 (ja) 2025-05-30

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JP2022210624A Active JP7685983B2 (ja) 2021-12-28 2022-12-27 酸化珪素膜用研磨液組成物

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JP (1) JP7685983B2 (enExample)
TW (1) TW202342662A (enExample)
WO (1) WO2023127898A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025023040A1 (ja) * 2023-07-21 2025-01-30 Ａｇｃ株式会社 研磨剤及びその製造方法、研磨剤用添加液の製造方法、研磨方法、並びに、半導体部品の製造方法
CN119998926A (zh) * 2023-09-13 2025-05-13 株式会社力森诺科 Cmp用研磨液、cmp用研磨液套组及研磨方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4462593B2 (ja) * 2001-07-26 2010-05-12 花王株式会社 研磨液組成物
JP7326048B2 (ja) * 2018-09-28 2023-08-15 花王株式会社 酸化珪素膜用研磨液組成物
JP7024690B2 (ja) * 2018-11-12 2022-02-24 トヨタ自動車株式会社 制御ユニット
JP7209583B2 (ja) * 2019-05-08 2023-01-20 花王株式会社 酸化珪素膜用研磨液組成物
JP7041714B2 (ja) * 2019-06-26 2022-03-24 花王株式会社 酸化珪素膜用研磨液組成物
JP7425660B2 (ja) * 2020-04-07 2024-01-31 花王株式会社 酸化珪素膜用研磨液組成物

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